Thermal Stresses in SOFC Stacks: The Role of Mismatch Among Thermal Conductivity of Adjacent Components

2021 ◽  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Stresses ◽  
Sofc Stacks

Lattice Thermal Conductivity Modelling of a Diatomic Nanoscale Material

2020 ◽  
Vol 10 (5) ◽  
pp. 602-609
Author(s):  
Adil H. Awad
Keyword(s):  
Thermal Conductivity ◽  
Lattice Thermal Conductivity ◽  
Phonon Scattering ◽  
Correction Term ◽  
Nanoscale Material ◽  
New Approach ◽  
Two Samples ◽  
Conductivity Modelling ◽  
Callaway Model

Introduction: A new approach for expressing the lattice thermal conductivity of diatomic nanoscale materials is developed. Methods: The lattice thermal conductivity of two samples of GaAs nanobeam at 4-100K is calculated on the basis of monatomic dispersion relation. Phonons are scattered by nanobeam boundaries, point defects and other phonons via normal and Umklapp processes. Methods: A comparative study of the results of the present analysis and those obtained using Callaway formula is performed. We clearly demonstrate the importance of the utilised scattering mechanisms in lattice thermal conductivity by addressing the separate role of the phonon scattering relaxation rate. The formulas derived from the correction term are also presented, and their difference from Callaway model is evident. Furthermore their percentage contribution is sufficiently small to be neglected in calculating lattice thermal conductivity. Conclusion: Our model is successfully used to correlate the predicted lattice thermal conductivity with that of the experimental observation.

The effect of variable properties and rotation in a visco-thermoelastic orthotropic annular cylinder under the Moore–Gibson–Thompson heat conduction model

2021 ◽  
pp. 146442072098589
Author(s):  
Ahmed E Aboueregal ◽  
Hamid M Sedighi
Keyword(s):  
Thermal Conductivity ◽  
Thermal Stresses ◽  
Thermal Conductivity Coefficient ◽  
Variable Properties ◽  
Transformation Technique ◽  
Present Contribution ◽  
Conduction Model ◽  
Thermoelastic Model ◽  
Shock Heating ◽  
Physical Fields

The present contribution aims to address a problem of thermoviscoelasticity for the analysis of the transition temperature and thermal stresses in an infinitely circular annular cylinder. The inner surface is traction-free and subjected to thermal shock heating, while the outer surface is thermally insulated and free of traction. In this work, in contrast to the various problems in which the thermal conductivity coefficient is considered to be fixed, this parameter is assumed to be variable depending on the temperature change. The problem is studied by presenting a new generalized thermoelastic model of thermal conductivity described by the Moore–Gibson–Thompson equation. The new model can be constructed by incorporating the relaxation time thermal model with the Green–Naghdi type III model. The Laplace transformation technique is used to obtain the exact expressions for the radial displacement, temperature and the distributions of thermal stresses. The effects of angular velocity, viscous parameter, and variance in thermal properties are also displayed to explain the comparisons of the physical fields.

Role of electron–phonon coupling in thermal conductivity of metallic nanofluids

2019 ◽  
Vol 52 (48) ◽  
pp. 485302 ◽  
Author(s):  
Dong-Xing Song ◽  
Yu-Feng Zhang ◽  
Wei-Gang Ma ◽  
Xing Zhang
Keyword(s):  
Thermal Conductivity ◽  
Phonon Coupling ◽  
Electron Phonon Coupling

Role of graphene waviness on the thermal conductivity of graphene composites

2012 ◽  
Vol 111 (1) ◽  
pp. 221-225 ◽  
Author(s):  
Ke Chu ◽  
Wen-sheng Li ◽  
Hongfeng Dong
Keyword(s):  
Thermal Conductivity

Development of a Compliant Nanothermal Interface Material

2011 ◽  
Author(s):  
David Shaddock ◽  
Stanton Weaver ◽  
Ioannis Chasiotis ◽  
Binoy Shah ◽  
Dalong Zhong
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Thermal Stresses ◽  
Performance Testing ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Bondline Thickness ◽  
Interface Materials

The power density requirements continue to increase and the ability of thermal interface materials has not kept pace. Increasing effective thermal conductivity and reducing bondline thickness reduce thermal resistance. High thermal conductivity materials, such as solders, have been used as thermal interface materials. However, there is a limit to minimum bondline thickness in reducing resistance due to increased fatigue stress. A compliant thermal interface material is proposed that allows for thin solder bondlines using a compliant structure within the bondline to achieve thermal resistance <0.01 cm2C/W. The structure uses an array of nanosprings sandwiched between two plates of materials to match thermal expansion of their respective interface materials (ex. silicon and copper). Thin solder bondlines between these mating surfaces and high thermal conductivity of the nanospring layer results in thermal resistance of 0.01 cm2C/W. The compliance of the nanospring layer is two orders of magnitude more compliant than the solder layers so thermal stresses are carried by the nanosprings rather than the solder layers. The fabrication process and performance testing performed on the material is presented.

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