scholarly journals Millimeter Wave Multi-Port Interferometric Radar Sensors: Evolution of Fabrication and Characterization Technologies

Sensors ◽  
2020 ◽  
Vol 20 (19) ◽  
pp. 5477
Author(s):  
Serioja Ovidiu Tatu ◽  
Emilia Moldovan
Keyword(s):  
Millimeter Wave ◽  
Antenna Arrays ◽  
High Speed ◽  
Low Cost ◽  
Radar Sensors ◽  
Laboratory Characterization ◽  
Calibration Methods ◽  
High Efficient ◽  
Fabrication And Characterization ◽  
Imaging Sensors

Recent advances in millimeter wave technologies, both in component and system design, in line with important size and cost reductions, have opened up new applications in ultra-high-speed wireless communications, radar and imaging sensors. The paper presents the evolution of millimeter wave circuit and modules fabrication and characterization technologies in the past decades. Novel planar low-cost fabrication technologies have been successfully developed in this period. In combination with the standard rectangular wave-guide technology, these offer great opportunities for prototyping and testing of future millimeter wave transceivers or front-ends, which integrate antenna arrays, down-converters, modulators, amplifiers, etc., in a compact fixture. The paper uses, as a suggestive example, the evolution of the multi-port interferometric front-ends implementation from millimeter wave bulky components and systems to miniaturized and high-efficient ones. Circuit and system designs are carefully done to avoid (as much as possible) complicated calibration methods or difficult post-processing of baseband data. This requires an increased effort in design and fabrication, but it allows miniaturization, low-power consumption, while keeping very good overall performances. Useful and straightforward laboratory characterization techniques of circuits and systems are described in detail.

scholarly journals Millimeter-wave GaN-based HEMT development at ETH-Zürich

2010 ◽  
Vol 2 (1) ◽  
pp. 33-38 ◽  
Author(s):  
Haifeng Sun ◽  
Diego Marti ◽  
Stefano Tirelli ◽  
Andreas R. Alt ◽  
Hansruedi Benedickter ◽  
...  
Keyword(s):  
Millimeter Wave ◽  
High Speed ◽  
Low Cost ◽  
High Electron Mobility Transistor ◽  
High Resistivity ◽  
High Electron ◽  
Cutoff Frequencies ◽  
Gan Hemts ◽  
The Difference ◽  
Gan On Si

We review the AlGaN/GaN high electron mobility transistor (HEMT) activities in the Millimeter-Wave Electronics Group at ETH-Zürich. Our group's main thrust in the AlGaN/GaN arena is the extension of device bandwidth to higher frequency bands. We demonstrated surprising performances for AlGaN/GaN HEMTs grown on high-resistivity (HR) silicon (111) substrates, and extended cutoff frequencies of 100 nm gate devices well into the millimeter (mm)-wave domain. Our results narrow the performance gap between GaN-on-SiC (or sapphire) and GaN-on-silicon and establish GaN-on-Si as a viable technology for low-cost mm-wave electronics. We here contrast the difference in behaviors observed in our laboratory between nominally identical devices built on high-resistivity silicon (HR-Si) and on sapphire substrates; we show high-speed devices with high-cutoff frequencies and breakdown voltages which combine fT,MAX × BV products as high as 5–10 THz V, and show AlGaN/GaN HEMTs with fT values exceeding 100 GHz on HR-Si. Although the bulk of our activities have so far focused on AlGaN/GaN HEMTs on HR-Si, our process produces excellent device performances when applied to GaN HEMTs on SiC as well: 100 nm gate transistors with fT > 125 GHz have been realized at ETH-Zürich.

High-Speed Slicing of SiC Ingot by High-Speed Multi Wire Saw

2014 ◽  
Vol 778-780 ◽  
pp. 771-775 ◽  
Author(s):  
Hiroto Maeda ◽  
Ryuichi Takanabe ◽  
Atsunori Takeda ◽  
Syogo Matsuda ◽  
Tomohisa Kato
Keyword(s):  
Single Crystal ◽  
High Speed ◽  
Low Cost ◽  
Scale Up ◽  
Wire Saw ◽  
High Efficient ◽  
Diamond Wire Sawing ◽  
Relationship Of ◽  
Sic Wafer ◽  
The Relationship

Development of high efficient and high accuracy slice processing technology is required for realizing the high quality and low cost large SiC wafer. Our target of high speed slicing is slicing a 6 inch SiC single crystal ingot in about 9 hours. This slicing speed is about 10 times higher than the loose abrasive slurry sawing and about 4 times higher than the current technology of diamond wire sawing. The slicing speed and the slicing accuracy are in the relationship of trade-off. Therefore, in this research, we have studied the high speed slicing technique of 3 inch and 4 inch SiC single crystal ingot aiming at reduction of sliced wafers SORI. Moreover, we have extracted subjects to scale-up for the high speed slicing of the 6 inch SiC single crystal ingot.

Study on Axial Turning of Engineering Ceramics

2010 ◽  
Vol 135 ◽  
pp. 309-313 ◽  
Author(s):  
Xin Li Tian ◽  
Fang Guo ◽  
Jun Fei Yang ◽  
Bao Guo Zhang ◽  
Ya Tao Mao
Keyword(s):  
High Speed ◽  
Low Cost ◽  
Cutting Edge ◽  
Work Piece ◽  
Transverse Cracks ◽  
Engineering Ceramics ◽  
High Efficient ◽  
High Speed Rotation ◽  
Speed Rotation ◽  
A Minor

Axial turning is a method to cut the cylindrical work piece along its axis, using the kinetic energy of high-speed rotation annularity tool, the abrasives in tool tip (or toes) as the main cutting edge to remove materials and the abrasives in the inner surface of tool as a minor cutting edge to sharpen the processed surface. The cutting thickness and feed rate could be more than 3~5mm and 30mm/min respectively in a cutting, and realized high-efficient, low-cost processing of engineering ceramics. Processing mechanism analyses showed that both median/radial cracks and lateral cracks occurred in the part to be removed, and the intensity of the processed part had little destroyed, only needing adjust the axial force to control the length of transverse cracks.

scholarly journals Rectangular Waveguide Polymer Microwave Fiber (PMF) Interconnect for Satellite Communication Systems

2021 ◽  
Vol 9 (9) ◽  
pp. 1295-1298
Keyword(s):  
Millimeter Wave ◽  
Communication Systems ◽  
High Speed ◽  
Satellite Communication ◽  
Propagation Constant ◽  
Low Cost ◽  
Data Communication ◽  
Dielectric Waveguides ◽  
Efficient Data ◽  
Ku Band

Research in millimeter-wave dielectric waveguides is recently experiencing high interest in efficient data communication. Generally, channel interconnect remains a challenge for high- speed links design in satellite communication. This paper presents an analysis of Polytetrafluoroethylene (PTFE) interconnect at Ku band owing to its low-cost and efficient throughput. The effect of varying PTFE properties was examined based on the wavelength, propagation constant and attenuation, in other to advise on coating and energy escape outside the Polymer Microwave Fiber (PMF).

Investigation on Tool Wear about High Efficient Axial Turning-Grinding of Engineering Ceramics

2012 ◽  
Vol 426 ◽  
pp. 89-92 ◽  
Author(s):  
X.L. Tian ◽  
Fang Guo ◽  
Ya Tao Mao ◽  
B.G. Zhang ◽  
Jian Quan Wang ◽  
...  
Keyword(s):  
Tool Wear ◽  
High Speed ◽  
High Efficiency ◽  
Low Cost ◽  
Cutting Edge ◽  
Engineering Ceramics ◽  
High Efficient ◽  
High Speed Rotation ◽  
Cylindrical Workpiece ◽  
A Minor

Axial turning-grinding is a processing method to cut cylindrical workpiece or inner surface of hole along its axis, using the kinetic energy of high-speed rotation annularity tool, the abrasives in tool tip as the main cutting edge to remove materials and the abrasives in the outside surface of tool as a minor cutting edge to sharpen the processed surface. And the cutting thickness and feed rate could be more than 5~10mm and 200mm/min respectively in a cutting, realizing high-efficiency, low-cost processing of engineering ceramics. Using the method, the ceramic sleeve of delivery valve precision coupling components in the engine is processed with high efficiency, and tool wear was researched with single factor test. The result indicated that the ratio of spindle speed and workpiece speed should be within a certain range in order to minimize tool wear, and tool wear increases with the increase of cutting depth, but not a linear relation.

Development and production experience of the multilayer curtain-coated linerboard of Ji’an PM No. 3,

TAPPI Journal ◽  
2014 ◽  
Vol 13 (2) ◽  
pp. 17-25
Author(s):  
JUNMING SHU ◽  
ARTHAS YANG ◽  
PEKKA SALMINEN ◽  
HENRI VAITTINEN
Keyword(s):  
Titanium Dioxide ◽  
High Speed ◽  
Food Packaging ◽  
Production Efficiency ◽  
Positive Impact ◽  
Low Cost ◽  
Board Structure ◽  
Flexographic Printing ◽  
Curtain Coating ◽  
Coating Formulations

The Ji’an PM No. 3 is the first linerboard machine in China to use multilayer curtain coating technology. Since successful startup at the end of 2011, further development has been carried out to optimize running conditions, coating formulations, and the base paper to provide a product with satisfactory quality and lower cost to manufacture. The key challenges include designing the base board structure for the desired mechanical strength, designing the surface properties for subsequent coating operations, optimizing the high-speed running of the curtain coater to enhance production efficiency, minimizing the amount of titanium dioxide in the coating color, and balancing the coated board properties to make them suitable for both offset and flexographic printing. The pilot and mill scale results show that curtain coating has a major positive impact on brightness, while smoothness is improved mainly by the blade coating and calendering conditions. Optimization of base board properties and the blade + curtain + blade concept has resulted in the successful use of 100% recycled fiber to produce base board. The optical, mechanical, and printability properties of the final coated board meet market requirements for both offset and flexographic printing. Machine runnability is excellent at the current speed of 1000 m/min, and titanium dioxide has been eliminated in the coating formulations without affecting the coating coverage. A significant improvement in the total cost of coated white liner production has been achieved, compared to the conventional concept of using virgin fiber in the top ply. Future development will focus on combining low cost with further quality improvements to make linerboard suitable for a wider range of end-use applications, including frozen-food packaging and folding boxboard.

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