Transmit/Receive (T/R) Modules—Key Elements for Phased Array Antennas

2013 ◽  
Vol 10 (3) ◽  
pp. 116-119 ◽  
Author(s):  
Martin Oppermann ◽  
Joerg Schroth ◽  
Felix Thurow
Keyword(s):  
Heat Sink ◽  
Cost Effective ◽  
Low Noise ◽  
High Yield ◽  
Power Devices ◽  
Active Components ◽  
High Power Amplifier ◽  
Noise Amplifier ◽  
Thermal Simulations ◽  
Silicon Based

Modern active electronically steered antennas (AESA) operate in different platforms and systems. Inside EADS/CASSIDIAN, the focus on X-band antennas today is on airborne and fighter nose radars, in satellite based SAR antennas (synthetic aperture radar) for earth observation, and ground surveillance and security radars. Active antennas are assembled with hundreds or even thousands of transmit/receive modules. This paper will describe an example of a so-called standardized module solution based on LTCC package technology. State-of-the-art modules are assembled with active components such as MMICs realized in GaAs technology, for example, the low noise amplifier (LNA) and the high power amplifier (HPA), silicon based devices, and passives. Assembly technologies are optimized for high yield series production inside CASSIDIAN MicroWave Factory. New semiconductor technologies, such as GaN (gallium nitride) are enablers for a new transmit/receive module generation. GaN/SiC based MMICs with higher power density compared with GaAs-based devices are technological challenges for innovative thermal management solutions and assembly alternatives. GaN power devices are soldered on modern heat sink materials with high thermal conductivity and matched CTE (between the MMIC and the heat sink). The results of thermal simulations comparing different heat sink materials in combination with soldering techniques will be discussed and an optimized solution will be shown. Another type of transmit/receive module technology based on RF-PCB and packaged MMICs will be discussed. Future applications of ground-based security radars, active antenna products with a one-dimensional array, and the need for cost-effective solutions seem to be a good fit for SMD-based products. Different packages, for example, QFN (quad flat pack no lead) and ceramic based (HTCC), mainly for power devices will be shown and compared.

Transmit/Receive (T/R) Modules – Key Elements for Phased Array Antennas

2013 ◽  
Vol 2013 (CICMT) ◽  
pp. 000054-000058
Author(s):  
Martin Oppermann ◽  
Joerg Schroth ◽  
Felix Thurow
Keyword(s):  
Cost Effective ◽  
Low Noise ◽  
High Yield ◽  
Power Devices ◽  
Active Components ◽  
High Power Amplifier ◽  
Active Antennas ◽  
Noise Amplifier ◽  
Thermal Simulations ◽  
Silicon Based

Modern Active Electronically Steered Antennas (AESA) are operating in different platforms and systems. Inside EADS/CASSIDIAN the focus on X-Band antennas today is in airborne and fighter nose radars, in satellite based SAR antennas (Synthetic Aperture Radar) for earth observation and ground surveillance and security radars. Active antennas are assembled with hundreds or even thousands of T/R modules. This paper will describe an example of a so called standardized module solution based on LTCC package technology. State-of-the-art modules are assembled with active components like MMICs realized in GaAs technology, e.g. Low Noise Amplifier (LNA) and High Power Amplifier (HPA), Silicon based devices and passives. Assembly technologies are optimized for high yield series production inside CASSIDIAN MicroWave Factory. New semiconductor technologies, like GaN (Gallium Nitride) are enablers for a new T/R module generation. GaN/SiC based MMICs with higher power density compared with GaAs based devices are technological challenges for innovative thermal management solutions and assembly alternatives. GaN power devices are soldered on modern heatsink materials with high thermal conductivity and matched CTE (between MMIC and heatsink). Results of thermal simulations comparing different heatsink materials in combination with soldering techniques will be discussed and an optimized solution will be shown. Another type of T/R Module technology based on RF-PCB and packaged MMICs will be discussed. Future applications of ground-based security radars, active antenna products with a one-dimensional array and needs for cost-effective solutions seem to be SMD-based products. Different packages, e.g. QFN (Quad Flat Pack no Lead) and ceramic based (HTCC), mainly for power devices will be shown and compared.

High-yield W-band monolithic HEMT low-noise amplifier and image rejection downconverter chips

1993 ◽  
Vol 3 (8) ◽  
pp. 281-283 ◽  
Author(s):  
H. Wang ◽  
K.W. Chang ◽  
T.N. Ton ◽  
M. Biedenbender ◽  
S.T. Chen ◽  
...  
Keyword(s):  
Low Noise ◽  
Low Noise Amplifier ◽  
High Yield ◽  
Image Rejection ◽  
W Band ◽  
Noise Amplifier

Quality films from carbon fiber evaporation for thorough coverage of TEM grids

1988 ◽  
Vol 46 ◽  
pp. 418-419
Author(s):  
N. Tempel ◽  
M. C. Ledbetter
Keyword(s):  
Electron Microscopy ◽  
High Resolution Electron Microscopy ◽  
Carbon Films ◽  
Low Noise ◽  
Vacuum Evaporation ◽  
High Yield ◽  
Good Adhesion ◽  
Noise Structure ◽  
Resolution Electron ◽  
Carbon Foils

Carbon films have been a support of choice for high resolution electron microscopy since the introduction of vacuum evaporation of carbon. The desirable qualities of carbon films and methods of producing them has been extensively reviewed. It is difficult to get a high yield of grids by many of these methods, especially if virtually all of the windows must be covered with a tightly bonded, quality film of predictable thickness. We report here a method for producing carbon foils designed to maximize these attributes: 1) coverage of virtually all grid windows, 2) freedom from holes, wrinkles or folds, 3) good adhesion between film and grid, 4) uniformity of film and low noise structure, 5) predictability of film thickness, and 6) reproducibility.Our method utilizes vacuum evaporation of carbon from a fiber onto celloidin film and grid bars, adhesion of the film complex to the grid by carbon-carbon contact, and removal of the celloidin by acetone dissolution. Materials must be of high purity, and cleanliness must be rigorously maintained.

A Wideband Low-Noise Amplifier with Active and Passive Cross-Coupled Feedbacks

2018 ◽  
Vol E101.C (1) ◽  
pp. 82-90
Author(s):  
Chang LIU ◽  
Zhi ZHANG ◽  
Zhiping WANG
Keyword(s):  
Low Noise ◽  
Low Noise Amplifier ◽  
Noise Amplifier
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