Photopatternable Laminate BCB Dielectric

2014 ◽  
Vol 2014 (1) ◽  
pp. 000580-000584 ◽  
Author(s):  
Corey O'Connor ◽  
Robert Barr ◽  
Jeff Calvert ◽  
Anupam Choubey ◽  
Mike Gallagher ◽  
...  
Keyword(s):  
Fracture Toughness ◽  
Electrical Properties ◽  
Dielectric Material ◽  
Polymer System ◽  
Spray Coating ◽  
High Volume ◽  
Large Area ◽  
Low Dielectric ◽  
Aspect Ratios ◽  
Laminate Film

Divinylsiloxane-bis-benzocyclobutene (DVS-bis-BCB, or BCB) is a well-known dielectric material that has been used in high volume manufacturing for many years (Dow's CYCLOTENE™ 3000/4000-series Advanced Electronic Resins). Typically, the application of these products has been by spincoating or spray coating of the dielectric material from a solvent-based formulation. However, for certain applications - for example, those involving large area, square substrates such as glass panels - it is desirable to be able to apply the BCB-based dielectric material using a dry film coating process, such as vacuum or hot roll lamination. In this paper, we describe the concept of creating a laminate film utilizing DVS-bis-BCB as the primary dielectric material component. In creating the laminate dielectric material, it is important to maintain the unique combination of thermal and electrical properties of DVS-bis-BCB, including high thermal stability, excellent copper barrier properties, low moisture uptake, low dielectric constant, and low dielectric loss. However, DVS-bis-BCB alone is too rigid to produce a high quality laminate film, therefore, it is necessary to modify the formulation to improve flexibility and lamination quality. As the flexibility of the film is increased, higher fracture toughness (K1C) and higher elongation values should result. Novel formulation adjustments to the base DVS-bis-BCB polymer system have resulted in an experimental laminate dielectric product that will be the focus of this discussion. Depending on the application, laminate films can vary in thickness from 2μm to 50μm or even thicker. A typical laminate film construct includes the BCB-based dielectric film with a base sheet of an optically-clear polyester (PET) film and a polyethylene (PE) cover sheet. The DVS-bis-BCB-based laminate can be tuned with appropriate additives to either pattern with UV exposure from a tool such as a Süss MicroTec Mask Aligner (50mJ/cm2 – 100mJ/cm2 exposure energy) or laser pattern with a tool such as a Süss MicroTec 248nm Excimer Laser. Aspect ratios of 1:1.5 have been achieved with a photopatternable DVS-bis-BCB film and aspect ratios of >1:1 are possible with a laser-patterned film. Beside the photopackage added to the film to enable UV patterning, toughening additives have also been incorporated to enhance the fracture toughness (K1C) and elongation properties. K1C for the laminate has been improved to 0.55Mpa·m1/2 vs. 0.35Mpa·m1/2 for DVS-bis-BCB. Elongation has been improved to 13% for the laminate vs. 8% for DVS-bis-BCB. Electrical properties are similar to DVS-bis-BCB. An additional attribute of the laminate dielectric is the ability to tent over and protect vias. Vias >100μm diameter have successfully been tented with a 10μm thick film. A DVS-bis-BCB-based laminate has been demonstrated with continued optimization and evaluation to follow.

Vapor Deposition of Low-Dielectric-Constant Polymeric Thin Films

MRS Bulletin ◽  
1997 ◽  
Vol 22 (10) ◽  
pp. 28-31 ◽  
Author(s):  
T-M. Lu ◽  
J.A. Moore
Keyword(s):  
Thin Films ◽  
Dielectric Constant ◽  
Vapor Deposition ◽  
Polymeric Materials ◽  
Large Area ◽  
Polymeric Thin Films ◽  
Dry Process ◽  
Low Dielectric ◽  
Aspect Ratios ◽  
Special Cases

For devices with feature sizes below 0.18 μm, it is desirable to have materials with a dielectric constant below 2.5 as interlayer dielectrics. Polymeric materials are possible candidates. There are two main strategies to grow polymeric films. The most widely used method is the spin-on technique. The other method is by vapor deposition. Although vapor deposition is less common, it has several attractive features that look quite promising, especially when the wafer size becomes very large.There are several advantages to vapor-deposited polymers:(1) The deposition of the polymers is a dry process. It is solvent-free and does not produce waste. No remedial measures are necessary to take care of the waste. The process is attractive from both energy-conservation and environmental considerations.(2) They can provide an extremely uniform coating over a very large area. For 200-mm wafers, for example, one can achieve better than 2% uniformity for vapor-deposited parylene (a type of polymer to be described later) films. Similar uniformity can be expected for future 300-mm wafers.(3) Many vapor-deposited polymers possess superior gap-filling capability. Small vias and trenches of very high aspect ratios can be filled without voids.There are some shortcomings in vapor deposition of polymeric thin films. First of all, except for some special cases, processing issues for these materials are not well-studied. Manufacturing equipment is not well-developed.

Skin–core structured fluorinated MWCNTs: a nanofiller towards a broadband dielectric material with a high dielectric constant and low dielectric loss

2018 ◽  
Vol 6 (9) ◽  
pp. 2370-2378 ◽  
Author(s):  
Yang Liu ◽  
Cheng Zhang ◽  
Benyuan Huang ◽  
Xu Wang ◽  
Yulong Li ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
Dielectric Loss ◽  
High Dielectric Constant ◽  
Dielectric Material ◽  
Epoxy Composite ◽  
Low Dielectric ◽  
High Dielectric

A novel skin–core structured fluorinated MWCNT nanofiller was prepared to fabricate epoxy composite with broadband high dielectric constant and low dielectric loss.

scholarly journals Chlorosulfuric acid-assisted production of functional 2D materials

2021 ◽  
Vol 5 (1) ◽  
Author(s):  
Mohsen Moazzami Gudarzi ◽  
Maryana Asaad ◽  
Boyang Mao ◽  
Gergo Pinter ◽  
Jianqiang Guo ◽  
...  
Keyword(s):  
Hexagonal Boron Nitride ◽  
2D Materials ◽  
Real Life ◽  
Large Area ◽  
Polar Solvents ◽  
Aspect Ratios ◽  
Two Dimensional Materials ◽  
Liquid Phase Exfoliation

AbstractThe use of two-dimensional materials in bulk functional applications requires the ability to fabricate defect-free 2D sheets with large aspect ratios. Despite huge research efforts, current bulk exfoliation methods require a compromise between the quality of the final flakes and their lateral size, restricting the effectiveness of the product. In this work, we describe an intercalation-assisted exfoliation route, which allows the production of high-quality graphene, hexagonal boron nitride, and molybdenum disulfide 2D sheets with average aspect ratios 30 times larger than that obtained via conventional liquid-phase exfoliation. The combination of chlorosulfuric acid intercalation with in situ pyrene sulfonate functionalisation produces a suspension of thin large-area flakes, which are stable in various polar solvents. The described method is simple and requires no special laboratory conditions. We demonstrate that these suspensions can be used for fabrication of laminates and coatings with electrical properties suitable for a number of real-life applications.

scholarly journals Superhydrophobicity and Durability in Recyclable Polymers Coating

2021 ◽  
Vol 13 (15) ◽  
pp. 8244
Author(s):  
Francesca Cirisano ◽  
Michele Ferrari
Keyword(s):  
Thermal Treatment ◽  
Superhydrophobic Surface ◽  
Low Cost ◽  
Spray Coating ◽  
Large Area ◽  
Average Roughness ◽  
Water Contact ◽  
Alkaline Environments ◽  
Fine Control ◽  
Recycle And Reuse

Highly hydrophobic and superhydrophobic materials obtained from recycled polymers represent an interesting challenge to recycle and reuse advanced performance materials after their first life. In this article, we present a simple and low-cost method to fabricate a superhydrophobic surface by employing polytetrafluoroethylene (PTFE) powder in polystyrene (PS) dispersion. With respect to the literature, the superhydrophobic surface (SHS) was prepared by utilizing a spray- coating technique at room temperature, a glass substrate without any further modification or thermal treatment, and which can be applied onto a large area and on to any type of material with some degree of fine control over the wettability properties. The prepared surface showed superhydrophobic behavior with a water contact angle (CA) of 170°; furthermore, the coating was characterized with different techniques, such as a 3D confocal profilometer, to measure the average roughness of the coating, and scanning electron microscopy (SEM) to characterize the surface morphology. In addition, the durability of SH coating was investigated by a long-water impact test (raining test), thermal treatment at high temperature, an abrasion test, and in acidic and alkaline environments. The present study may suggest an easy and scalable method to produce SHS PS/PTFE films that may find implementation in various fields.

Photo-induced Large Area Growth Of Dielectrics With Excimer Lamps

2000 ◽  
Vol 617 ◽  
Author(s):  
Ian W. Boyd ◽  
Jun-Ying Zhang
Keyword(s):  
Thin Films ◽  
Dielectric Constant ◽  
Low Temperature ◽  
Leakage Current ◽  
Sol Gel ◽  
Low Dielectric Constant ◽  
Large Area ◽  
Excimer Lamp ◽  
Low Dielectric ◽  
Current Densities

AbstractIn this paper, UV-induced large area growth of high dielectric constant (Ta2O5, TiO2and PZT) and low dielectric constant (polyimide and porous silica) thin films by photo-CVD and sol-gel processing using excimer lamps, as well as the effect of low temperature LW annealing, are discussed. Ellipsometry, Fourier transform infrared spectroscopy (FTIR), X-ray photoelectron spectroscopy (XPS), UV spectrophotometry, atomic force microscope (AFM), capacitance-voltage (C-V) and current-voltage (I-V) measurements have been employed to characterize oxide films grown and indicate them to be high quality layers. Leakage current densities as low as 9.0×10−8 Acm−2 and 1.95×10−7 Acm−2 at 0.5 MV/cm have been obtained for the as-grown Ta2O5 films formed by photo-induced sol-gel processing and photo-CVD. respectively - several orders of magnitude lower than for any other as-grown films prepared by any other technique. A subsequent low temperature (400°C) UV annealing step improves these to 2.0×10−9 Acm−2 and 6.4× 10−9 Acm−2, respectively. These values are essentially identical to those only previously formed for films annealed at temperatures between 600 and 1000°C. PZT thin films have also been deposited at low temperatures by photo-assisted decomposition of a PZT metal-organic sol-gel polymer using the 172 nm excimer lamp. Very low leakage current densities (10−7 A/cm2) can be achieved, which compared with layers grown by conventional thermal processing. Photo-induced deposition of low dielectric constant organic polymers for interlayer dielectrics has highlighted a significant role of photo effects on the curing of polyamic acid films. I-V measurements showed the leakage current density of the irradiated polymer films was over an order of magnitude smaller than has been obtained in the films prepared by thermal processing. Compared with conventional furnace processing, the photo-induced curing of the polyimide provided both reduced processing time and temperature, A new technique of low temperature photo-induced sol-gel process for the growth of low dielectric constant porous silicon dioxide thin films from TEOS sol-gel solutions with a 172 nm excimer lamp has also been successfully demonstrated. The dielectric constant values as low as 1.7 can be achieved at room temperature. The applications investigated so far clearly demonstrate that low cost high power excimer lamp systems can provide an interesting alternative to conventional UV lamps and excimer lasers for industrial large-scale low temperature materials processing.

A Study on Low Dielectric Material Deposition Using a Helicon Plasma Source

1996 ◽  
Vol 143 (9) ◽  
pp. 2990-2995 ◽  
Author(s):  
Jung‐Hyung Kim ◽  
Sang‐Hun Seo ◽  
Seok‐Min Yun ◽  
Hong‐Young Chang ◽  
Kwang‐Man Lee ◽  
...  
Keyword(s):  
Dielectric Material ◽  
Plasma Source ◽  
Helicon Plasma ◽  
Low Dielectric ◽  
Material Deposition

Three-Dimensional Potential and Electric Field Distributions in HV Cable Insulation Containing Multiple Cavities

2013 ◽  
Vol 845 ◽  
pp. 372-377 ◽  
Author(s):  
Nabipour Afrouzi Hadi ◽  
Zulkurnain Abdul-Malek ◽  
Saeed Vahabi Mashak ◽  
A.R. Naderipour
Keyword(s):  
Electrical Properties ◽  
Electric Field ◽  
High Voltage ◽  
Three Dimensional ◽  
The Finite Element Method ◽  
Low Dielectric ◽  
Underground Cable ◽  
Insulation Failure ◽  
Field Distributions ◽  
Hv Cable

Cross-linked polyethylene is widely used as electrical insulation because of its excellent electrical properties such as low dielectric constant, low dielectric loss and also due to its excellent chemical resistance and mechanical flexibility. Nevertheless, the most important reason for failure of high voltage equipment is due to its insulation failure. The electrical properties of an insulator are affected by the presence of cavities within the insulating material, in particular with regard to the electric field and potential distributions. In this paper, the electric field and potential distributions in high voltage cables containing single and multiple cavities are studied. Three different insulating media, namely PE, XLPE, and PVC was modeled. COMSOL software which utilises the finite element method (FEM) was used to carry out the simulation. An 11kV underground cable was modeled in 3D for better observation and analyses of the generated voltage and field distributions. The results show that the electric field is affected by the presence of cavities in the insulation. Furthermore, the field strength and uniformity are also affected by whether cavities are radially or axially aligned, as well as the type of the insulating solid. The effect of insulator type due the presence of cavities was seen most prevalent in PVC followed by PE and then XLPE.

Electrical properties of low-dielectric-constant films prepared by PECVD in O2/CH4/HMDSO

2002 ◽  
Vol 5 (2-3) ◽  
pp. 279-284 ◽  
Author(s):  
G Borvon ◽  
A Goullet ◽  
X Mellhaoui ◽  
N Charrouf ◽  
A Granier
Keyword(s):  
Dielectric Constant ◽  
Electrical Properties ◽  
Low Dielectric Constant ◽  
Low Dielectric
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