Reflection Phase Shift for PWB and PCBA Production Testing

2012 ◽  
Vol 9 (1) ◽  
pp. 1-9
Author(s):  
Abdelghani Renbi ◽  
Jerker Delsing

Testing of printed wiring boards (PWBs) and printed circuit board assemblies (PCBAs) is part of electronics production that has a great impact on profitability. High throughput and low cost testing is always needed for high quality and reliability. Bare board testing, that is, testing before loading components, is crucial, and can detect such defects as opens, bridges, near-opens, near-bridges, and characteristic impedance mismatches due to process variations and compounding raw material tolerances. If not detected at the bare board stage, the cost of defects can increase 10-fold. Another motivation for an unpopulated board test is that loading expensive components on a set of defective boards could be economically catastrophic. Flying probe systems, which were developed in late 1980s, are commonly used and favorable to perform bare board isolation and continuity testing, especially when the volume is not great enough to justify bed-of-nails purchase. Flying probe system performance for a given bare board depends on the test algorithm, the mechanical speed, and the number of probes. To reduce the cost on expensive test probes and probe maintenance and to accelerate the test time, this paper presents a new and cost-efficient approach to testing both populated and unpopulated boards with open sockets, using a single probe. Specifically, a coaxial probe injects one frequency signal into the PWB trace, and the phase shift between the reflected signal from the trace and the incident wave is detected and compared with the nominal value. This nominal value is determined by testing a defect-free board that already passed direct continuity and isolation testing. By applying this test solution to bed-of-nails equipment, we reduce the amount of probes by 50%. By employing this solution to flying probe systems with two probes, for a given design with NI isolated traces and NA adjacent pairs, we reduce the number of tests from (NI + NA) tests to NI tests as isolation and continuity are performed in one go. Flying probe systems involve mechanical movements that dominate the test time. By reducing the number of mechanical movements, we will dramatically increase test throughput. The experiments demonstrate feasibility for practical use in automatic test equipment (ATE) for PWB and PCBA testing. At the highest sensitivity of the phase shift detector, the prototyped tester is capable of distinguishing between a defective and error-free board with significant margins in case of defects such as opens, DC and RF bridges, and exceeded and different width lines. The margin in the measurement between a defective and a correct board, which depends on the type of the defect, is about 7% to 68%. In the case of loaded board testing, the approach is capable of detecting opens with important margins (our test cases showed 40% and 33%), which makes it a strong candidate approach to be applied officially to PCBA testing where probing is feasible. The approach can be applied to the complete layout or to boost the test strategy where the applied test solutions do not cover 100% of the possible defects.

2011 ◽  
Vol 2011 (1) ◽  
pp. 000311-000317 ◽  
Author(s):  
Abdelghani Renbi ◽  
Jerker Delsing

Bare board testing is vital before components loading. Defects after the PCB manufacturing process are possible such as opens, bridges, near-opens, near-bridges and characteristic impedance mismatches due to process variations and compounding raw material tolerances. Moreover, defects might cost about ten times more when detected in the next test phase, another motivation for unpopulated board test is loading expensive components on a set of defective boards might be economically catastrophic. Flying probe systems, which were developed in late 1980’s are commonly used and favorable to perform bare board isolation and continuity testing, especially when the volume is not big enough to justify bed of nails purchase. Flying probe system performance for a given bare board depends on the test algorithm, the mechanical speed and the number of probes. To reduce the cost on expensive test probes and probe maintenance and to accelerate the test time, this paper presents a new and cost efficient approach to test unpopulated and populated board with open sockets, using a single probe. Specifically, a coaxial probe injects one frequency signal into the PCB trace, the phase shift between the reected signal from the trace and the incident wave is detected and compared with the nominal value, which has been captured from a defect free board, which already underwent direct continuity and isolation testing. The conducted experiments have shown a good feasibility for practical use in the ATE (Automatic Test Equipment) for bare board and loaded board with open sockets. At the highest sensitivity of the phase shift detector, the prototyped tester is capable to distinguish between a defective and error free board with significant margins in case of defects such as opens, DC and RF bridges, exceeded and different width lines. The margin in the measurement between a defective and a correct board, which depends on the type of the defect is about 8 % to 65 %.


Author(s):  
Keyur Mahant ◽  
Hiren Mewada ◽  
Amit Patel ◽  
Alpesh Vala ◽  
Jitendra Chaudhari

Aim: In this article, wideband substrate integrated waveguide (SIW) and rectangular waveguide (RWG) transition operating in Ka-band is proposed Objective: In this article, wideband substrate integrated waveguide (SIW) and rectangular waveguide (RWG) transition operating in Ka-band is proposed. Method: Coupling patch etched on the SIW cavity to couple the electromagnetic energy from SIW to RWG. Moreover, metasurface is introduced into the radiating patch to enhance bandwidth. To verify the functionality of the proposed structure back to back transition is designed and fabricated on a single layer substrate using standard printed circuit board (PCB) fabrication technology. Results: Measured results matches with the simulation results, measured insertion loss is less than 1.2 dB and return loss is better than 3 dB for the frequency range of 28.8 to 36.3 GHz. By fabricating transition with 35 SRRs bandwidth of the proposed transition can be improved. Conclusion: The proposed transition has advantages like compact in size, easy to fabricate, low cost and wide bandwidth. Proposed structure is a good candidate for millimeter wave circuits and systems.


2021 ◽  
Vol 11 (15) ◽  
pp. 6885
Author(s):  
Marcos D. Fernandez ◽  
José A. Ballesteros ◽  
Angel Belenguer

Empty substrate integrated coaxial line (ESICL) technology preserves the many advantages of the substrate integrated technology waveguides, such as low cost, low profile, or integration in a printed circuit board (PCB); in addition, ESICL is non-dispersive and has low radiation. To date, only two transitions have been proposed in the literature that connect the ESICL to classical planar lines such as grounded coplanar and microstrip. In both transitions, the feeding planar lines and the ESICL are built in the same substrate layer and they are based on transformed structures in the planar line, which must be in the central layer of the ESICL. These transitions also combine a lot of metallized and non-metallized parts, which increases the complexity of the manufacturing process. In this work, a new through-wire microstrip-to-ESICL transition is proposed. The feeding lines and the ESICL are implemented in different layers, so that the height of the ESICL can be independently chosen. In addition, it is a highly compact transition that does not require a transformer and can be freely rotated in its plane. This simplicity provides a high degree of versatility in the design phase, where there are only four variables that control the performance of the transition.


2019 ◽  
Vol 2019 ◽  
pp. 1-5 ◽  
Author(s):  
Steve W. Y. Mung ◽  
Cheuk Yin Cheung ◽  
Ka Ming Wu ◽  
Joseph S. M. Yuen

This article presents a simple wideband rectangular antenna in foldable and non-foldable (printed circuit board (PCB)) structures for Internet of Things (IoT) applications. Both are simple structures with two similar rectangular metal planes which cover multiple frequency bands such as GPS, WCDMA/LTE, and 2.4 GHz industrial, scientific, and medical (ISM) bands. This wideband antenna is suitable to integrate into the short- and long-range wireless applications such as the short-range 2.4 GHz ISM band and standard cellular bands. This lowers the overall size of the product as well as the cost in the applications. In this article, the configuration and operation principle are presented as well as its trade-offs on the design parameters. Simulated and experimental results of foldable and non-foldable (PCB) structures show that the antenna is suited for IoT applications.


Author(s):  
Hanh

In this work, ZnO nanorods (NRs) were successfully grown on printed circuit board substrates (PCBs) by utilizing a one-step, seedless, low-cost hydrothermal method. It was shown that by implementing a galvanic cell structure in an aqueous solution of 80 mM of zinc nitrate hexahydrate and hexamethylenetetramine, ZnO NRs can directly grow on the PCBs substrate without the assistance of a seed layer. The effect of hydrothermal time on the surface morphologies, and the crystallinity of the as-grown ZnO nanorods (NRs) was also investigated. The as-grown ZnO NRs also exhibited a significant enhancement in vertical growth and their crystallinity with 5 hour growth.


2002 ◽  
Vol 124 (3) ◽  
pp. 205-211 ◽  
Author(s):  
John H. Lau ◽  
S. W. Ricky Lee ◽  
Stephen H. Pan ◽  
Chris Chang

An elasto-plastic-creep analysis of a low-cost micro via-in-pad (VIP) substrate for supporting a solder bumped flip chip in a chip scale package (CSP) format which is soldered onto a printed circuit board (PCB) is presented in this study. Emphasis is placed on the design, materials, and reliability of the micro VIP substrate and of the micro VIP CSP solder joints on PCB. The solder is assumed to obey Norton’s creep law. Cross-sections of samples are examined for a better understanding of the solder bump, CSP substrate redistribution, micro VIP, and solder joint. Also, the thermal cycling test results of the micro VIP CSP PCB assembly is presented.


Author(s):  
Robert N. Dean ◽  
Lauren E. Beckingham

Printed circuit board (PCB) sensors are a sensor technology where the layout of traces on a PCB has been optimized so that the traces electromagnetically interact with the surrounding environment. These types of sensors can be manufactured at very low cost using standard commercially available low-cost printed circuit board fabrication. Exposed conductive electrodes on the circuit board are useful for measuring the electrical conductivity of the surrounding environment, and these sensors have been used in applications such as salinity measurement and dissolved ion content measurement of aqueous solutions. Insulated interdigitated electrode sensors are useful for capacitively analyzing the surrounding environment, and these sensors have been used to detect the presence of liquid water and to measure the moisture content of substances in physical contact with the sensor. Additionally, by measuring the complex impedance of the capacitive sensor over a wide frequency range, information concerning the chemical composition of the substance in contact with the sensor can be determined. In addition to conducive and capacitive PCB sensors, the third type of PCB sensor would be an inductive sensor. Although it is challenging to realize 3D coils in PCB technology, planar inductors can be realized in a single Cu layer on a PCB, and insulated from the environment using a cover layer of polymeric solder mask. This type of electrode structure can inductively couple with magnetic materials in close proximity to the sensor. A variety of magnetic materials exist, including iron, nickel and cobalt. Additionally, many alloys of these elements are also magnetic. Of particular interest are corrosion products with magnetic properties, such as iron(III) oxide, Fe3O2, also known as common rust. A thin layer of iron(III) oxide powder deposited on the sensor's active area results in a measureable increase in the sensor's inductance. As such, an inductive PCB sensor could be a low-cost option for detecting the presence of some corrosion products in its operating environment.


2016 ◽  
Vol 2016 (1) ◽  
pp. 000557-000562
Author(s):  
Robert N. Dean ◽  
Frank T. Werner ◽  
Michael J. Bozack

Abstract Printed circuit board (PCB) sensors using low-cost commercial printed circuit board fabrication processes have been demonstrated for environmental sensing applications. One configuration of these sensors uses exposed electrodes to measure saltwater concentration in freshwater/seawater mixtures, through monitoring the resistance between the electrodes when they are immersed in the saltwater/freshwater solution. The lowest cost commercial PCB processes use an immersion Sn HASL surface finish on exposed copper cladding, including the sensing electrodes. This commercial PCB process has been demonstrated to make an effective, low-cost, short-lifetime sensor for saltwater concentration testing. The Sn finish, however, may not be optimal for this application. Sn oxidizes, which can interfere with sensor performance. Additionally, Sn and Sn oxides are potentially reactive with chemical constituents in seawater and seawater/freshwater solutions. An immersion Au (ENIG) surface finish is certainly less reactive with the atmosphere and chemicals likely present in the testing environment. However, an immersion Au finish increases the cost of the sensors by 30% to 40%. To investigate if the possible benefits of the more expensive Au surface finish are worth the extra expense, a study was performed where identical PCB sensors were procured from a commercial vendor with their standard low-cost Sn HASL finish and with their standard ENIG surface finish. Both sets of sensors were then evaluated in concentrations of seawater and freshwater, from 0% to 100% seawater concentration, using freshwater samples from a natural freshwater source near the coast where the seawater was obtained. Testing demonstrated an insignificant difference in sensor performance between the Sn HASL and the ENIG coated sensing electrodes. The results of this investigation indicated that for applications where the sensors will not be used for long periods of time, the added expense of an immersion Au surface finish is not worth the added cost.


2020 ◽  
Vol 12 (5) ◽  
pp. 356-366
Author(s):  
Salma El-Sawy ◽  
Wasim Nawaz ◽  
Mohamed Osama ◽  
Ahmet Tekin

AbstractThis paper discusses the design of chip-less RFID tags of a standard pocket size of 69 mm by 156 mm. These tags are based on lumped elements of copper metal traces constructed on a thin polyamide flexible substrate. Moreover, a low-cost single-chip Bluetooth detector circuit system is demonstrated. Two different detection methods: variable coil load coupling and optical light intensity detection were combined to yield 256 unique ID codes. In the first method, by utilizing simple 4 MHz digital drivers and an integrated analog to digital converter (ADC) in the reader controller; various inductively coupled resonant loads corresponding to multiple distinct tags could be differentiated, yielding eight different (3-bit) ID codes. The additional via-based hole pattern reflectometer method creates additional 32 distinct levels (5-bit) utilizing 650 nm visible light-emitting diode and a simple trans-impedance operational along with the same analog ADC pins of a Bluetooth controller. The printed circuit board trace coil on the two-layer low-cost FR-4 waterproof sealed detector unit is simultaneously used as a Qi wireless power receiver to charge the120 mAh 2450 Lithium Polymer (LiR) battery. The device could remain operational for more than a month with a single charge; remaining connected with a mobile device and enabling 10 readouts daily.


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