The reliability of COF Joints with Tin Bumps and Non-Conductive Adhesives for Image Sensor Module Application

2010 ◽  
Vol 2010 (1) ◽  
pp. 000736-000741
Author(s):  
Chang-Bae Lee ◽  
Jin-Gu Kim ◽  
Young-Do Kweon ◽  
Kyoung-Moo Harr ◽  
Young-Ho Kim

We developed a low cost and low temperature chip-on flex(COF) bonding technology by using Sn bumps and non-conductive adhesive(NCA) for image sensor device. Two types of Sn bumps, square and hemispherical bumps, were fabricated. Sn bumps were formed sequentially by electroplating and then were reflowed to form the hemispherical bumps. Device with Sn bumps was bonded with flexible-printed circuit board(F-PCB) using NCA at 180°C after the NCA was dispensed. To evaluate the reliability of the COF joints, a thermal cycling (TC) test, high temperature storage (HTS) test, and temperature and humidity (T&H) test have been performed. The bondability and reliability of joints were evaluated by measuring the contact resistance of each bump. The electrical test showed that COF bonding was successful with no failed bumps, and the contact resistance of COF joints was very low about 10mΩ per bump. After aging treatment at 150°C slightly increased the contact resistance. But failed COF joints were not observed before and after aging treatment. The reliability of COF joints fabricated using hemispherical bumps was good more than that of joint with square Sn bump. NCA trapping in the interface between bump and pad had an influence on the reliability of COF joints. The results of our experiments were successfully performed in application for the temperature sensitive devices such as image sensor module.

2021 ◽  
Author(s):  
Devanshu Kakkar

This thesis presents the design and development of quasi-static 2-dimensional Flexible Printed Circuit Board (FPCB) based micromirror for portable laser marking/ engraving system. It focuses on the modelling and prototyping of the novel 2-dimensional electromagnetic actuated micromirror which can be used in place of two 1-dimensional micromirrors having the benefits of lower footprint in size of the scanner and efficient alignment with the incident laser beam. This 2-dimensional micromirror can be used in portable low power laser marking/ engraving system ideally designed for consumer applications like printing name cards, engraving jewellery etc. The problem of drifting/ creep associated with quasi-static mode of FPCB based micromirror actuators is analyzed and Zero method is proposed to minimize the drifting issue which is proven experimentally in the thesis. From this thesis work, it is evident that the developed 2-dimensional, low-cost, quasi-static FPCB based micromirror would be a suitable candidate for replacement of the expensive conventional MEMS bonded mirrors in the market.


2021 ◽  
Author(s):  
Devanshu Kakkar

This thesis presents the design and development of quasi-static 2-dimensional Flexible Printed Circuit Board (FPCB) based micromirror for portable laser marking/ engraving system. It focuses on the modelling and prototyping of the novel 2-dimensional electromagnetic actuated micromirror which can be used in place of two 1-dimensional micromirrors having the benefits of lower footprint in size of the scanner and efficient alignment with the incident laser beam. This 2-dimensional micromirror can be used in portable low power laser marking/ engraving system ideally designed for consumer applications like printing name cards, engraving jewellery etc. The problem of drifting/ creep associated with quasi-static mode of FPCB based micromirror actuators is analyzed and Zero method is proposed to minimize the drifting issue which is proven experimentally in the thesis. From this thesis work, it is evident that the developed 2-dimensional, low-cost, quasi-static FPCB based micromirror would be a suitable candidate for replacement of the expensive conventional MEMS bonded mirrors in the market.


2019 ◽  
Vol 8 (3) ◽  
pp. 163-176
Author(s):  
JeongHwan Kim ◽  
Steven Aurecianus ◽  
Seonglok Nam ◽  
Jungkeun Park ◽  
Taesam Kang

Purpose The purpose of this paper is to introduce a low-cost quadrotor that can be used for educational purposes and investigate the applicability of a low-cost MEMS laser sensor for accurate altitude control. Design/methodology/approach A single printed circuit board is designed to form the structure of the quadrotor. A low-cost MEMS motion sensor, a microcontroller and four small motors are mounted on the board. A separate laser sensor module measures the altitude. A remote controller is designed to control the quadrotor’s motion. The remote controller communicates with the quadrotor via wireless connection. Roll and pitch attitude stabilization is achieved using the proportional and derivative control algorithm. The applicability of an MEMS laser sensor for altitude control is also studied. Findings The low-cost quadrotor works well even though its body structure is made using a printed circuit board. Low pass and Kalman filters work well for attitude estimation and control application. The laser sensor is very accurate and good for altitude feedback; however, it has a relatively short measurement range and its sampling rate is relatively slow, which limits its applications. The vertical velocity obtained by differentiating the laser altitude has delay and inhibits suitable damping. Using the vertical velocity obtained by integrating the vertical accelerometer’s output, the damping performance is improved. Originality/value Developing a low-cost quadrotor that can be used for educational purposes and successfully implementing altitude control using a laser sensor and accelerometer.


Proceedings ◽  
2021 ◽  
Vol 68 (1) ◽  
pp. 16
Author(s):  
Mahmoud Wagih ◽  
Alex S. Weddell ◽  
Steve Beeby

Radio frequency energy harvesting (RFEH) and wireless power transfer (WPT) are increasingly seen as a method of enabling sustainable computing, as opposed to mechanical or solar EH WPT does not require special materials or resonators and can be implemented using low-cost conductors and standard semiconductor devices. This work revisits the simplest antenna design, the wire monopole to demonstrate the lowest-footprint, lowest-cost rectifying antenna (rectenna) based on a single Schottky diode. The antenna is fabricated using a single Litz-wire silk-coated thread, embroidered into a standard textile substrate. The rectifier is fabricated on a compact low-cost flexible printed circuit board (PCB) using ultra-thin polyimide copper laminates to accommodate low-footprint surface mount components. The antenna maintains its bandwidth across the 868/915 MHz license-free band on- and off-body with only −4.7 dB degradation in total efficiency in human proximity. The rectenna achieves up to 55% RF to DC efficiency with 1.8 V DC output, at 1 mW of RF power, demonstrating its suitability as a power-supply unit for ultra-low power e-textile nodes.


Author(s):  
Keyur Mahant ◽  
Hiren Mewada ◽  
Amit Patel ◽  
Alpesh Vala ◽  
Jitendra Chaudhari

Aim: In this article, wideband substrate integrated waveguide (SIW) and rectangular waveguide (RWG) transition operating in Ka-band is proposed Objective: In this article, wideband substrate integrated waveguide (SIW) and rectangular waveguide (RWG) transition operating in Ka-band is proposed. Method: Coupling patch etched on the SIW cavity to couple the electromagnetic energy from SIW to RWG. Moreover, metasurface is introduced into the radiating patch to enhance bandwidth. To verify the functionality of the proposed structure back to back transition is designed and fabricated on a single layer substrate using standard printed circuit board (PCB) fabrication technology. Results: Measured results matches with the simulation results, measured insertion loss is less than 1.2 dB and return loss is better than 3 dB for the frequency range of 28.8 to 36.3 GHz. By fabricating transition with 35 SRRs bandwidth of the proposed transition can be improved. Conclusion: The proposed transition has advantages like compact in size, easy to fabricate, low cost and wide bandwidth. Proposed structure is a good candidate for millimeter wave circuits and systems.


2021 ◽  
Vol 11 (15) ◽  
pp. 6885
Author(s):  
Marcos D. Fernandez ◽  
José A. Ballesteros ◽  
Angel Belenguer

Empty substrate integrated coaxial line (ESICL) technology preserves the many advantages of the substrate integrated technology waveguides, such as low cost, low profile, or integration in a printed circuit board (PCB); in addition, ESICL is non-dispersive and has low radiation. To date, only two transitions have been proposed in the literature that connect the ESICL to classical planar lines such as grounded coplanar and microstrip. In both transitions, the feeding planar lines and the ESICL are built in the same substrate layer and they are based on transformed structures in the planar line, which must be in the central layer of the ESICL. These transitions also combine a lot of metallized and non-metallized parts, which increases the complexity of the manufacturing process. In this work, a new through-wire microstrip-to-ESICL transition is proposed. The feeding lines and the ESICL are implemented in different layers, so that the height of the ESICL can be independently chosen. In addition, it is a highly compact transition that does not require a transformer and can be freely rotated in its plane. This simplicity provides a high degree of versatility in the design phase, where there are only four variables that control the performance of the transition.


Author(s):  
Chao Sun ◽  
Roman Mikhaylov ◽  
Yongqing Fu ◽  
Fangda Wu ◽  
Hanlin Wang ◽  
...  

2015 ◽  
Vol 11 (6) ◽  
pp. 1366-1377 ◽  
Author(s):  
Jinn-Tsong Tsai ◽  
Chorng-Tyan Lin ◽  
Cheng-Chung Chang ◽  
Jyh-Horng Chou

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