Inkjet Printing Technology: A Novel Bottom-up Approach For Multilayer Ceramic Components and High Definition Printed Electronic Devices

2012 ◽  
Vol 2012 (CICMT) ◽  
pp. 000055-000066 ◽  
Author(s):  
C. DOSSOU-YOVO ◽  
M. MOUGENOT ◽  
E. BEAUDROUET ◽  
M. BESSAUDOU ◽  
N. BERNARDIN ◽  
...  
Keyword(s):  
Inkjet Printing ◽  
High Definition ◽  
Large Area ◽  
Droplet Spreading ◽  
Component Design ◽  
Ceramic Capacitor ◽  
Ceramic Components ◽  
Multilayer Ceramic ◽  
Design Characteristics ◽  
Printing Parameters

This paper describes the methodology of thick film and Multilayer Ceramic Capacitor (MLCC) components manufacturing by inkjet printing. The printing unit is a CERADROP 3D multimaterial inkjet printer. Aqueous conductive and dielectric inks were formulated according to the printheads specifications in terms of viscosity, surface tension, particles size and sedimentation. Jetting behavior was controlled and optimized to reach the best droplets characteristics with regard to the design. Numerical processing simulation tool helps to control the printing job and to identify beneficial potential issues during the processing. Therefore printing parameters (droplet spreading, layer thickness, filling strategy, layer drying, etc.) were optimized according to material and component design characteristics. By this way, high definition and thin conductive tracks were achieved on alumina substrate with good electrical properties. Moreover, two printheads were used to build successively 3D multimaterial MLCC components with thin dielectric and conductive layers (i) with a good margins precision compared to traditional processes and (ii) with very high complex configurations thanks to the flexibility of the inkjet printing process. For both applications, large area components were accessible in a single batch.

Inkjet Printing Technology: A Novel Bottom-up Approach for Multilayer Ceramic Components and High Definition Printed Electronic Devices

2012 ◽  
Vol 9 (4) ◽  
pp. 187-198
Author(s):  
C. Dossou-Yovo ◽  
M. Mougenot ◽  
E. Beaudrouet ◽  
M. Bessaudou ◽  
N. Bernardin ◽  
...  
Keyword(s):  
Inkjet Printing ◽  
Good Precision ◽  
High Definition ◽  
Large Area ◽  
Droplet Spreading ◽  
Component Design ◽  
Ceramic Components ◽  
Multilayer Ceramic ◽  
Design Characteristics ◽  
Component Manufacturing

This paper describes the methodology of thick film and multilayer ceramic capacitor (MLCC) component manufacturing by inkjet printing. The printing unit is a CeraDrop 3D multimaterial inkjet printer. Aqueous conductive and dielectric inks were formulated according to the printhead specifications in terms of viscosity, surface tension, particle size, and sedimentation. Jetting behavior was controlled and optimized to reach the best droplet characteristics with regard to the design. The numerical processing simulation tool helps to control the printing job and to identify potential beneficial issues during the processing. Therefore, printing parameters (droplet spreading, layer thickness, filling strategy, layer drying, etc.) were optimized according to material and component design characteristics. In this way, high definition and thin conductive tracks were achieved on an alumina substrate with good electrical properties. Moreover, two printheads were used to successively build 3D multimaterial MLCC components with thin dielectric and conductive layers (i) with good precision of margins compared with traditional processes, and (ii) with very high complex configurations thanks to the flexibility of the inkjet printing process. For both applications, large area components were accessible in a single batch.

scholarly journals Hexagonal and Square Patterned Silver Nanowires/PEDOT:PSS Composite Grids by Screen Printing for Uniformly Transparent Heaters

Polymers ◽  
2019 ◽  
Vol 11 (3) ◽  
pp. 468 ◽  
Author(s):  
Xin He ◽  
Gengzhe Shen ◽  
Ruibin Xu ◽  
Weijia Yang ◽  
Chi Zhang ◽  
...  
Keyword(s):  
Screen Printing ◽  
Silver Nanowires ◽  
Composite Films ◽  
Silver Nanowire ◽  
Mass Ratio ◽  
Large Area ◽  
High Transparency ◽  
Square Grid ◽  
Photoelectric Properties ◽  
Printing Parameters

Transparent conductive films with hexagonal and square patterns were fabricated on poly(ethylene terephthalate) (PET) substrates by screen printing technology utilizing a poly(3,4-ethylenedioxythiophene) poly(styrenesulfonate) (PEDOT:PSS) and silver nanowire (Ag NWs) composite ink. The printing parameters—mesh number, printing layer, mass ratio of PEDOT:PSS to Ag NWs and pattern shape—have a significant influence on the photoelectric properties of the composite films. The screen mesh with a mesh number of 200 possesses a suitable mesh size of 74 µm for printing clear and integrated grids with high transparency. With an increase in the printing layer and a decrease in the mass ratio of PEDOT:PSS to Ag NWs, the transmittance and resistance of the printed grids both decreased. When the printing layer is 1, the transmittance and resistance are 85.6% and 2.23 kΩ for the hexagonal grid and 77.3% and 8.78 kΩ for the square grid, indicating that the more compact arrangement of square grids reduces the transmittance, and the greater number of connections of the square grid increases the resistance. Therefore, it is believed that improved photoelectric properties of transparent electrodes could be obtained by designing a printing pattern with optimized printing parameters. Additionally, the Ag NWs/PEDOT:PSS composite films with hexagonal and square patterns exhibit high transparency and good uniformity, suggesting promising applications in large-area and uniform heaters.

The XFM beamline at the Australian Synchrotron

2020 ◽  
Vol 27 (5) ◽  
pp. 1447-1458 ◽  
Author(s):  
Daryl L. Howard ◽  
Martin D. de Jonge ◽  
Nader Afshar ◽  
Chris G. Ryan ◽  
Robin Kirkham ◽  
...  
Keyword(s):  
Materials Science ◽  
Energy Detection ◽  
Array Detector ◽  
X Rays ◽  
X Ray Diffraction ◽  
High Definition ◽  
Large Area ◽  
X Ray ◽  
Diffraction Microscopy ◽  
System Time

The X-ray fluorescence microscopy (XFM) beamline is an in-vacuum undulator-based X-ray fluorescence (XRF) microprobe beamline at the 3 GeV Australian Synchrotron. The beamline delivers hard X-rays in the 4–27 keV energy range, permitting K emission to Cd and L and M emission for all other heavier elements. With a practical low-energy detection cut-off of approximately 1.5 keV, low-Z detection is constrained to Si, with Al detectable under favourable circumstances. The beamline has two scanning stations: a Kirkpatrick–Baez mirror microprobe, which produces a focal spot of 2 µm × 2 µm FWHM, and a large-area scanning `milliprobe', which has the beam size defined by slits. Energy-dispersive detector systems include the Maia 384, Vortex-EM and Vortex-ME3 for XRF measurement, and the EIGER2 X 1 Mpixel array detector for scanning X-ray diffraction microscopy measurements. The beamline uses event-mode data acquisition that eliminates detector system time overheads, and motion control overheads are significantly reduced through the application of an efficient raster scanning algorithm. The minimal overheads, in conjunction with short dwell times per pixel, have allowed XFM to establish techniques such as full spectroscopic XANES fluorescence imaging, XRF tomography, fly scanning ptychography and high-definition XRF imaging over large areas. XFM provides diverse analysis capabilities in the fields of medicine, biology, geology, materials science and cultural heritage. This paper discusses the beamline status, scientific showcases and future upgrades.

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