The Continued Adoption of ZiBond and DBI in Volume Applications
2013 ◽
Vol 2013
(DPC)
◽
pp. 1-46
Abstract not available. Outline: Company Background; Intellectual Property Status; Homogeneous Direct Bond (ZiBond) Technology; Hetergeneous Direct Bond (DBI) Technology; Wafer to Wafer (W2W) Applications; Implementation; and Summary
2002 ◽
Vol 12
(1)
◽
pp. 4-9
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