scholarly journals Optimization of High-Speed Electrolytic Plating of Copper Pillar to Achieve a Flat Top Morphology and Height Uniformity

2021 ◽  
Vol 18 (1) ◽  
pp. 7-11
Author(s):  
Raihei Ikumoto ◽  
Yuki Itakura ◽  
Shinji Tachibana ◽  
Hisamitsu Yamamoto
Keyword(s):  
Polarization Curve ◽  
High Speed ◽  
Organic Additive ◽  
Additive Concentration ◽  
Plating Bath ◽  
Pillar Height ◽  
Large Size ◽  
Cu Pillar ◽  
The Ideal

Abstract Cu plating bath for high-speed electrodeposition of Cu pillar was designed in consideration of a flat top morphology of pillar and a pillar height uniformity. An ideal polarization curve was assumed for the flat top morphology. To obtain the ideal polarization curve, an effect of organic additive concentration and solution agitation on the polarization curve were investigated. The basic bath components were optimized considering a Wagner number to improve the pillar height uniformity. To confirm the pillar top morphology and the pillar height uniformity, a 300-mm diameter wafer was plated with Cu at 20 A/dm2. As a result, improved pillar top morphology and pillar height uniformity were obtained. The optimized plating bath was applied to the plating of a large-size panel of 415 × 510 mm.

Optimization of High-Speed Electrolytic Plating of Copper Pillar to Achieve a Flat Top Morphology and Height Uniformity

2020 ◽  
Vol 2020 (1) ◽  
pp. 000150-000155
Author(s):  
Raihei Ikumoto ◽  
Yuki Itakura ◽  
Shinji Tachibana ◽  
Hisamitsu Yamamoto
Keyword(s):  
Polarization Curve ◽  
High Speed ◽  
Organic Additive ◽  
Additive Concentration ◽  
Plating Bath ◽  
Pillar Height ◽  
Large Size ◽  
Cu Pillar ◽  
The Ideal

Abstract Cu plating bath for high-speed electrodeposition of Cu pillar was designed in consideration of a flat top morphology of pillar and a pillar height uniformity. An ideal polarization curve was assumed for the flat top morphology. To obtain the ideal polarization curve, an effect of organic additive concentration and solution agitation on the polarization curve were investigated. The basic bath components were optimized considering a Wagner number to improve pillar height uniformity. To confirm the pillar top morphology and the pillar height uniformity, a 300 mm diameter wafer was plated with Cu at 20 A/dm2. As a result, improved pillar top morphology and pillar height uniformity were obtained. The optimized plating bath was applied to the plating of large-size panel of 415 × 510 mm.

scholarly journals Exercise Intensity and Technical Involvement in U9 Team Handball: Effect of Game Format

2021 ◽  
Vol 18 (11) ◽  
pp. 5663
Author(s):  
Georgios Ermidis ◽  
Rasmus C. Ellegard ◽  
Vincenzo Rago ◽  
Morten B. Randers ◽  
Peter Krustrup ◽  
...  
Keyword(s):  
Heart Rate ◽  
Locomotor Activity ◽  
Exercise Intensity ◽  
High Intensity ◽  
High Speed ◽  
Medium Size ◽  
Total Distance ◽  
Team Handball ◽  
Large Size ◽  
Game Format

The purpose of this study was to quantify the exercise intensity and technical involvement of U9 boys’ and girls’ team handball during different game formats, and the differences between genders. Locomotor activity (total distance, distance in speed zones, accelerations, and decelerations), heart rate (HR), and technical involvement (shots, goals, and duels) metrics were collected during various 15 min game formats from a total of 57 Danish U9 players (37 boys and 20 girls). Game formats were a small size pitch (20 × 13 m) with 3 vs 3 players and offensive goalkeepers (S3 + 1) and 4 vs 4 players (S4), a medium size pitch (25.8 × 20 m) with 4 vs 4 (M4) and 5 vs 5 (M5) players, and a large size pitch (40 × 20 m) with 5 vs 5 (L5) players. Boys and girls covered a higher total distance (TD) of high-speed running (HSR) and sprinting during L5 games compared to all other game formats (p < 0.05; ES = (−0.9 to −2.1), (−1.4 to −2.8), and (−0.9 to −1.3) respectively). Players covered the highest amount of sprinting distance in L5 games compared to all other game formats (p < 0.01; ES = 0.8 to 1.4). In all the game formats, players spent from 3.04 to 5.96 min in 180–200 bpm and 0.03 min to 0.85 min in >200 bpm of the total 15 min. In addition, both genders had more shots in S3 + 1 than M5 (p < 0.01; ES = 1.0 (0.4;1.7)) and L5 (p < 0.01; ES = 1.1 (0.6;2.2)). Team handball matches have high heart rates, total distances covered, and high-intensity running distances for U9 boys and girls irrespective of the game format. Locomotor demands appeared to be even higher when playing on larger pitches, whereas the smaller pitch size and fewer players led to elevated technical involvement.

scholarly journals Hydride-based antiperovskites with soft anionic sublattices as fast alkali ionic conductors

2021 ◽  
Vol 12 (1) ◽  
Author(s):  
Shenghan Gao ◽  
Thibault Broux ◽  
Susumu Fujii ◽  
Cédric Tassel ◽  
Kentaro Yamamoto ◽  
...  
Keyword(s):  
Experimental Studies ◽  
Ionic Conductivities ◽  
Cubic Phase ◽  
Ionic Conductors ◽  
Large Size ◽  
Migration Barriers ◽  
Soft Phonon Mode ◽  
Aliovalent Substitution ◽  
Cubic Forms ◽  
The Ideal

AbstractMost solid-state materials are composed of p-block anions, only in recent years the introduction of hydride anions (1s2) in oxides (e.g., SrVO2H, BaTi(O,H)3) has allowed the discovery of various interesting properties. Here we exploit the large polarizability of hydride anions (H–) together with chalcogenide (Ch2–) anions to construct a family of antiperovskites with soft anionic sublattices. The M3HCh antiperovskites (M = Li, Na) adopt the ideal cubic structure except orthorhombic Na3HS, despite the large variation in sizes of M and Ch. This unconventional robustness of cubic phase mainly originates from the large size-flexibility of the H– anion. Theoretical and experimental studies reveal low migration barriers for Li+/Na+ transport and high ionic conductivity, possibly promoted by a soft phonon mode associated with the rotational motion of HM6 octahedra in their cubic forms. Aliovalent substitution to create vacancies has further enhanced ionic conductivities of this series of antiperovskites, resulting in Na2.9H(Se0.9I0.1) achieving a high conductivity of ~1 × 10–4 S/cm (100 °C).

scholarly journals Optical Encryption Based on Computer Generated Holograms in Photopolymer

Polymers ◽  
2021 ◽  
Vol 13 (9) ◽  
pp. 1358
Author(s):  
Taihui Wu ◽  
Jianshe Ma ◽  
Chengchen Wang ◽  
Haibei Wang ◽  
Liangcai Cao ◽  
...  
Keyword(s):  
High Speed ◽  
Three Dimensional ◽  
Angular Spectrum ◽  
Quick Response ◽  
Response Code ◽  
Optical Encryption ◽  
Large Size ◽  
Quick Response Code ◽  
Computer Generated Holograms ◽  
Encryption Method

An optical encryption method based on computer generated holograms printing of photopolymer is presented. Fraunhofer diffraction is performed based on the Gerchberg-Saxton algorithm, and a hologram of the Advanced Encryption Standard encrypted Quick Response code is generated to record the ciphertext. The holograms of the key and the three-dimensional image are generated by the angular spectrum diffraction algorithm. The experimental results show that large-size encrypted Quick Response (QR) code and miniature keys can be printed in photopolymers, which has good application prospects in optical encryption. This method has the advantages of high-density storage, high speed, large fault tolerance, and anti-peeping.

Parameter study and optimization design of a hat oblique tunnel portal

2021 ◽  
pp. 095440972110140
Author(s):  
Zijian Guo ◽  
Tanghong Liu ◽  
Wenhui Li ◽  
Yutao Xia
Keyword(s):  
High Speed ◽  
Optimization Design ◽  
Pareto Front ◽  
Optimization Problem ◽  
Optimization Method ◽  
Design Parameters ◽  
Parameter Study ◽  
Buffer Structure ◽  
Tunnel Entrance ◽  
The Ideal

The present work focuses on the aerodynamic problems resulting from a high-speed train (HST) passing through a tunnel. Numerical simulations were employed to obtain the numerical results, and they were verified by a moving-model test. Two responses, [Formula: see text] (coefficient of the peak-to-peak pressure of a single fluctuation) and[Formula: see text] (pressure value of micro-pressure wave), were studied with regard to the three building parameters of the portal-hat buffer structure of the tunnel entrance and exit. The MOPSO (multi-objective particle swarm optimization) method was employed to solve the optimization problem in order to find the minimum [Formula: see text] and[Formula: see text]. Results showed that the effects of the three design parameters on [Formula: see text] were not monotonous, and the influences of[Formula: see text] (the oblique angle of the portal) and [Formula: see text] (the height of the hat structure) were more significant than that of[Formula: see text] (the angle between the vertical line of the portal and the hat). Monotonically decreasing responses were found in [Formula: see text] for [Formula: see text] and[Formula: see text]. The Pareto front of [Formula: see text] and[Formula: see text]was obtained. The ideal single-objective optimums for each response located at the ends of the Pareto front had values of 1.0560 for [Formula: see text] and 101.8 Pa for[Formula: see text].

High-Speed Cu Electrodeposition and Reliability of Cu Pillar Bumps in High-Temperature Storage

2018 ◽  
Vol 165 (13) ◽  
pp. D647-D653 ◽  
Author(s):  
P. T. Lee ◽  
Y. S. Wu ◽  
C. Y. Lee ◽  
H. C. Liu ◽  
C. E. Ho
Keyword(s):  
High Temperature ◽  
High Speed ◽  
Cu Pillar ◽  
High Temperature Storage ◽  
Temperature Storage

Propelling Nozzle Research

1964 ◽  
Vol 68 (647) ◽  
pp. 717-727 ◽  
Author(s):  
W. G. E. Lewis
Keyword(s):  
High Speed ◽  
High Performance ◽  
Research Programme ◽  
Static Tests ◽  
Transport Aircraft ◽  
Supersonic Transport ◽  
Design Behaviour ◽  
Base Bleed ◽  
Critical Phases ◽  
The Ideal

SummaryThe current interest in supersonic transport aircraft makes it appropriate to consider the problems of propulsion nozzle systems for high speed flight. The discussion will be confined mainly to this field of activity.In the absence of external drag and weight factors, the ideal configuration to maintain optimum thrust at all flight speeds would employ a mechanically variable area ratio nozzle. By such means the jet flow could be fully and properly expanded at all times.A practical design to accommodate such variations is inherently complex, and so an alternative solution using aerodynamic techniques has been sought. It is necessary to remember that the success of whatever method is eventually chosen must rest on its ability to combine a high performance at cruise with very small loss during other critical phases of the flight plan.This paper describes some of the results of a nozzle research programme aimed primarily at solving the above problem, with an attempt to explain the philosophy behind the aerodynamic techniques tried. Some discussion is given of the experimental difficulties in establishing a sufficiently accurate standard of measurement for design point performance. In a few chosen configurations experimental results have been extensively backed by theoretical studies.The need to demonstrate off-design behaviour in the presence of an external flow field is stressed, with special reference to the misleading results often obtained from static tests.Finally, some attention is given to the question of base bleed, with its repercussions on the installation of the propulsion nozzle in an aircraft.

Si Photonics Deployment Using Cu Pillar Interconnect and Chip On Wafer Platform

2016 ◽  
Vol 2016 (DPC) ◽  
pp. 001663-001681
Author(s):  
Miguel Jimarez
Keyword(s):  
Light Source ◽  
Silicon Photonics ◽  
High Speed ◽  
High Sensitivity ◽  
Optical Path ◽  
Clock Recovery ◽  
Wafer Scale ◽  
Si Photonics ◽  
Cu Pillar ◽  
Fine Pitch

We introduce a high-speed 4x25Gbps, MSA-compliant, QSFP transceiver built on a Silicon Photonics platform. The transceiver integrates high sensitivity receivers, CTLE, clock recovery, modulator drivers and BIST on a TSMC 28nm die connected to the photonic die thru a fine pitch (50um) Copper Pillar interface. A wafer-scale approach, Chip on Wafer, CoW, is used to assemble the electronic die and the light source on to the photonic die, so that the full optical path can be tested, at speed, in loopback configuration in wafer form, using a standard ATE solution. This presentation focuses on the CoW assembly development aspects of the transceiver. Wafer probe and bump, die processing services, CoW assembly and Back End of Line, BEOL, Test Services will be presented.

Control of Bump Morphology in Lead Free Solder Plating for Higher Density Packaging

2014 ◽  
Vol 2014 (DPC) ◽  
pp. 001643-001669
Author(s):  
Koji Tatsumi ◽  
Kyouhei Mineo ◽  
Takeshi Hatta ◽  
Takuma Katase ◽  
Masayuki Ishikawa ◽  
...  
Keyword(s):  
High Speed ◽  
Flip Chip ◽  
New Technologies ◽  
Short Circuit ◽  
Lead Free Solder ◽  
Cu Pillar ◽  
Fine Pitch ◽  
Different Shapes ◽  
Free Solder ◽  
High Density Packaging

Solder bumping is one of the key technologies for flip chip connection. Flip chip connection has been moving forward to its further downsizing and higher integration with new technologies, such as Cu pillar, micro bump and Through Silicon Via (TSV). Unlike some methods like solder printing and ball mounting, electroplating is a very promising technology for upcoming finer bump formation. We have been developing SnAg plating chemical while taking technology progress and customers' needs into consideration at the same time. Today, we see more variety of requests including for high speed plating to increase the productivity and also for high density packaging such as narrowing the bump pitch itself and downsizing of the bump diameter. To meet these technical needs, some adjustments of plating chemical will be necessary. This time we developed new plating chemicals to correspond to bump miniaturization. For instance, our new SnAg chemical can control bump morphology while maintaining the high deposition speed. With our new plating chemicals, we can deposit mushroom bumps that grow vertically against the resist surface, also this new chemicals work effectively to prevent short-circuit between mushroom bumps with fine pitch from forming. In addition, we succeeded in developing high speed Cu pillar plating chemicals that can control the surface morphology to create different shapes. We'd like to present our updates on controlling bump morphology for various applications.

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