Modular Microsystems with Embedded Components

2013 ◽  
Vol 2013 (1) ◽  
pp. 000735-000739
Author(s):  
Christian Boehme ◽  
Andreas Ostmann ◽  
Martin Schneider-Ramelow
Keyword(s):  
Data Transmission ◽  
State Of The Art ◽  
Video Stream ◽  
Circuit Board ◽  
Passive Components ◽  
Processing Technologies ◽  
Usb Interface ◽  
I2c Bus ◽  
The Individual ◽  
Structure Environment

Each system is designed to fulfill the desired purpose. It is defined by its inputs, outputs, structure, environment, boundary, and the including elements (subsystems). Due to the ongoing miniaturization and integration the complexity of subsystems increases continuously. This paper is intended to demonstrate the build-up of modular Microsystems. By using the embedding technology, each subsystem (module) is interchangeable and stackable. Therefore, the functionality of the entire system depends solely on the selected modules. Moreover, the enhancement, expansion or redesign can be accomplished by replacing existing or adding new modules. The communication between the individual modules is based on the standardized I2C bus. Additionally, a USB interface has been implemented to manage the data transmission between the embedded camera module and a computer. The whole system recognizes each module and performs accordingly. The user can access sensor values, watch the video stream, and change the parameters of each module via a Graphical User Interface (GUI) on his computer. To achieve the build-up of the modular Microsystems we only used packaged active and passive components. Depending on the complexity of each module a core of up to eight layers is build up. The components are then soldered onto both sides of the core. At this point the components are embedded using a laminating press. The afterwards even surface is then structured again, to enable the stacking of the modules. Each step of the entire assembly process is done via state of the art circuit board processing technologies, including laser drill and laser-direct imaging.

Magnetic Emission Mapping for Passive Integrated Components Characterisation

2003 ◽  
Author(s):  
O. Crépel ◽  
Y. Bouttement ◽  
P. Descamps ◽  
C. Goupil ◽  
P. Perdu ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Mobile Phone ◽  
Printed Circuit Board ◽  
Magnetic Sensors ◽  
Circuit Board ◽  
Magnetic Disturbance ◽  
Passive Components ◽  
Printed Circuit ◽  
Integrated Inductor ◽  
The Magnetic Field

Abstract We developed a system and a method to characterize the magnetic field induced by circuit board and electronic component, especially integrated inductor, with magnetic sensors. The different magnetic sensors are presented and several applications using this method are discussed. Particularly, in several semiconductor applications (e.g. Mobile phone), active dies are integrated with passive components. To minimize magnetic disturbance, arbitrary margin distances are used. We present a system to characterize precisely the magnetic emission to insure that the margin is sufficient and to reduce the size of the printed circuit board.

Microhardness Testing on Via Fill Material for Via In Pad Technology

2003 ◽  
Author(s):  
Norman J. Armendariz ◽  
Carolyn McCormick
Keyword(s):  
Printed Circuit Board ◽  
Failure Modes ◽  
Strong Dependence ◽  
Circuit Board ◽  
Electrical Performance ◽  
Gravimetric Analysis ◽  
Passive Components ◽  
Root Cause ◽  
Fill Material ◽  
Signal Routing

Abstract Via in pad PCB (Printed Circuit board) technology for passive components such as chip capacitors and resistors, provides the potential for improved signal routing density and reduced PCB area. Because of these improvements there is the potential for PCB cost reduction as well as gains in electrical performance through reduced impedance and inductance. However, not long after the implementation, double digit unit failures for solder joint electrical opens due to capacitor “tombstoning” began to occur. Failure modes included via fill material (solder mask) protrusion from the via as well as “out gassing” and related “tombstoning.” This failure analysis involved investigating a strong dependence on PCB supplier and, less obviously, manufacturing site. Other factors evaluated included via fill material, drill size, via fill thermal history and via fill amount or fill percent. The factor most implicated was incomplete cure of the via fill material. Previous thermal gravimetric analysis methods to determine level of polymerization or cure did not provide an ability to measure and demonstrate via fill cure level in small selected areas or its link to the failures. As a result, there was a metrology approach developed to establish this link and root-cause the failures in the field, which was based on microhardness techniques and noncontact via fill measuring metrologies.

scholarly journals A compact low-noise frontend for interleaved Rx/Tx arrays at K-/Ka-Band

2021 ◽  
pp. 1-7
Author(s):  
Anton Sieganschin ◽  
Thomas Jaschke ◽  
Arne F. Jacob
Keyword(s):  
Insertion Loss ◽  
Printed Circuit Board ◽  
Noise Figure ◽  
Low Noise ◽  
Single Band ◽  
Circuit Board ◽  
Dual Band ◽  
Ka Band ◽  
Compression Properties ◽  
The Individual

Abstract This contribution deals with a frontend for interleaved receive (Rx)-/transmit (Tx)-integrated phased arrays at K-/Ka-band. The circuit is realized in printed circuit board technology and feeds dual-band Rx/Tx- and single-band Tx-antenna elements. The dual-band element feed is composed of a substrate-integrated waveguide (SIW) diplexer with low insertion loss, a low-noise amplifier (LNA), a bandpass filter, and several passive transitions. The compression properties of the LNA are identified through two-tone measurements. The results dictate the maximum allowable output power of the power amplifier. The single band feed consists of a SIW with several transitions. Simulation and measurement results of the individual components are presented. The frontend is assembled and measured. It exhibits an Rx noise figure of 2 dB, a Tx insertion loss of ~ 2.9 dB, and an Rx/Tx-isolation of 70 dB. The setup represents the unit cell of a full array and thus complies with the required half-wave spacing at both Rx and Tx.

scholarly journals Inflammation, epigenetics, and metabolism converge to cell senescence and ageing: the regulation and intervention

2021 ◽  
Vol 6 (1) ◽  
Author(s):  
Xudong Zhu ◽  
Zhiyang Chen ◽  
Weiyan Shen ◽  
Gang Huang ◽  
John M. Sedivy ◽  
...  
Keyword(s):  
Cell Fate ◽  
Cellular Response ◽  
State Of The Art ◽  
Cell Senescence ◽  
Therapeutic Interventions ◽  
Cell Fate Decision ◽  
The Past ◽  
Fate Decision ◽  
The Individual ◽  
Remarkable Progress

AbstractRemarkable progress in ageing research has been achieved over the past decades. General perceptions and experimental evidence pinpoint that the decline of physical function often initiates by cell senescence and organ ageing. Epigenetic dynamics and immunometabolic reprogramming link to the alterations of cellular response to intrinsic and extrinsic stimuli, representing current hotspots as they not only (re-)shape the individual cell identity, but also involve in cell fate decision. This review focuses on the present findings and emerging concepts in epigenetic, inflammatory, and metabolic regulations and the consequences of the ageing process. Potential therapeutic interventions targeting cell senescence and regulatory mechanisms, using state-of-the-art techniques are also discussed.

Predicting Psycho-educational Problems in Childhood

1978 ◽  
Vol 3 (3) ◽  
pp. 148-159 ◽  
Author(s):  
Howard S. Adelman
Keyword(s):  
State Of The Art ◽  
Cost Benefit ◽  
Policy Makers ◽  
Health Maintenance ◽  
Ethical Concerns ◽  
Current State ◽  
The Individual ◽  
Assessment Procedures ◽  
Mass Identification ◽  
Ethical Perspectives

Presented are (1) a brief synthesis of several key conceptual and methodological concerns and some ethical perspectives related to identification of psycho-educational problems and (2) conclusions regarding the current state of the art. The conceptual discussion focuses on differentiating prediction from identification and screening from diagnosis; three models used in developing assessment procedures also are presented. Methodologically, the minimal requirements for satisfactory research are described and current problems are highlighted. Three ethical perspectives are discussed; cost-benefit for the individual, models-motives-goals underlying practices, and cost-benefit for the culture. The current state of the art is seen as not supporting the efficacy of the widespread use of currently available procedures for mass screening. Given this point and the methodological and ethical concerns discussed, it is suggested that policy makers reallocate limited resources away from mass identification and toward health maintenance and other approaches to prevention and early-age intervention.

High-voltage synthetic inductor for vibration damping in resonant piezoelectric shunt

2020 ◽  
pp. 107754632095261
Author(s):  
Kevin Dekemele ◽  
Patrick Van Torre ◽  
Mia Loccufier
Keyword(s):  
Piezoelectric Material ◽  
High Voltage ◽  
State Of The Art ◽  
Vibration Damping ◽  
Operational Amplifiers ◽  
Frequency Range ◽  
Resonant Condition ◽  
Passive Components ◽  
Resonance Frequencies ◽  
Resonant Shunt

Resonant piezoelectric shunts are a well-established way to reduce vibrations of mechanical systems suffering from resonant condition. The vibration energy is transferred to the electrical domain through the bonded piezoelectric material where it is dissipated in the shunt. Typically, electrical and mechanical resonance frequencies are several orders apart. As such, finding a suitable high inductance component for the resonant shunt is not feasible. Therefore, these high inductance values are mimicked through synthetic impedances, consisting of operational amplifiers and passive components. A downside of these synthetic impedances is that standard operational amplifiers can only handle up to 30 V peak to peak and the state-of-the-art amplifiers up to 100 Vpp. However, as mechanical structures tend to become lighter and more flexible, the order induced voltages over the piezoelectric material electrode voltages increase above these limitations. In this research, a high-voltage synthetic inductor is proposed and built by combining the bridge amplifier configuration and the output voltage boost configuration around a single operational amplifier gyrator circuit, effectively quadrupling the range of the synthetic inductor to 400 Vpp. The impedance of the circuit over a frequency range is numerically and experimentally investigated. The synthetic inductor is then connected to a piezoelectric material bonded to a cantilever beam. Numerical and experimental investigation confirms the high-voltage operation of the implemented circuit and its suitability as a vibration damping circuit.

scholarly journals First Cost Calculation Methods for Road Freight Transport Activity

2017 ◽  
Vol 18 (2) ◽  
pp. 107-117 ◽  
Author(s):  
György Kovács
Keyword(s):  
State Of The Art ◽  
Common Type ◽  
Estimation Methods ◽  
Cost Calculation ◽  
Transport Activity ◽  
Calculation Methods ◽  
Transport Costs ◽  
Art Practices ◽  
Road Freight ◽  
The Individual

Abstract The transport activity is one of the most expensive processes in the supply chain. Forwarding and transport companies focuses on the optimization of transportation and the reduction of transport costs. The goal of this study is to develop a method which calculate the first (prime) cost of a given transport task more precisely than the state of the art practices. In practice the calculation of transport fee depends on the individual estimation methods of the transport managers, which could result losses for the company. In this study the elaborated calculation method for total first cost is detailed for three types of fulfilment of transport tasks. The most common type of achievement is, when “own vehicle is used with own driver”. A software was also developed for this case based on the elaborated method. Based on the calculations of our software, the first cost can be defined quickly and precisely to realize higher profit.

scholarly journals One for All: Neural Joint Modeling of Entities and Events

2019 ◽  
Vol 33 ◽  
pp. 6851-6858 ◽  
Author(s):  
Trung Minh Nguyen ◽  
Thien Huu Nguyen
Keyword(s):  
Deep Learning ◽  
Recent Work ◽  
State Of The Art ◽  
Contextual Information ◽  
Joint Modeling ◽  
Event Extraction ◽  
Event Trigger ◽  
The Individual ◽  
Novel Model ◽  
Argument Roles

The previous work for event extraction has mainly focused on the predictions for event triggers and argument roles, treating entity mentions as being provided by human annotators. This is unrealistic as entity mentions are usually predicted by some existing toolkits whose errors might be propagated to the event trigger and argument role recognition. Few of the recent work has addressed this problem by jointly predicting entity mentions, event triggers and arguments. However, such work is limited to using discrete engineering features to represent contextual information for the individual tasks and their interactions. In this work, we propose a novel model to jointly perform predictions for entity mentions, event triggers and arguments based on the shared hidden representations from deep learning. The experiments demonstrate the benefits of the proposed method, leading to the state-of-the-art performance for event extraction.

scholarly journals Estado del arte del rendimiento académico en la educación media

2014 ◽  
Vol 17 (17) ◽  
pp. 197-220
Author(s):  
Oscar Hernán Cerquera Losada
Keyword(s):  
Academic Achievement ◽  
Secondary Education ◽  
State Of The Art ◽  
School Achievement ◽  
The State ◽  
Main Research ◽  
The World ◽  
El Sistema ◽  
The Individual

Este documento muestra el Estado de arte de los determinantes del rendimiento académico en la educación media, teniendo en cuenta las principales investigaciones realizadas, tanto a nivel nacional como internacional, acerca de los factores que influyen en el logro escolar de los estudiantes. Con este trabajo, se busca establecer las principales variables, tanto en Colombia como en algunos lugares del mundo, que afectan el desempeño académico de los estudiantes. Este documento se organiza en dos sesiones, determinantes a nivel mundial y determinantes a nivel colombiano; cada sesión clasifica las investigaciones de acuerdo a los factores del estudiante, de la escuela y las características organizacionales y políticas. A pesar de existir muchas investigaciones sobre el tema, aún no se ha llegado a un consenso general sobre cómo determinar los factores del  rendimiento académico, pues en la realidad son muchas las características del individuo, la escuela o el sistema que se relacionan entre sí de diferente manera y pueden afectar el logro estudiantil.ABSTRACTThis document shows the state of the art of the determinants of academic achievement in secondary education, taking into account the main research conducted, both nationally and internationally, about the factors that influence school achievement of students. With this paper, we seek to establish the main variables which affect the academic achievement of students in Colombia as well as in some parts of the world. This document is organized in two sessions: world and Colombian determinants; each session classifies research according to the factors of the student, the school and organizational and political characteristics. Although there is much research on the topic so far it has not been possible to reach a consensus on how to determine the factors of academic achievement, because in reality many characteristics of the individual, of the school or of the system relate to each other differently and can affect student achievement.RESUMOEste documento mostra o Estado da arte dos determinantes do rendimento escolar no ensino medio, tendo em conta às principais pesquisas realizadas, tanto a nível nacional como internacionalmente, sobres os fatores que influenciam o desempenho escolar dos estudantes. Com este trabalho, se procura estabelecer as principais variáveis, tanto na Colômbia e em alguns lugares do mundo, afetando o desempenho acadêmico dos estudantes. Este documento está organizado em duas sessões, determinantes a nível mundial e determinantes a nível colombiano; cada sessão clasifica as pesquisas de acordó a os fatores do estudante, da escola e das características organizacionais e políticas. Embora haja muitas pesquisas sobre o tema, ainda não se chegou a um consenso geral sobre os fatores determinantes no desempenho acadêmico, porque na realidade são muitas as características do indivíduo, a escola ou o sistema que se relacionam uns com os outros de forma diferente e podem afetar o desempenho acadêmico.

Planning of Material Handling : Literature Review

2019 ◽  
Vol 13 (2) ◽  
pp. 29-44
Author(s):  
Péter Telek ◽  
Ákos Cservenák
Keyword(s):  
Literature Review ◽  
Material Handling ◽  
State Of The Art ◽  
The State ◽  
Integrated Planning ◽  
Complex Process ◽  
Individual Planning ◽  
The Individual ◽  
The University

Nowadays, there are many well proved, effective processes to solve planning tasks in the field of material handling used advanced calculations forms and software. Unfortunately, most of them are used for individual tasks, so the applicability of their results is limited. The Institute of Logistics of the University of Miskolc has been working on integrated planning of handling machines for decades, where the individual planning tasks have to be solved together in a complex process. The main aim of this paper to give an overview about the state of the art of the planning of material handling, based on a literature review of the Science Direct publication database. As a result of this research we can determine some new direction for the planning of material handling.

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