Development and Challenges of Warpage for Fan-Out Wafer-Level Package Technology

2016 ◽  
Vol 2016 (1) ◽  
pp. 000524-000528
Author(s):  
Mu-Hsuan Chan ◽  
Yu-Po Wang ◽  
Ivan Chang ◽  
James Chiang ◽  
George Pan ◽  
...  
Keyword(s):  
Process Optimization ◽  
High Performance ◽  
Thermal Loading ◽  
Material Selection ◽  
Measurement Data ◽  
Structure Design ◽  
Wafer Level ◽  
Element Analysis ◽  
Geometry Design ◽  
Wide Range

Abstract Fan-out wafer-level-packaging (FO-WLP) technology has been widely investigated recently with its advantages of thin form factor structure, cost effectiveness and high performance for wide range applications. Reducing wafer warpage is one of the most challenging needs to be addressed for success on subsequent processes. Therefore, the majority of studies focus on the ratio of die and compound thickness, structure design. In order to optimize the warpage for success on subsequent processes, it is indispensable to consider whole wafer process including thermal loading and stress. In this study, reducdution of wafer warpage at each process was proposed in terms of material selection, and process optimization through finite element analysis (FEA) and experiment. Wafer process dependent modeling results were validated by experimental measurement data. The mutual relationship and effects of material property, compound thickness, and corresponding thermal influences were both investigated and addressed. Key parameters were identified based on FEA modeling results: thickness ratio of die/compound andmolding compound materials. Therefore, the geometry design with balanced die/compound ratio is optimal for warpage improvement. The effect of process will be discussed and should be considered for future package warpage characterization. Such findings have been successfully used in process optimization to reduce wafer warapge after grinding process.

Polymers for high performance Li-S batteries: Material selection and structure design

2019 ◽  
Vol 89 ◽  
pp. 19-60 ◽  
Author(s):  
Sheng Huang ◽  
Ruiteng Guan ◽  
Shuanjin Wang ◽  
Min Xiao ◽  
Dongmei Han ◽  
...  
Keyword(s):  
High Performance ◽  
Material Selection ◽  
Structure Design

Application of SU-8 photoresist as a multi-functional structural dielectric layer in FOWLP

2017 ◽  
Vol 2017 (DPC) ◽  
pp. 1-19
Author(s):  
Raquel Pinto ◽  
André Cardoso ◽  
Sara Ribeiro ◽  
Carlos Brandão ◽  
João Gaspar ◽  
...  
Keyword(s):  
Structural Material ◽  
High Performance ◽  
Microelectromechanical Systems ◽  
Low Cost ◽  
Process Conditions ◽  
Processing Temperature ◽  
Wafer Level ◽  
Fast Growing ◽  
Wide Range ◽  
Different Types

Microelectromechanical Systems (MEMS) are a fast growing technology for sensor and actuator miniaturization finding more and more commercial opportunities by having an important role in the field of Internet of Things (IoT). On the same note, Fan-out Wafer Level Packaging (FOWLP), namely WLFO technology of NANIUM, which is based on Infineon/ Intel eWLB technology, is also finding further applications, not only due to its high performance, low cost, high flexibility, but also due to its versatility to allow the integration of different types of components in the same small form-factor package. Despite its great potential it is still off limits to the more sensitive components as micro-mechanical devices and some type of sensors, which are vulnerable to temperature and pressure. In the interest of increasing FOWLP versatility and enabling the integration of MEMS, new methods of assembling and processing are continuously searched for. Dielectrics currently used for redistribution layer construction need to be cured at temperatures above 200°C, making it one of the major boundary for low temperature processing. In addition, in order to accomplish a wide range of dielectric thicknesses in the same package it is often necessary to stack very different types of dielectrics with impact on bill of materials complexity and cost. In this work, done in cooperation with the International Iberian Nanotechnology Laboratory (INL), we describe the implementation of commercially available SU-8 photoresist as a structural material in FOWLP, allowing lower processing temperature and reduced internal package stress, thus enabling the integration of components such as MEMS/MOEMS, magneto-resistive devices and micro-batteries. While SU-8 photoresist was first designed for the microelectronics industry, it is currently highly used in the fabrication of microfluidics as well as microelectromechanical systems (MEMS) and BIO-MEMS due to its high biocompatibility and wide range of available thicknesses in the same product family. Its good thermal and chemical resistance and also mechanical and rheological properties, make it suitable to be used as a structural material, and moreover it cures at 150°C, which is key for the applications targeted. Unprecedentedly, SU-8 photoresist is tested in this work as a structural dielectric for the redistribution layers on 300mm fan-out wafers. Main concerns during the evaluation of the new WLFO dielectric focused on processability quality; adhesion to multi-material substrate and metals (copper, aluminium, gold, ¦); between layers of very different thicknesses; and overall reliability. During preliminary runs, processability on 300 mm fan-out wafers was evaluated by testing different coating and soft bake conditions, exposure settings, post-exposure parameters, up to developing setup. The outputs are not only on process conditions and results but also on WLFO design rules. For the first time, a set of conditions has been defined that allows processing SU-8 on WLFO, with thickness values ranging from 1 um to 150 um. The introduction of SU-8 in WLFO is a breakthrough in this fast-growing advanced packaging technology platform as it opens vast opportunities for sensor integration in WLP technology.

Maximizing MFL ILI Sizing Confidence and Accuracy Using High-Resolution Field Measurement Data

2012 ◽  
Author(s):  
Patrick Yeung ◽  
Ryan Sporns ◽  
Stuart Clouston ◽  
Grant A. Coleman ◽  
Scott Miller ◽  
...  
Keyword(s):  
High Resolution ◽  
Field Measurement ◽  
High Performance ◽  
Field Data ◽  
Oil And Gas ◽  
Measurement Techniques ◽  
Measurement Data ◽  
Industry Standards ◽  
Defect Profile ◽  
Wide Range

Magnetic Flux Leakage inspection tools are generally calibrated on a series of manufactured defects. This has been shown to give good results on a wide range of defects in varying wall thicknesses, velocities and pipeline conditions. Significant improvements in sizing performance can be achieved if sizing algorithms can be optimized on high resolution field data with low uncertainty that more closely reflects the actual line specific corrosion dimensions and profiles. The effects of defect profile can be significant to the MFL signal response. In order to achieve this goal, very high resolution and accurate field measurement techniques are needed to map the combined profile of a significant number of corrosion defects. This paper discusses a process for developing high performance sizing algorithms that consistently better industry standards for MFL sizing performance in areas of high density or complex corrosion in both oil and gas pipelines through the incorporation of high resolution laser scan technology. Complex corrosion may be considered as an area wherein individual corrosions interact together such that they no longer behave as a single corrosion and the MFL response experiences a superposition of leakage signals. A review of the methodology will be discussed and the results demonstrated through case studies from both Enbridge Pipelines Inc. and TransCanada Pipelines Ltd. where high-resolution field data was used as the basis for sizing model optimization.

CMP Compatibility of Partially Cured Benzocyclobutene (BCB) for a Via-First 3D IC Process

2005 ◽  
Vol 867 ◽  
Author(s):  
J. J. McMahon ◽  
F. Niklaus ◽  
R. J. Kumar ◽  
J. Yu ◽  
J.Q. Lu ◽  
...  
Keyword(s):  
High Performance ◽  
Removal Rate ◽  
Three Dimensional ◽  
Surface Damage ◽  
Wafer Level ◽  
Razor Blade ◽  
3D Ic ◽  
3D Technology ◽  
Process Step ◽  
Wide Range

AbstractWafer-level three dimensional (3D) IC technology offers the promise of decreasing RC delays by reducing long interconnect lines in high performance ICs. This paper focuses on a viafirst 3D IC platform, which utilizes a back-end-of-line (BEOL) compatible damascene-patterned layer of copper and Benzocyclobutene (BCB). This damascene-patterned copper/BCB serves as a redistribution layer between two fully fabricated wafer sets of ICs and offers the potential of high bonding strength and low contact resistance for inter-wafer interconnects between the wafer pair. The process would thus combine the electrical advantages of 3D technology using Cu-to-Cu bonding with the mechanical advantages of 3D technology using BCB-to-BCB bonding.In this work, partially cured BCB has been evaluated for copper damascene patterning using commercially available CMP slurries as a key process step for a via-first 3D process flow. BCB is spin-cast on 200 mm wafers and cured at temperatures ranging from 190°C to 250°C, providing a wide range of crosslink percentage. These films are evaluated for CMP removal rate, surface damage (surface scratching and embedded abrasives), and planarity with commercially available copper CMP slurries. Under baseline process parameters, erosion, and roughness changes are presented for single-level damascene test patterns. After wafers are bonded under controlled temperature and pressure, the bonding interface is inspected optically using glass-to-silicon bonded wafers, and the bond strength is evaluated by a razor blade test.

Optimal Structure Design and Analysis of Pressure Hull for the Underwater Glider

2013 ◽  
Vol 850-851 ◽  
pp. 317-321
Author(s):  
Da Lei Song ◽  
Li Ping Chen ◽  
Yong Fang Wang ◽  
Zhen Yu Wang
Keyword(s):  
Material Selection ◽  
Load Capacity ◽  
Structure Design ◽  
Design Solution ◽  
Main Body ◽  
Analysis Tool ◽  
Underwater Glider ◽  
Element Analysis ◽  
Autonomous Underwater Glider ◽  
Test Verification

Pressure hull is an important part of an underwater glider, on which the study was designed to ensure that it has sufficient strength and stability, the smallest weight, as well as the maximum internal deployment of space and load capacity. In order to find the best initial design solution of the pressure hull, this paper analyzes the design process of underwater vehicle systematically. After the shape and material selection of the main body and end cover, structural analysis and size optimization of pressure shell for autonomous underwater glider carried out by the finite element analysis tool Ansys Workbench, and the simulation results paves the way for the pressure test verification.

Thermal Modeling of Plastic Ic Packages

1991 ◽  
Vol 226 ◽  
Author(s):  
A. Bar-Cohen ◽  
Devin E. Mix
Keyword(s):  
Integrated Circuit ◽  
High Performance ◽  
Failure Modes ◽  
Material Selection ◽  
Thermal Modeling ◽  
Temperature Fields ◽  
Analytical Models ◽  
Element Analysis ◽  
Component Reliability ◽  
Thermal Expansion Coefficients

AbstractThe successful design of plastic integrated circuit packages for high performance VLSI chips is a crucial element in the development of costeffective packaging technology. Unfortunately, however, most common plastic encapsulating and die-bonding materials provide relatively low thermal conductivities and large thermal expansion coefficients, as well as low mechanical strengths and a limited operating temperature range. These material properties combine to produce a large number of thermally induced package failure modes. Thus, insightful material selection and detailed design, based on extensive thermal modeling/analysis, must be performed to achieve acceptable levels of component reliability.This paper begins with a discussion of the temporal development of the temperature fields inside a plastic IC package and continues with the presentation of transient and steady-state, first-order analytical models for: the chip temperature, the temperature and gradient across the die bond, and the half-thickness encapsulant temperature. The values obtained for a typical PDIP package are discussed and compared to the results of a finite-element analysis of this package. The insights obtained from these analyses are used to develop material Figures-of-Merit that can be used in the selection of die-bond and encapsulant materials for plastic IC packages.

scholarly journals Electro-textile wearable antennas in wireless body area networks: materials, antenna design, manufacturing techniques, and human body consideration—a review

2020 ◽  
pp. 004051752093223 ◽  
Author(s):  
Bahaa Almohammed ◽  
Alyani Ismail ◽  
Aduwati Sali
Keyword(s):  
Human Body ◽  
High Performance ◽  
Material Selection ◽  
Wireless Body Area Network ◽  
Area Network ◽  
Body Area ◽  
Wearable Antennas ◽  
Wide Range ◽  
Manufacturing Techniques ◽  
The Internet Of Things

The latest progress in the emerging wireless technology has resulted in the development of wearable antennas made of various fabrics. This unique antenna is an integral part of the wireless body area network (WBAN). A wide range of applications are made by the wearable antennas in the fields of the Internet of Things, sport, defense, public safety, telemedicine, navigation, and tracking. The focus point of the current review is the recent progress of electro-textiles research with special attention on the materials properties, criteria, and manufacturing techniques. Existing as well as upcoming materials specifically and potentially used for electro-textile fabrication are discussed. Various manufacturing techniques are discussed to match the importance of material selection. The current work highlights the performance when the antennas tagging are applied in WBAN objects and illustrates how the human body affects the performance of the wearable antenna and vice versa. The findings of this review by introducing the best materials, techniques, and designs could be used in future to provide high-performance materials for body-centric applications.

An application of finite element method in material selection for dental implant crowns

2021 ◽  
Vol 0 (0) ◽  
Author(s):  
Abdullah T. Şensoy ◽  
Murat Çolak ◽  
Irfan Kaymaz ◽  
Fehim Findik
Keyword(s):  
Finite Element ◽  
Material Selection ◽  
Selection Process ◽  
Primary Stability ◽  
Patient Specific ◽  
Selection Strategy ◽  
Virtual Surgery ◽  
Element Analysis ◽  
Dental Crowns ◽  
Wide Range

Abstract Materials used for dental crowns show a wide range of variety, and a dentist’s choice can depend on several factors such as patient desires, esthetics, tooth factors, etc. One of the most important issues for implant surgery is the primary stability and it should be provided to minimize the risks of screw loosening, failed osseointegration, or nonunion. The current study aims to present the Finite Element Analysis (FEA)-based material selection strategy for a dental crown in terms of reducing the aforementioned risks of dental implants. A virtual surgery mandible model obtained using MIMICS software was transferred to the ANSYS and material candidates determined using CES software were compared using FEA. The results indicated that Zr02+Y2O3 (zirconia) has shown a 12.79% worse performance compared to Au83-88/Pt4-12/Pd4.5-6 alloy in terms of abutment loosening. On the other hand, zirconia is the most promising material for dental crowns in terms of the stability of the bone-implant complex. Therefore, it may show the best overall performance for clinical use. Moreover, as suggested in this study, a better outcome and more accurate predictions can be achieved using a patient-specific FEA approach for the material selection process.

Quantification of Underfill Influence to Chip Packaging Interactions of WLCSP

2018 ◽  
Author(s):  
Huayan Wang ◽  
Shuai Shao ◽  
Vanlai Pham ◽  
Panju Shang ◽  
Cheng Zhong ◽  
...  
Keyword(s):  
Thermal Cycling ◽  
Thermal Loading ◽  
Strain Difference ◽  
Consumer Electronics ◽  
Image Correlation ◽  
Normal Strain ◽  
Wafer Level ◽  
Element Analysis ◽  
Corner Crack ◽  
Underfill Material

Wafer Level Chip Scale Package (WLCSP) has been a favorable packaging solution for compact portable consumer electronics. The microelectronics industry introduced Extra Low K (ELK) to enhance electric performances with the cost of diminishing mechanical reliability. The ELK itself and its interfaces are highly fragile and susceptible to fracture. ELK cracking under bumps and ELK inter layer delamination (ILD) from die corners are often observed during and after solder reflow and qualification process such as accelerated thermal cycling (ATC). In this study, the underfill selection and its fillet formation influence to the Chip Packaging Interactions (CPI) of WLCSP was investigated through an experimental technique and numerical analysis. For the experimental assessment, thermo-mechanical interactions between die corner and underfill was investigated. Digital image correlation (DIC) technique with optical microscope was utilized to quantify the deformation behavior and strains of cross-sectioned WLCSP die corner subjected to thermal loading from 25°C to 125°C. The results clearly show captured deformations of die corner area under thermal loading. For the fillet formation influence, it shows that the high underfill fillet configuration gives higher normal strain at the die corner area during thermal cycling. For the underfill selection, it clearly shows that the strain difference at corner solder during thermal cycling caused by two different type of underfill material. Finally, finite element analysis (FEA) was conducted by simulating the thermal loading applied in the experiments and validated with experimental results. Then, using the FEA analysis, parametric study for underfill material properties and fillet height were performed on the ELK reliability of WLCSP. Energy release rate of the die corner crack were obtained and used as damage indicators for die corner ELK delamination.

scholarly journals Design and analysis of a new type and normally open hydraulic chuck

2020 ◽  
Vol 4 (1) ◽  
Author(s):  
Yanfu Li
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
High Performance ◽  
Structure Design ◽  
Clamping Force ◽  
Element Analysis ◽  
Drilling Rig ◽  
New Type ◽  
Working Principle ◽  
Overall Performance

To solve the problem that large torque drilling rig requires high performance of the chuck, this paper introduces the composition and working principle of a normally open hydraulic chuck, as well as the design and calculation method of its bearing capacity and clamping force. Through the use of creo2.0/simulate finite element analysis module, finite element analysis is made on the main structure parts of the chuck. The results show that the parameter selection and structure design of the chuck mechanism meet the requirements of use, which provides a guarantee for improving the reliability of the chuck mechanism and the overall performance of the drilling rig.

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