Integration of Chemically Amplified Photoresist and High-Speed Copper Plating Products for Advanced Packaging Applications

2017 ◽  
Vol 2017 (DPC) ◽  
pp. 1-22
Author(s):  
Rosemary Bell ◽  
Joseph Lachowski ◽  
Mitsuru Haga ◽  
Inho Lee ◽  
Regina Cho ◽  
...  
Keyword(s):  
High Speed ◽  
Product Line ◽  
Superior Performance ◽  
Copper Plating ◽  
Plating Bath ◽  
Chemical Company ◽  
Chemically Amplified ◽  
Key Factor ◽  
Advanced Packaging ◽  
Electroplating Process

Advanced packaging technologies require materials which will allow for better resolution of patterns associated with the ever more challenging device architecture, along with materials that will allow for higher throughput. Device throughput can be increased with imaging materials that have higher sensitivity and metallization chemistries with faster electrodeposition rates. Chemically amplified photoresists offer the advantages of excellent sensitivity and resolution with good process margins, coupled with excellent stripping performance and plating bath compatibility for the film thicknesses that are required in packaging applications. Electrolytic copper plating products with fast deposition rates are a key factor in decreasing wafer plating time and increasing throughput. However, it is the integration of the photoimaging material and the subsequent plating chemistry that is essential in producing metallized structures for copper pillar and solder applications. Because the profile of the resist image is directly transferred during the electroplating process, it is critical to have a well formed image that is resistant to the plating chemistry. Plating bath contamination and resist strippability are other key factors in producing void-free, defect-free structures. Dow's newly introduced chemically amplified material is capable of film thicknesses from 30um to 80um by a single coating process with good uniformity. Imaging and process latitude are demonstrated at 40um and 65um thicknesses with emphasis on sidewall profiles and sensitivity. Further, the photoresist compatibility with INTERVIA™ Cu 8540 Electroplating Copper Chemistry is shown, along with NIKAL™ BP Ni plating chemistry and SOLDERON™ BP TS 6000 SnAg plating chemistry compatibility. The improvements in product line from Dow's INTERVIA™ Cu 8540 to INTERVIA™ 9000 Electroplating Copper Chemistry is also demonstrated in the paper, with thickness uniformity, high plating speed, and tunable morphology highlighted for various applications. The power of integration has enabled the development of this suite of products designed for compatibility and superior performance for advanced packaging technologies. ™ Trademark of The Dow Chemical Company

Fast Copper Plating Process for Through Silicon Via (TSV) Filling

2011 ◽  
Author(s):  
Su Wang ◽  
S. W. Ricky Lee
Keyword(s):  
Integrated Circuits ◽  
Cross Sections ◽  
Three Dimensional ◽  
Optical Microscope ◽  
Copper Plating ◽  
Ray Method ◽  
Plating Bath ◽  
Bottom Up ◽  
Electroplating Process ◽  
Filling Mechanism

There is an increasing demand for electronic devices with smaller sizes, higher performance and increased functionality. The development of vertical interconnects or through silicon vias (TSV) may be one of the most promising approaches to provide the three-dimensional (3D) integration of integrated circuits (IC). It is possible to improve the system’s performance with shorter RC delay, shorter signal paths and less power consumption. Electroplating process is one of the major contributors to the cost of TSV. Thus, plating time is one of our major concerns in TSV applications. About 80% of the TSVs are filled with copper due to its high conductivity and wide applications in multilayer wiring. Even though the electroplating of copper for interconnections is well established for the copper damascene micro-fabrication process, it has been shown that the filling of TSVs with copper plating is a different situation due to the much larger dimensions of TSVs. Generally the filling mechanism consists of conformal plating and bottom up plating. A 100% bottom up filling is preferred for copper filling in TSV. A seam may exist in via if the majority of filling mechanism is conformal plating. Thus, the bottom up filling profile is one the critical points to achieve void free filling. In this study, the void free copper filling TSVs with diameter from 10–30 m and depth from 50–150 m will be investigated by copper electroplating. A near 100% bottom up plating formula was developed in order to achieve void free and seam free filling. Filling performance of this plating formula was evaluated by examining vertical cross-sections and top-down cross-section of the filled TSVs using optical microscope and X-ray method. Pretreatment process and relationship with diffusion time will be also studied with respect to the TSV plating process. The effect of concentration of copper, acid and additives will be optimized to achieve the desired bottom up plating process. The ultimate goal is to achieve TSV plating with shorter plating time and better consistency. Electroplating experiment was conducted with an industrial electroplating tool. Successful plating results are demonstrated with optimized plating bath and plating mechanism. The void free and seam free copper deposition results are shown with minimized overburden. The time taken for the plating process is also greatly reduced with this near 100% bottom up plating formula. The benefits of this novel plating mechanism will be discussed in detail in this paper.

scholarly journals Surface Forming Criteria of Ti-6AL-4V Titanium Alloy under Laser Loading

2021 ◽  
Vol 11 (12) ◽  
pp. 5406
Author(s):  
Fei Yin ◽  
Xia Ye ◽  
Hongbing Yao ◽  
Pengyu Wei ◽  
Xumei Wang ◽  
...  
Keyword(s):  
Titanium Alloy ◽  
Surface Morphology ◽  
High Speed ◽  
Yttrium Aluminum Garnet ◽  
Laser Energy ◽  
Target Material ◽  
Nanosecond Laser ◽  
Laser Shock ◽  
Shock Condition ◽  
Key Factor

In order to study the spallation phenomenon of titanium alloy under the shock of nanosecond laser, the Neodymium-Yttrium-Aluminum Garnet laser was used to carry out laser shock experiments on the surface of titanium alloy. By observing and measuring the surface morphology of the target material, the forming factors and the changes of the surface morphology under different parameter settings, the forming criteria of the titanium alloy were obtained. The results show that under the single variable method, the change of laser energy can affect the target shape variable, and there is a positive correlation between them. When the thickness was greater than or equal to 0.08 mm, no obvious cracks were found in the targets. Moreover, the number of impact times was the key factor for the target deformation; with the growth of impact times, the target deformation gradually became larger until the crack appeared. The larger the diameter of the spot, the more likely the target was to undergo plastic deformation. The surface of titanium alloy with a thickness of 0.08 mm appeared to rebound under specific laser shock condition. The changes in the back of the target material were observed in real time through a high-speed camera, and the plasma induced by the laser was observed in the process. This study is based on the results of previous studies to obtain the titanium alloy forming criteria, which provides a basis for the setting of laser parameters and the thickness of the target when the nanosecond laser impacts the Ti-6AL-4V target.

scholarly journals Randomized scheduling algorithm for virtual output queuing switch at the presence of non-uniform traffic

2019 ◽  
Vol 8 (1) ◽  
pp. 50
Author(s):  
Ali Ghiasian ◽  
Majid Jamali
Keyword(s):  
Randomized Algorithms ◽  
High Speed ◽  
Time Slot ◽  
Scheduling Algorithm ◽  
Superior Performance ◽  
High Complexity ◽  
Maximum Weight ◽  
Switch Architecture ◽  
Simulation Results ◽  
Maximum Weight Matching

<span>Virtual Output Queuing (VOQ) is a well-known queuing discipline in data switch architecture that eliminates Head Of Line (HOL) blocking issue. In VOQ scheme, for each output port, a separate FIFO is maintained by each input port. Consequently, a scheduling algorithm is required to determine the order of service to virtual queues at each time slot. Maximum Weight Matching (MWM) is a well-known scheduling algorithm that achieves the entire throughput region. Despite of outstanding attainable throughput, high complexity of MWM makes it an impractical algorithm for implementation in high-speed switches. To overcome this challenge, a number of randomized algorithms have been proposed in the literature. But they commonly perform poorly when input traffic does not uniformly select output ports. In this paper, we propose two randomized algorithms that outperform the well-known formerly proposed solutions. We exploit a method to keep a parametric number of heavy edges from the last time matching and mix it by randomly generated matching to produce a new schedule. Simulation results confirm the superior performance of the proposed algorithms.</span>

scholarly journals Development of High Speed Black Electroplating Process

1991 ◽  
Vol 77 (8) ◽  
pp. 1344-1351 ◽  
Author(s):  
Katsushi SAITO ◽  
Yujiro MIYAUCHI ◽  
Kazumi SHIBATA
Keyword(s):  
High Speed ◽  
Electroplating Process

Analysis of High-Speed Electrical Generators for Utility Applications

2013 ◽  
Author(s):  
Miroslav P. Petrov
Keyword(s):  
Electricity Generation ◽  
High Speed ◽  
Renewable Energy Sources ◽  
Scale Up ◽  
Energy Utilization ◽  
Superior Performance ◽  
Electricity Production ◽  
Small Scale ◽  
Technical Challenges ◽  
Compact Design

High-speed alternators are believed to be well developed nowadays, following the improvement in performance and decrease of costs for electronic power converters and permanent magnet materials. Their compact design and their ability to vary the rotational speed in off-design conditions promise superior performance when compared to conventional generators. High-speed alternators are only available in limited sizes for small-scale applications, whereas improvements in efficiency and optimized part-load behavior are particularly important especially for small-scale electricity generation. Enhanced energy utilization for electricity production by small utility plants or by distributed units located at private homes or commercial buildings, based on thermodynamic cycles powered by natural gas or various renewable energy sources, is possible to be achieved through a wider application of grid-integrated high-speed technology. This study presents a critical review of previous research and demonstration work on high-speed electrical machines and a summary of the technical challenges limiting their performance and their expansion into larger sizes. Conclusions are drawn for finding appropriate solutions for practical high-speed electricity generation units and their readiness for a much wider deployment. Closer analysis is attempted on the thermal and mechanical integrity of high-speed alternators and the technical challenges that slow down their scale-up to MW-size units for utility applications. The necessary research and development work that needs to be done in the near future is outlined and discussed herein.

Optimization of High-Speed Electrolytic Plating of Copper Pillar to Achieve a Flat Top Morphology and Height Uniformity

2020 ◽  
Vol 2020 (1) ◽  
pp. 000150-000155
Author(s):  
Raihei Ikumoto ◽  
Yuki Itakura ◽  
Shinji Tachibana ◽  
Hisamitsu Yamamoto
Keyword(s):  
Polarization Curve ◽  
High Speed ◽  
Organic Additive ◽  
Additive Concentration ◽  
Plating Bath ◽  
Pillar Height ◽  
Large Size ◽  
Cu Pillar ◽  
The Ideal

Abstract Cu plating bath for high-speed electrodeposition of Cu pillar was designed in consideration of a flat top morphology of pillar and a pillar height uniformity. An ideal polarization curve was assumed for the flat top morphology. To obtain the ideal polarization curve, an effect of organic additive concentration and solution agitation on the polarization curve were investigated. The basic bath components were optimized considering a Wagner number to improve pillar height uniformity. To confirm the pillar top morphology and the pillar height uniformity, a 300 mm diameter wafer was plated with Cu at 20 A/dm2. As a result, improved pillar top morphology and pillar height uniformity were obtained. The optimized plating bath was applied to the plating of large-size panel of 415 × 510 mm.

How to balance interfirm relationships? A case from high-speed railway industry

2020 ◽  
Vol 35 (11) ◽  
pp. 1785-1799 ◽  
Author(s):  
Na Zhang ◽  
Xiaopeng Deng ◽  
Bon-Gang Hwang ◽  
Yanliang Niu
Keyword(s):  
High Speed ◽  
Superior Performance ◽  
Interfirm Relationships ◽  
High Speed Railway ◽  
Content Type ◽  
Railway Industry ◽  
Interfirm Cooperation ◽  
Relationship Structures ◽  
Interfirm Competition

Purpose Balancing interfirm relationships is important for firms’ long-term superior performance. However, prior studies mainly focus on interfirm competition or interfirm cooperation separately, ignoring the balance of interfirm relationships. To bridge this gap in knowledge, this study aims to develop a framework to evaluate the balance of interfirm competition and interfirm cooperation and propose strategies to optimize a firm’s interfirm relationships. Design/methodology/approach After an in-depth literature review, a framework was developed for evaluating and optimizing the interfirm relationships. Taking the high-speed railway industry as an example, the proposed framework was implemented. Findings The results of the case confirm that the balancing of interfirm relationships can lead to more superior firm performance. Also, rather than mutual suppression, the interfirm competition and interfirm cooperation present a roughly positive relationship. Originality/value This study would contribute to the existing knowledge body by developing a framework for balancing interfirm relationships. Also, this study can aid practitioners in evaluating and optimizing their interfirm relationship structures.

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