Excimer Laser Ablation of High Aspect Ratio Microvias Using a Novel Sensitizer-Enhanced Photopolymer

2011 ◽  
Vol 8 (2) ◽  
pp. 66-71 ◽  
Author(s):  
F. Sarwar ◽  
Z. Chen ◽  
J. Wu ◽  
D.C. Webster ◽  
V.R. Marinov
Keyword(s):  
Laser Ablation ◽  
Aspect Ratio ◽  
Thick Film ◽  
Excimer Laser ◽  
High Aspect Ratio ◽  
Thick Layer ◽  
Laser Fabrication ◽  
Excimer Laser Ablation ◽  
Negative Tone

A new drop-in sensitizer has been developed for use with COTS negative tone photoresist to facilitate the laser fabrication of high aspect ratio microstructures in a thick film of photopolymer. Microvias with diameters as small as 50 μm have been successfully laser ablated in a 160 μm thick layer of the sensitized photoresist. Ablation rates of up to 86 nm/pulse have been achieved with an excimer laser.

Laser Machining and Metallization of VIAS in Aluminum Nitride

1995 ◽  
Vol 390 ◽  
Author(s):  
Sudhakar Raman ◽  
Janet K. Lumpp
Keyword(s):  
Laser Ablation ◽  
Aluminum Nitride ◽  
Thick Film ◽  
Excimer Laser ◽  
Laser Machining ◽  
Excimer Laser Ablation ◽  
Electrical Interconnection ◽  
Cyanoacrylate Adhesive ◽  
Metal Backing ◽  
Film Conductor

ABSTRACTA via metallization technique involving excimer laser ablation of aluminum nitride substrate with a metal backing, attached with cyanoacrylate adhesive was investigated. The objective was to develop a procedure to ensure good electrical interconnection between the thick film conductor pads and the walls of the via. An aluminum nitride compatible Ag-Pd thick film paste was used in this experiment. Two different sequences were tested: In the first sequence both sides of the aluminum nitride substrate were printed and fired and then the vias were laser drilled. In the second sequence, one side of the substrate was printed and fired first, then the vias were laser drilled and the second side was printed and fired. In both of the above sequences, laser ablation of the printed conductor and redeposition of the ablated metal backing are necessary for making a proper contact with the thick film conductor pads.

UV excimer laser drilled high aspect ratio submicron via hole

2009 ◽  
Vol 256 (1) ◽  
pp. 183-186 ◽  
Author(s):  
K.H. Chen ◽  
Wenhsing Wu ◽  
Byung Hwan Chu ◽  
C.Y. Chang ◽  
Jenshan Lin ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
Excimer Laser ◽  
High Aspect Ratio ◽  
Via Hole

Photoacoustic injury and bone healing following 193nm excimer laser ablation

1992 ◽  
Vol 12 (4) ◽  
pp. 390-396 ◽  
Author(s):  
Joshua Lustmann ◽  
Mario Ulmansky ◽  
Amihay Fuxbrunner ◽  
Aaron Lewis
Keyword(s):  
Laser Ablation ◽  
Excimer Laser ◽  
Bone Healing ◽  
Excimer Laser Ablation

Excimer-laser ablation and micro-patterning of ceramic Si 3 N 4

1997 ◽  
Vol 65 (3) ◽  
pp. 259-261 ◽  
Author(s):  
J. Heitz ◽  
J.D. Pedarnig ◽  
D. Bäuerle ◽  
G. Petzow
Keyword(s):  
Laser Ablation ◽  
Excimer Laser ◽  
Excimer Laser Ablation ◽  
Micro Patterning
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