Adhesives. T-peel test for flexible-to-flexible bonded assemblies

2010 ◽  
Keyword(s):  
Peel Test

Aramid-HDPE Composites: Influence of Interface Adhesion Measured by T-peel Test on Tensile Properties

2014 ◽  
Vol 56 (5) ◽  
pp. 369-374
Author(s):  
Aylin Bekem ◽  
Mustafa Dogu ◽  
Zafer Gemici ◽  
Ahmet Unal ◽  
Mehmet Hilmi Guler
Keyword(s):  
Tensile Properties ◽  
Peel Test ◽  
Interface Adhesion

A Study of the Floating Roller Peel Test for Adhesives.

1987 ◽  
Author(s):  
R. D. Kemp ◽  
Robert A. Brockman ◽  
Gregory J. Stenger
Keyword(s):  
Peel Test

scholarly journals An Assessment of Surface Treatments for Adhesion of Polyimide Thin Films

Polymers ◽  
2021 ◽  
Vol 13 (12) ◽  
pp. 1955
Author(s):  
Marco Cen-Puc ◽  
Andreas Schander ◽  
Minerva G. Vargas Gleason ◽  
Walter Lang
Keyword(s):  
Flexible Electronics ◽  
Oxygen Plasma ◽  
Reactive Ion Etching ◽  
Peel Test ◽  
Scratch Test ◽  
Peel Strength ◽  
Surface Treatments ◽  
Oxygen Plasma Treatment ◽  
Polyimide Films ◽  
Ion Etching

Polyimide films are currently of great interest for the development of flexible electronics and sensors. In order to ensure a proper integration with other materials and PI itself, some sort of surface modification is required. In this work, microwave oxygen plasma, reactive ion etching oxygen plasma, combination of KOH and HCl solutions, and polyethylenimine solution were used as surface treatments of PI films. Treatments were compared to find the best method to promote the adhesion between two polyimide films. The first selection of the treatment conditions for each method was based on changes in the contact angle with deionized water. Afterward, further qualitative (scratch test) and a quantitative adhesion assessment (peel test) were performed. Both scratch test and peel strength indicated that oxygen plasma treatment using reactive ion etching equipment is the most promising approach for promoting the adhesion between polyimide films.

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