Metal-clad base materials for printed wiring boards. Copper-clad base materials

Mapping Intimacies ◽

10.3403/00210556u ◽

2015 ◽

Keyword(s):

Printed Wiring Boards ◽

Base Materials

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Metal-clad base materials for printed wiring boards

10.3403/00192020 ◽

1989 ◽

Keyword(s):

Printed Wiring Boards ◽

Base Materials

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Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits

10.3403/00209133u ◽

2015 ◽

Keyword(s):

Printed Wiring Boards ◽

Printed Circuits ◽

Base Materials ◽

Materials Used

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Special Articles: MCM Using Multi Layer Printed Wiring Boards, Organic Thin Film Multi Layer Printed Wiring Boards. Development of Base Materials and Packaging Technologies for MCM-L's.

Circuit Technology ◽

10.5104/jiep1986.8.465 ◽

1993 ◽

Vol 8 (6) ◽

pp. 465-470

Author(s):

Tadashi HIRAKAWA

Keyword(s):

Thin Film ◽

Organic Thin Film ◽

Printed Wiring Boards ◽

Base Materials

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Special Articles: New Technical Trends of Base Materials for Printed Wiring Boards. The Materials for High-Speed Processing.

Circuit Technology ◽

10.5104/jiep1986.8.105 ◽

1993 ◽

Vol 8 (2) ◽

pp. 105-109

Author(s):

Toshiyuki OHTORI ◽

Toshiro TAKEDA

Keyword(s):

High Speed ◽

Printed Wiring Boards ◽

Base Materials

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Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits

10.3403/00209121 ◽

1990 ◽

Keyword(s):

Printed Wiring Boards ◽

Printed Circuits ◽

Base Materials ◽

Materials Used

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Metal-clad base materials for printed wiring boards. Copper-clad base materials

10.3403/00210556 ◽

1990 ◽

Keyword(s):

Printed Wiring Boards ◽

Base Materials

Download Full-text

Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits

10.3403/00265098u ◽

2015 ◽

Keyword(s):

Printed Wiring Boards ◽

Printed Circuits ◽

Base Materials ◽

Materials Used

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Special Articles: New Technical Trends of Base Materials for Printed Wiring Boards. High Density and High Multilayer Materials.

Circuit Technology ◽

10.5104/jiep1986.8.99 ◽

1993 ◽

Vol 8 (2) ◽

pp. 99-104

Author(s):

Mitsuo YOKOTA

Keyword(s):

High Density ◽

Printed Wiring Boards ◽

Base Materials ◽

Multilayer Materials

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Special Articles: New Technical Trends of Base Materials for Printed Wiring Boards. Composite Materials, Special Materials.

Circuit Technology ◽

10.5104/jiep1986.8.122 ◽

1993 ◽

Vol 8 (2) ◽

pp. 122-127

Author(s):

Tatsuya ODA

Keyword(s):

Composite Materials ◽

Printed Wiring Boards ◽

Base Materials

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Special Articles: New Technical Trends of Base Materials for Printed Wiring Boards. High-Performance Heat-Resistant Materials.

Circuit Technology ◽

10.5104/jiep1986.8.115 ◽

1993 ◽

Vol 8 (2) ◽

pp. 115-121

Author(s):

Tokio YOSHIMITSU ◽

Eiichiro SAITO

Keyword(s):

High Performance ◽

Printed Wiring Boards ◽

Heat Resistant ◽

Base Materials

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