scholarly journals STUDI KONDUKTIVITAS ELEKTROLIT POLIMER KITOSAN/PVA+KOH

2011 ◽  
Vol 1 (2) ◽  
pp. 13-17
Author(s):  
R.Putri ◽  
A.Maddu ◽  
Irzaman
Keyword(s):  
Thermal Analysis ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Ionic Conductivity ◽  
Polyvinyl Alcohol ◽  
Polymer Electrolyte ◽  
Potassium Hydroxide ◽  
Room Temperature ◽  
Casting Technique

The blend-based polymer electrolyte consisting of chitosan and polyvinyl alcohol (PVA) as host polymers and potassium hydroxide (KOH) as the complexing salt was studied. Polymerelectrolyte were obtained by the casting technique. An attempt was also made to investigate the effect of TiO2 concentration in the chitosan/PVA+KOH polymer electrolyte. The best ionic conductivity values of 1,105 x 10-2 S cm-1 at room temperature were obtained for the sample containing 35%wt of KOH and 1,210 x 10-2 S cm-1 for the sample containing 50% wt TiO2. The polymer electrolyte with good ionic conductivity properties were characterized by thermal analysis (DSC). The glass transition temperature about 75.30 °C for the optimum Chitosan/PVA+KOH

scholarly journals Thermal analysis: basic concept of differential scanning calorimetry and thermogravimetry for beginners

2020 ◽  
Vol 0 (0) ◽  
Author(s):  
Nurul Fatahah Asyqin Zainal ◽  
Jean Marc Saiter ◽  
Suhaila Idayu Abdul Halim ◽  
Romain Lucas ◽  
Chin Han Chan
Keyword(s):  
Thermal Analysis ◽  
Differential Scanning Calorimetry ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Commercial Application ◽  
Scanning Calorimetry ◽  
Teaching Activities ◽  
Sample Decomposition ◽  
Calibration Baseline

AbstractWe present an overview for the basic fundamental of thermal analysis, which is applicable for educational purposes, especially for lecturers at the universities, who may refer to the articles as the references to “teach” or to “lecture” to final year project students or young researchers who are working on their postgraduate projects. Description of basic instrumentation [i.e. differential scanning calorimetry (DSC) and thermogravimetry (TGA)] covers from what we should know about the instrument, calibration, baseline and samples’ signal. We also provide the step-by-step guides for the estimation of the glass transition temperature after DSC as well as examples and exercises are included, which are applicable for teaching activities. Glass transition temperature is an important property for commercial application of a polymeric material, e.g. packaging, automotive, etc. TGA is also highlighted where the analysis gives important thermal degradation information of a material to avoid sample decomposition during the DSC measurement. The step-by-step guides of the estimation of the activation energy after TGA based on Hoffman’s Arrhenius-like relationship are also provided.

Silk Polymer Coating with Low Dielectric Constant and High Thermal Stability for Ulsi Interlayer Dielectric

1997 ◽  
Vol 476 ◽  
Author(s):  
P. H. Townsend ◽  
S. J. Martin ◽  
J. Godschalx ◽  
D. R. Romer ◽  
D. W. Smith ◽  
...  
Keyword(s):  
Thin Film ◽  
Dielectric Constant ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Integrated Circuits ◽  
Room Temperature ◽  
Polymer Network ◽  
Flow Characteristics ◽  
Interlayer Dielectric

AbstractA novel polymer has been developed for use as a thin film dielectric in the interconnect structure of high density integrated circuits. The coating is applied to the substrate as an oligomeric solution, SiLK*, using conventional spin coating equipment and produces highly uniform films after curing at 400 °C to 450 °C. The oligomeric solution, with a viscosity of ca. 30 cPs, is readily handled on standard thin film coating equipment. Polymerization does not require a catalyst. There is no water evolved during the polymerization. The resulting polymer network is an aromatic hydrocarbon with an isotropie structure and contains no fluorine.The properties of the cured films are designed to permit integration with current ILD processes. In particular, the rate of weight-loss during isothermal exposures at 450 °C is ca. 0.7 wt.%/hour. The dielectric constant of cured SiLK has been measured at 2.65. The refractive index in both the in-plane and out-of-plane directions is 1.63. The flow characteristics of SiLK lead to broad topographic planarization and permit the filling of gaps at least as narrow as 0.1 μm. The glass transition temperature for the fully cured film is greater than 490 °C. The coefficient of thermal expansivity is 66 ppm/°C below the glass transition temperature. The stress in fully cured films on Si wafers is ca. 60 MPa at room temperature. The fracture toughness measured on thin films is 0.62 MPa m ½. Thin coatings absorb less than 0.25 wt.% water when exposed to 80% relative humidity at room temperature.

The Effect of Thermal History on Porcelain Expansion Behavior

1989 ◽  
Vol 68 (9) ◽  
pp. 1313-1315 ◽  
Author(s):  
C.W. Fairhurst ◽  
D.T. Hashinger ◽  
S.W. Twiggs
Keyword(s):  
Thermal Expansion ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Heating Rate ◽  
Room Temperature ◽  
Heating Rates ◽  
Thermal Expansion Data ◽  
Temperature Range ◽  
Expansion Behavior

Porcelain-fused-to-metal restorations are fired several hundred degrees above the glass-transition temperature and cooled rapidly through the glass-transition temperature range. Thermal expansion data from room temperature to above the glass-transition temperature range are important for the thermal expansion of the porcelain to be matched to the alloy. The effect of heating rate during measurement of thermal expansion was determined for NBS SRM 710 glass and four commercial opaque and body porcelain products. Thermal expansion data were obtained at heating rates of from 3 to 30°C/min after the porcelain was cooled at the same rate. By use of the Moynihan equation (where Tg systematically increases in temperature with an increase in cooling/heating rate), the glass-transition temperatures (Tg) derived from these data were shown to be related to the heating rate.

A carbon nanotube–epoxy interface improved damping below the glass transition temperature

RSC Advances ◽  
2016 ◽  
Vol 6 (25) ◽  
pp. 21271-21276 ◽  
Author(s):  
Yung-Chi Chu ◽  
Ming-Hsiao Weng ◽  
Wen-Yi Lin ◽  
Hsin-Jung Tsai ◽  
Wen-Kuang Hsu
Keyword(s):  
Glass Transition ◽  
Carbon Nanotube ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Room Temperature ◽  
Viscous Drag

Composites made from fibers and epoxy display a low viscous drag and are rarely used as mechanical dampers at room temperature.

Identification of Elastomers in Tire Sections by Total Thermal Analysis. III. White Sidewall Compounds of Neoprene Rubber Blends

1975 ◽  
Vol 48 (4) ◽  
pp. 640-652 ◽  
Author(s):  
A. K. Sircar ◽  
T. G. Lamond
Keyword(s):  
Thermal Analysis ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Exothermic Reaction ◽  
Crosslinking Reaction ◽  
Rubber Blends ◽  
Tg And Dtg ◽  
Dsc Curves ◽  
Residual Weight

Abstract DSC curves of sulfur-cured CR differ from peroxide-cured vulcanizates in the shape of the exotherm and the peak temperatures. The exothermic reaction, attributed to dehydrochlorination and subsequent crosslinking, is accelerated by sulfur. TG and DTG curves support this contention. In blends with NR, BR, or SBR, the second polymer intervenes in the crosslinking reaction, resulting in a lower residual weight for the CR network. White sidewall compounds of NR/CR or NR/CR/CSM can be identified by their DSC peaks in nitrogen, glass transition temperature, and DTG peaks. DSC and thermogravimetric curves supplement each other in the identification of these elastomers.

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