scholarly journals Potentials for Improvement of Resource Efficiency in Printed Circuit Board Manufacturing: A Case Study Based on Material Flow Cost Accounting

2017 ◽  
Vol 9 (6) ◽  
pp. 907 ◽  
Author(s):  
Yi-Xuan Wang ◽  
Chien-Hung Kuo ◽  
Rui Song ◽  
Allen Hu ◽  
Shu-Shen Zhang
Keyword(s):  
Material Flow ◽  
Printed Circuit Board ◽  
Cost Accounting ◽  
Resource Efficiency ◽  
Circuit Board ◽  
Printed Circuit ◽  
Printed Circuit Board Manufacturing

scholarly journals Decarbonization of Industrial Energy Systems: A Case Study of Printed Circuit Board manufacturing

2021 ◽  
Author(s):  
Carles Ribas Tugores ◽  
Gerald Birngruber ◽  
Jürgen Fluch ◽  
Angelika Swatek ◽  
Gerald Schweiger
Keyword(s):  
Printed Circuit Board ◽  
Energy Systems ◽  
Circuit Board ◽  
Printed Circuit ◽  
Printed Circuit Board Manufacturing ◽  
Industrial Energy

Process Improvement Using Design by Experiments

1994 ◽  
Author(s):  
Hsien-chen Li ◽  
Fuyau Lin
Keyword(s):  
Process Improvement ◽  
Manufacturing Process ◽  
Printed Circuit Board ◽  
Fractional Factorial Design ◽  
Time Budget ◽  
Fractional Factorial ◽  
Circuit Board ◽  
Printed Circuit ◽  
Printed Circuit Board Manufacturing

Abstract This paper present an approach to apply Design by Experiments for process improvement with the objectives to minimize cost and shorten investigation time. A case study of PCB (Printed Circuit Board) manufacturing process is chosen to illustrate this approach. A Fractional Factorial Design by Experiment was performed due to the constraints of the time, budget, and resources.

Application of Lock-in Thermography on PCB for Fault Localization and Validation of Failure Mechanism Due to External Discrete Component Variation

2010 ◽  
Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen
Keyword(s):  
Failure Mechanism ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Hot Spot ◽  
Circuit Board ◽  
Discrete Component ◽  
Printed Circuit ◽  
Thermal Signature ◽  
Lock In

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.

Temperature and Humidity Dependent Reliability Analysis of RGB LED Chips

2006 ◽  
Author(s):  
Jun-Xian Fu ◽  
Shukri Souri ◽  
James S. Harris
Keyword(s):  
Reliability Analysis ◽  
Printed Circuit Board ◽  
Light Emitting Diode ◽  
Circuit Board ◽  
Light Emitting ◽  
Printed Circuit ◽  
Root Cause ◽  
Micro Cracks ◽  
Temperature And Humidity

Abstract Temperature and humidity dependent reliability analysis was performed based on a case study involving an indicator printed-circuit board with surface-mounted multiple-die red, green and blue light-emitting diode chips. Reported intermittent failures were investigated and the root cause was attributed to a non-optimized reflow process that resulted in micro-cracks and delaminations within the molding resin of the chips.

PRINTED CIRCUIT BOARD MANUFACTURING AND TESTING OF RIMM™

1999 ◽  
Vol 09 (03) ◽  
pp. 215-222
Author(s):  
JOHN LAU ◽  
CHRIS CHANG ◽  
MAURICE LEE ◽  
DAVID CHENG ◽  
TZYY JANG TSENG
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Printed Circuit Board Manufacturing
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