scholarly journals Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution

10.3791/59376 ◽  
2019 ◽  
Author(s):  
Toshiaki Koga ◽  
Yoshitaro Sakata ◽  
Nao Terasaki
Keyword(s):  
Copper Sulfate ◽  
Plating Solution ◽  
Cuprous Ions

Quenching characteristics of bathocuproinedisulfonic acid, disodium salt in aqueous solution and copper sulfate plating solution

2018 ◽  
Vol 57 (4S) ◽  
pp. 04FL04 ◽  
Author(s):  
Toshiaki Koga ◽  
Chieko Hirakawa ◽  
Michinori Takeshita ◽  
Nao Terasaki
Keyword(s):  
Aqueous Solution ◽  
Copper Sulfate ◽  
Disodium Salt ◽  
Plating Solution

Control of Accumulation of Cu(I) in Copper Sulfate Electroplating Plating Solution

2017 ◽  
Vol 75 (35) ◽  
pp. 15-20 ◽  
Author(s):  
Toshiaki Koga ◽  
Chieko Hirakawa ◽  
Yoshitaro Sakata ◽  
Hiroaki Noma ◽  
Kazuhiro Nonaka ◽  
...  
Keyword(s):  
Copper Sulfate ◽  
Plating Solution

Detection of Cu (I) in Copper Sulfate Plating Solution Using BCS Fluorescence

2017 ◽  
Author(s):  
T. Koga ◽  
C. Hirakawa ◽  
M. Takeshita ◽  
N. Terasaki
Keyword(s):  
Copper Sulfate ◽  
Plating Solution

Fate and forms of Cu in a reservoir ecosystem following copper sulfate treatment (Saint Germain les Belles, France)

2003 ◽  
Vol 107 ◽  
pp. 1333-1336 ◽  
Author(s):  
E. Van Hullebusch ◽  
P. Chatenet ◽  
V. Deluchat ◽  
P. M. Chazal ◽  
D. Froissard ◽  
...  
Keyword(s):  
Copper Sulfate
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