scholarly journals Noncontact and Full-Field Measurement of Residual and Thermal Stress in Film/Substrate Structures

Surfaces ◽  
2021 ◽  
Vol 4 (1) ◽  
pp. 89-96
Author(s):  
Dong Yang ◽  
Xumeng Zhang ◽  
Jianguo Zhu
Keyword(s):  
Thin Film ◽  
Thermal Stress ◽  
High Temperature ◽  
Correlation Method ◽  
Image Correlation ◽  
Full Field ◽  
3D Digital Image Correlation ◽  
Full Field Measurement ◽  
Curvature Measurement ◽  
Film Substrate

Residual stress and thermal stress of a film/substrate system are determined based on the curvature measurement with a 3D digital image correlation method (DIC) and calculation of the thin-film stresses by the extension of Stoney’s formula. A Ni film electroplated on a H62Cu plate is used to verify the proposed method. The full fields of nonuniform thin-film stresses are obtained in a room temperature to high-temperature environment of 200 °C, which can be potentially extended to higher temperatures. These results provide a fundamental approach to understanding thin-film stresses and a feasible measurement method for high temperature.

scholarly journals Strain determination of self-adhesive resin cement using 3D digital image correlation method

2018 ◽  
Vol 146 (7-8) ◽  
pp. 372-377 ◽  
Author(s):  
Aleksandra Mitrovic ◽  
Ivan Tanasic ◽  
Nenad Mitrovic ◽  
Milos Milosevic ◽  
Ljiljana Tihacek-Sojic ◽  
...  
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Correlation Method ◽  
Resin Cement ◽  
Image Correlation ◽  
Resin Cements ◽  
Adhesive Resin ◽  
Full Field ◽  
3D Digital Image Correlation ◽  
Dental Procedures

Introduction/Objective. In an attempt to simplify dental procedures, a new group of resin cements, self-adhesive resin cements (SARCs), have been introduced. Performance of SARCs can widely vary. One of the main reasons of adhesion failure is polymerization shrinkage. The aim of this study was to determine, evaluate, and measure strain field of self-adhesive dual cure resin cement during polymerization in self-cure mode using 3D digital image correlation (DIC) method. Methods. The self-adhesive Maxcem Elite (Kerr, Orange, CA, USA) cement was tested in five cylindrical samples (5 mm in diameter and 2 mm in thickness) prepared by filling plastic ring-type molds. Digital images were recorded immediately after sample preparation. Results. Non-uniform strain distribution was found in resin cement with higher strain values along the periphery (up to 15%) and lower strain values in central parts (around 4%) of each sample. Conclusion. It can be concluded that DIC is a powerful tool for full-field strain measurements in material characterization.

The Stress Intensity Factor of Opening Mode Determined by Digital Image Correlation

2011 ◽  
Vol 83 ◽  
pp. 54-59 ◽  
Author(s):  
Rui Zhang ◽  
Ling Feng He ◽  
Chang Rong Li
Keyword(s):  
Stress Intensity Factor ◽  
Stress Intensity ◽  
Digital Image Correlation ◽  
Intensity Factor ◽  
Digital Image ◽  
Correlation Method ◽  
Compact Tension ◽  
Image Correlation ◽  
Full Field ◽  
Opening Mode

Applications of the digital image correlation method (DIC) for the determination of the opening mode stress intensity factor (SIF) is investigated using an edge cracked aluminum plate in this paper. Standard compact tension test specimen was tested under tensile loading and the full-field displacement fields of the test sample were recorded using DIC. The SIF associated with unavoidable rigid-body displacement translation were calculated simultaneously from the experimental data by fitting the theoretical displacement field using the method of least-squares. Selection of displacement and convergence values is discussed. For validation, the SIF thus determined is compared with theoretical results, confirming the effectiveness and accuracy of the proposed technique. Therefore it reveals that the DIC is a practical and effective tool for full-field deformation and SIF measurement.

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