scholarly journals Modification of Cockcroft–Walton-Based High-Voltage Multipliers with 220 V and 50 Hz Input for Non-Thermal Food Processing Apparatus

2020 ◽  
Vol 12 (16) ◽  
pp. 6330
Author(s):  
Anurak Jaiwanglok ◽  
Kei Eguchi ◽  
Krit Smerpitak ◽  
Amphawan Julsereewong

A design of high-voltage multipliers to generate underwater shockwaves is one of the most important factors for successfully providing non-thermal food processing in a cost-effective manner. To be capable of fully utilizing the Cockcroft–Walton-based high-voltage multipliers for underwater shockwave generation, this paper presents a topological modification of three interesting design approaches in bipolar structure for 220 V and 50 Hz AC input to generate more than 3.5 kV DC output within short time periods. In addition to Cockcroft–Walton multipliers (CWMs), the first modified scheme employs a positive full-wave rectifier (FWR) and positive voltage multiplier block (VMB), the second modified scheme employs positive/negative half-wave rectifiers (HWRs), and the last modified scheme employs a switched-capacitor AC-AC converter. To comparatively analyze their performances, the digitally controlled operations of the modified realization schemes as well as their electrical characteristic estimation based on a four-terminal equivalent model are described in detail. The effectiveness of three modified circuit configurations and the correctness of the given theoretical analysis are verified through SPICE (Simulation Program with Integrated Circuit Emphasis) simulation results. The formulas achieved from theoretical estimation are particularly useful when designing the proposed high-voltage multipliers (HVMs) because good agreement between the theoretical and simulation results can be achieved.

2014 ◽  
Vol 619 ◽  
pp. 173-177 ◽  
Author(s):  
Kei Eguchi ◽  
Sawai Pongswatd ◽  
Shinya Terada ◽  
Ichirou Oota

A high voltage multiplier is proposed for non-thermal food processing systems utilizing an underwater shockwave. Unlike conventional Cockcroft-Walton Voltage Multiplier (CWVM) providing a DC output from an AC input, the proposed multiplier consists of two switched-capacitor-based DC-DC converters with different polarities. Owing to the symmetrical bipolar structure without magnetic component, the proposed multiplier can achieve faster response speed and lower voltage drop than the conventional CWVM. The theoretical analysis and simulation program with integrated circuit emphasis (SPICE) simulations show the effectiveness of the proposed voltage multiplier.


Sensors ◽  
2021 ◽  
Vol 21 (8) ◽  
pp. 2590
Author(s):  
Alexandre Robichaud ◽  
Dominic Deslandes ◽  
Paul-Vahé Cicek ◽  
Frederic Nabki

This paper proposes a system in package (SiP) for ultrasonic ranging composed of a 4 × 8 matrix of piezoelectric micromachined ultrasonic transducers (PMUT) and an interface integrated circuit (IC). The PMUT matrix is fabricated using the PiezoMUMPS process and the IC is implemented in the AMS 0.35 µm technology. Simulation results for the PMUT are compared to the measurement results, and an equivalent circuit has been derived to allow a better approximation of the load of the PMUT on the IC. The control circuit is composed of a high-voltage pulser to drive the PMUT for transmission and of a transimpedance amplifier to amplify the received echo. The working frequency of the system is 1.5 MHz.


2020 ◽  
Vol 12 (15) ◽  
pp. 6095
Author(s):  
Kei Eguchi ◽  
Farzin Asadi ◽  
Akira Shibata ◽  
Hiroto Abe ◽  
Ichirou Oota

Recently, shockwave food processing is drawing much attention as a low-cost non-thermal food process technique. In shockwave non-thermal food processing, underwater shockwaves are generated by a high voltage generator. Therefore, high inrush currents and high voltage stress on circuit components significantly reduce the reliability and life expectancy of the circuit. However, to the best of our knowledge, stress reduction techniques and their experimental verification have not been studied yet in the shockwave non-thermal food processing system. In this paper, we propose a stress reduction technique for the shockwave non-thermal food processing system and investigate the effectiveness of the proposed technique experimentally. To achieve high reliability and life expectancy, a new high voltage multiplier with an exponential clock pulse generator is proposed for the shockwave non-thermal food processing system. By slowing down the rate at which the capacitors charge in the high voltage multiplier, the exponential clock pulse generator significantly reduces the inrush current. Furthermore, to perform shockwave non-thermal food processing continuously at a lower voltage level, we present a new electrode with a reset mechanism for wire electric discharge (WED), where a square-shaped metal wire swings on a hinge in the proposed electrode. The proposed electrode enables not only shockwave generation at a lower voltage level but also continuous non-thermal food processing, because the square-shaped metal wire is not melted in the WED process. To confirm the validity of the proposed techniques, some experiments are performed regarding the laboratory prototype of the shockwave non-thermal food processing system. In the performed experiments, reduction of inrush currents and effective food processing are confirmed.


1987 ◽  
Vol 95 ◽  
Author(s):  
J. Del Cueto ◽  
B. Von Roedern ◽  
A. Madan

The attraction for amorphous Silicon based alloys (a-Si) stems in large part from its ease in its depositing uniformly over large areas in a cost effective manner. We here at Glasstech Solar, Inc. (GSI) wish to report on the development of a-Si films for electrophotographic applications. For this specific purpose we have developed thick films (˜30–40 μm) of intrinsic a-Si deposited on TCO at deposition rates of up to 14 Å/S We tested the material for its photoconductivity and breakdown voltage, and its suitability for the application at hand with one measured parameter, the 400 volt switching time, TΔ400. Essentially the goal consisted of developing a high voltage photoconductive switch, that would swing 400 volts at the terminals in a few μsec.


MRS Bulletin ◽  
1992 ◽  
Vol 17 (4) ◽  
pp. 38-41
Author(s):  
Robert C. Pfahl

Electronic packaging involves using an appropriate combination of conductive and dielectric materials to electrically interconnect and mechanically support electronic components in a reliable and cost-effective manner. Since the invention of the integrated circuit in 1959 and mass wave-soldering in 1958, the vast majority of electronic packaging has involved a planar substrate to which semiconductor devices in protective packages are attached by melting eutectic solder. The planar substrates or printed circuit boards (PCBs) were invented in 1940, but their widespread implementation was limited until the invention of mass soldering. PCBs use conventional epoxy-glass dielectric material with mass patterned conductive traces of copper, but alternative materials have been used for either enhanced electrical performance or lower product cost.


Author(s):  
W.J. Parker ◽  
N.M. Shadbolt ◽  
D.I. Gray

Three levels of planning can be distinguished in grassland farming: strategic, tactical and operational. The purpose of strategic planning is to achieve a sustainable long-term fit of the farm business with its physical, social and financial environment. In pastoral farming, this essentially means developing plans that maximise and best match pasture growth with animal demand, while generating sufficient income to maintain or enhance farm resources and improvements, and attain personal and financial goals. Strategic plans relate to the whole farm business and are focused on the means to achieve future needs. They should be routinely (at least annually) reviewed and monitored for effectiveness through key performance indicators (e.g., Economic Farm Surplus) that enable progress toward goals to be measured in a timely and cost-effective manner. Failure to link strategy with control is likely to result in unfulfilled plans. Keywords: management, performance


Author(s):  
Mark Kimball

Abstract This article presents a novel tool designed to allow circuit node measurements in a radio frequency (RF) integrated circuit. The discussion covers RF circuit problems; provides details on the Radio Probe design, which achieves an input impedance of 50Kohms and an overall attenuation factor of 0 dB; and describes signal to noise issues in the output signal, along with their improvement techniques. This cost-effective solution incorporates features that make it well suited to the task of differential measurement of circuit nodes within an RF IC. The Radio Probe concept offers a number of advantages compared to active probes. It is a single frequency measurement tool, so it complements, rather than replaces, active probes.


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