Attachment materials for electronic assembly

2002 ◽  
Keyword(s):  
Electronic Assembly

scholarly journals An Interactive System for Scheduling Jobs in Electronic Assembly

2000 ◽  
Vol 16 (6) ◽  
pp. 450-459 ◽  
Author(s):  
J. Smed ◽  
T. Johtela ◽  
M. Johnsson ◽  
M. Puranen ◽  
O. Nevalainen
Keyword(s):  
Interactive System ◽  
Electronic Assembly

Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al

2012 ◽  
Vol 41 (7) ◽  
pp. 1868-1881 ◽  
Author(s):  
Adam J. Boesenberg ◽  
Iver E. Anderson ◽  
Joel L. Harringa
Keyword(s):  
Electronic Assembly

Ink-jetting for Electronic Assembly

2010 ◽  
Vol 2010 (1) ◽  
pp. 000929-000934
Author(s):  
Georg Meyer-Berg ◽  
Gottfried Beer ◽  
Klaus Pressel
Keyword(s):  
Void Formation ◽  
Experimental Results ◽  
Special Focus ◽  
Electronic Assembly ◽  
Filler Size ◽  
Die Attach ◽  
Ink Jet ◽  
The Future

We report experimental results on applying ink-jetting to dedicated system-in-package technologies. Special focus is on die-attach, vertical and horizontal interconnects. Our experiments on die attach experiments demonstrate that today we have still too high expenses to adapt materials, filler size and viscosity. The filling experiments of 150μm diameter vertical through encapsulant vias for package-on-package applications with ink-jetting showed void formation, which requires still smaller ink jet drops in the future. For formation of horizontal interconnects, e.g. for rerouting, by ink-jetting we observe that a functionalization of the surfaces e.g. with plasma or sulfur acid is required. Based on these project results and experience we suggest a roadmap for ink-jetting using parallel nozzles and single nozzles.

scholarly journals Application of Bernoulli Process-Based Charts to Electronic Assembly

10.5772/60758 ◽  
2015 ◽  
Vol 7 ◽  
pp. 14
Author(s):  
Darja Noskievičová ◽  
Eva Jarošová ◽  
Kateřina Brodecká
Keyword(s):  
Bernoulli Process ◽  
Electronic Assembly
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