scholarly journals Parametric study on the rotation capacity of stiffened end-plate beam-to-column connection

2014 ◽  
Vol 13 (3) ◽  
pp. 267-274 ◽  
Author(s):  
Krzysztof Ostrowski ◽  
Aleksander Kozłowski

Rotation capacity is one of the joint parameters needed to be taken into account of the real joint behaviour in a global analysis. It has a special influence on the plastic design of steel frames. The results of the parametric study of the stiffened bolted end-plate beam-to-column connection have been presented in the paper. The main investigated parameters are: thickness of end plate “tp”, horizontal bolt spacing “w” and distance of the bolt to plate edge “cg1”. The analysis was performed with the use of finite element method, based on the numerical experiment plan.

2015 ◽  
Vol 77 (16) ◽  
Author(s):  
T. Y. Taher ◽  
M. M. Tahir ◽  
A. Sulaiman ◽  
S. P. Ngian ◽  
A. Saggaff

Steel frames can be designed as simple, semi-continuous, and continuous construction. However, these types of constructions depend on the type of connections used. Connections are usually classified in design as pinned which is associated with simple construction or rigid which is associated with continuous construction. However, the actual behaviour in most cases is classified as semi-rigid connections or partial strength. The semi-rigid connections usually associated with the stiffness of the connection while the strength of this connection usually associated with partial strength. The use of semi-rigid connection has been encouraged by Euro-code 3 and studies on the matter known as semi-continuous construction have proven that substantial savings in steel weight of the overall construction. A series of parametric studies on two bays of two, four, six, and eight storey of multi-storey braced steel frame are presented in this paper. All frames are designed using S275 steel and flush end-plate connection was used as connection for semi-continuous construction whereas fin plate connection was used for simple construction. The frames are designed both as simple construction and semi-continuous construction and the steel weight of the frames was calculated and compared. From the parametric study it was found that by using partial strength connection the saving in steel weight of the frames is in the range of 11.5% to 22.5% of the total steel weight of the frames.


2014 ◽  
Vol 4 (4) ◽  
pp. 26-33
Author(s):  
P.Deepak Kumar ◽  
◽  
Ishan Sharma ◽  
P.R. Maiti ◽  
◽  
...  

Author(s):  
Ah-Young Park ◽  
Satish Chaparala ◽  
Seungbae Park

Through-silicon via (TSV) technology is expected to overcome the limitations of I/O density and helps in enhancing system performance of conventional flip chip packages. One of the challenges for producing reliable TSV packages is the stacking and joining of thin wafers or dies. In the case of the conventional solder interconnections, many reliability issues arise at the interface between solder and copper bump. As an alternative solution, Cu-Cu direct thermo-compression bonding (CuDB) is a possible option to enable three-dimension (3D) package integration. CuDB has several advantages over the solder based micro bump joining, such as reduction in soldering process steps, enabling higher interconnect density, enhanced thermal conductivity and decreased concerns about intermetallic compounds (IMC) formation. Critical issue of CuDB is bonding interface condition. After the bonding process, Cu-Cu direct bonding interface is obtained. However, several researchers have reported small voids at the bonded interface. These defects can act as an initial crack which may lead to eventual fracture of the interface. The fracture could happen due to the thermal expansion coefficient (CTE) mismatch between the substrate and the chip during the postbonding process, board level reflow or thermal cycling with large temperature changes. In this study, a quantitative assessment of the energy release rate has been made at the CuDB interface during temperature change finite element method (FEM). A parametric study is conducted to analyze the impact of the initial crack location and the material properties of surrounding materials. Finally, design recommendations are provided to minimize the probability of interfacial delamination in CuDB.


2014 ◽  
Vol 48 (3) ◽  
pp. 923-940 ◽  
Author(s):  
M. Bahaaddini ◽  
P. C. Hagan ◽  
R. Mitra ◽  
B. K. Hebblewhite

Author(s):  
Si-zhu Zhou ◽  
Jacob Jen-Gwo Chen

Taking a multibody system of the oil field pumping unit into a multibody elastic system, this paper analyzes its kinematics and dynamics by means of finite element method, deduces the kinematics and dynamics function after doing the element’s and global analysis, and puts forward the procedures of this method, i.e., (1) dividing the system into elements; (2) calculating for the elements; (3) calculating the matrix of external force; (4) piling the element stiffness and mass matrixes up; and (5) solving the function. As an example, this paper illustrates the process of analyzing the multibody system of a PUMPING UNIT used in an oil field.


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