Embedding Active and Passive Devices in Medical Electronics

Efforts to increase the packaging efficiency of microelectronic systems have been extensive and continuous over the past few decades. Evidence of this can be seen even before the expansion of the space program by the United States in 1961 and the race to the moon; one of the first settings where size was truly limited and miniaturization of electronics was a necessity. In the 1950's the world saw its first major size reduction of electronic component with the phase out of the vacuum tube in favor of the transistor. The transistor saw its first major commercial use in 1952 via hybrid vacuum tube transistor technology. While many industries benefitted from the shift, in 1954 the hearing aid industry specifically experienced major improvements owing to the implementation of transistors, becoming smaller, requiring less power and having better functionality. The first 4-transistor AM radio product followed shortly thereafter. Much of today's effort since 1978 has been driven by the telecommunications industry that has succeeded in reducing cell phone size while simultaneously increasing functionality. Just as in the 1950's, hearing aid technology continues to be at the forefront when it comes to miniaturization. The hearing aid business has always had the need to use extremely small electronic packaging. The first completely in the canal (CIC) hearing aids were produced in 1993 and required all electronic components to be small enough that they fit entirely inside the ear canal. The introduction of wireless systems into hearing aids has sharply increased component count. Due to the size and shape of a multitude of types of hearing aids, flexible circuits need to be folded and bent to fit inside hearing aid cases, with essentially all available space being used. More powerful processors and more memory are enabling sophisticated algorithms that are able to greatly improve sound quality. There is also a strong market desire to add more features to hearing products while at the same time making them smaller and less visible. The latest hearing aids have succeeded in the later demand, constructed so small they are not visible and consequently are called invisible in the canal (IIC). In order to continue meeting the markets want for smaller and more features, a new packaging method needed to be developed. One such option is embedded die packaging. This paper will examine the use of embedded die packaging (or chip-in-flex) to drive significant further size reduction in custom and standard hearing instruments over what can be achieved using chip-on-flex or traditional ceramic hybrid based technologies. The historical drivers, available circuit board technologies, use of integrated passive devices, performance improvement, size reduction, device reliability, changes in supply chain, impact on wafer test, impact on device test, and challenges of working with wafers instead of die will be discussed.