scholarly journals Sensing and Modelling Mechanical Response in Large Deformation Indentation of Adherent Cell Using Atomic Force Microscopy

Sensors ◽  
2020 ◽  
Vol 20 (6) ◽  
pp. 1764 ◽  
Author(s):  
Tianyao Shen ◽  
Bijan Shirinzadeh ◽  
Yongmin Zhong ◽  
Julian Smith ◽  
Joshua Pinskier ◽  
...  

The mechanical behaviour of adherent cells when subjected to the local indentation can be modelled via various approaches. Specifically, the tensegrity structure has been widely used in describing the organization of discrete intracellular cytoskeletal components, including microtubules (MTs) and microfilaments. The establishment of a tensegrity model for adherent cells has generally been done empirically, without a mathematically demonstrated methodology. In this study, a rotationally symmetric prism-shaped tensegrity structure is introduced, and it forms the basis of the proposed multi-level tensegrity model. The modelling approach utilizes the force density method to mathematically assure self-equilibrium. The proposed multi-level tensegrity model was developed by densely distributing the fundamental tensegrity structure in the intracellular space. In order to characterize the mechanical behaviour of the adherent cell during the atomic force microscopy (AFM) indentation with large deformation, an integrated model coupling the multi-level tensegrity model with a hyperelastic model was also established and applied. The coefficient of determination between the computational force-distance (F-D) curve and the experimental F-D curve was found to be at 0.977 in the integrated model on average. In the simulation range, along with the increase in the overall deformation, the local stiffness contributed by the cytoskeletal components decreased from 75% to 45%, while the contribution from the hyperelastic components increased correspondingly.

2018 ◽  
Vol 32 (18) ◽  
pp. 1850198
Author(s):  
Guocheng Zhang ◽  
Hai Jiang ◽  
Na Fan ◽  
Longxiang Yang ◽  
Jian Guo ◽  
...  

In recent years, a delivery system based on atomic force microscopy (AFM) has been developed to transport nucleic acids, proteins and drugs to single adherent cell by controlling the indentation process. However, the transportation efficiency is limited by the low penetration rate of the common commercial AFM probe. The tip of commercial AFM probe is blunt and it is hard for blunt tip to insert into the soft cell membrane. In this study, dissipative particle dynamics (DPD) simulations were applied to investigate the penetration process of the AFM probe into the cell membrane subjected to different strain states. It was observed that the AFM tip moved down a shorter distance to penetrate the stretched lipid membrane compared with unstretched membrane. Moreover, the threshold value of penetrating force decreased as cell membrane extended. The short indentation time and small force can reduce the probability of cell membrane collapse, therefore it is easier for the AFM tip to penetrate the cell. We also performed the AFM indentation experiments via AFM to investigate the relationship between penetrating force and indentation speed. This work provides a potential way to improve the efficiency of cell transfection by using the AFM delivery system.


2005 ◽  
Vol 867 ◽  
Author(s):  
Subrahmanya Mudhivarthi ◽  
Parshuram Zantyea ◽  
Ashok Kumara ◽  
Jeung-Yeop Shim

AbstractChemical Mechanical Planarization (CMP) is the process of choice for planarization of the constituent layers of the Multi Level Metallization schemes in modern Integrated Circuits. Besides having a lot of advantages, copper CMP process still needs significant process control to eliminate defects such as delamination, microscratches, dishing, erosion etc. In this research, effect of heat generated at the interface on the generation of CMP defects has been investigated. CMP of blanket and patterned samples has been carried out at two conditions of pressure x velocity values with varying slurry temperature. Post CMP metrology is carried out using Atomic force microscopy (AFM) in order to characterize the variation in scratch depth, dishing profile and non-uniformity in step coverage. Pictures of the patterned samples polished at different temperatures are captured using Optical Microscopy (OM) to study the dishing and dissolution of copper lines in greater detail. The primary goal of this study was to gain deeper understanding of the effect of heat generation and rise in temperature at the pad-wafer-slurry interface on CMP induced defectivity.


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