Solid wood panelling and cladding - Characteristics, requirements and marking

Untersuchungen zum Diffusionswiderstand von Holzwerkstoffen | Diffusion resistance of timber materials

Schweizerische Zeitschrift fur Forstwesen ◽

10.3188/szf.2005.0100 ◽

2005 ◽

Vol 156 (3-4) ◽

pp. 100-103

Author(s):

Rudolf Popper ◽

Peter Niemz ◽

Gerhild Eberle

Keyword(s):

Relative Humidity ◽

Water Vapour ◽

Middle Lamella ◽

Solid Wood ◽

Diffusion Resistance ◽

Water Vapour Diffusion ◽

Wood Panels ◽

Vapour Diffusion ◽

Wet Climate ◽

Panel Thickness

The water vapour diffusion resistance of timber materials were tested in a wet climate (relative humidity ranging from 100%to 65% at 20 °C) and in a dry climate (relative humidity ranging from 0% to 65% and from 0% to 35% at 20 °c) with variation by relative humidity and vapour pressure gradient. The diffusion resistance of multilayer solid wood panels lies under or within the range of the solid wood (spruce), tending even to a lower range. This can be attributed to the loosely inserted middle lamella of the used solid wood panels, which were not correctly glued by the manufacturer. The diffusion resistance of the solid wood panels increases with decreasing moisture content and decreasing panel thickness, as well as with increasing water vapour gradient from 818 to 1520 Pa. There were clear differences between the tested timber materials. The diffusion resistance of particle composites is strongly dependent on the specific gravity. Due to laminar particles OSBs(Oriented Strand Boards) have a larger diffusion resistance than chipboards. The water vapour diffusion resistance of OSBs lies within the range of plywood.

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