Package Reliability Monitored Drop Shock and Temperature Cycling Testing Progression and Advantages
The increase in sophistication of reliability testing over the past several years is in part driven by the increase in complexity of package architecture it is meant to evaluate. Movement from a pass/ fail centric suite of testing toward a trend of increased design for reliability and potential problem analysis driven testing criteria is evident. A facet of this is the increased emphasis on test to failure approaches for certain package related tests such as drop shock testing. Additionally, there is an increased importance for extracting more meaningful data from standard fixed duration tests such as temperature cycling. In-situ monitored reliability testing for both drop shock and temperature cycling is an effective method for evaluating package technologies from a test to failure and immediate failure feedback perspective.