scholarly journals A Novel Mass-Producible Capacitive Sensor with Fully Symmetric 3D Structure and Microfluidics for Cells Detection

Sensors ◽  
2019 ◽  
Vol 19 (2) ◽  
pp. 325
Author(s):  
Zhaorui Zuo ◽  
Kun Wang ◽  
Libin Gao ◽  
Vincent Ho ◽  
Hongju Mao ◽  
...  
Keyword(s):  
Integrated Circuit ◽  
Cell Concentration ◽  
3D Structure ◽  
Capacitive Sensor ◽  
Test System ◽  
Microfluidic Channels ◽  
Cell Detection ◽  
Transfer Program ◽  
Electrode Structure ◽  
Capacitance Change

Affinity biosensors of interdigitated electrodes have been widely used in cell detection. This research presents a mass-producible and disposable three-dimensional (3D) structure capacitive sensor based on the integrated circuit package lead frames for cell concentration detection. The fully symmetric 3D interdigital electrode structure makes the sensor more homogeneous and sensitive. (3-Aminopropyl) triethoxysilane (APTES) and glutaraldehyde are immobilized onto gold-plated electrodes. By overlaying the microfluidic channels on top, the volume of the solution is kept constant to obtain repeatable measured capacitance values. Moreover, using the upgraded reading and writing functions and circular measurement of the E4980A Data Transfer Program, an automatic multigroup test system is developed. It is shown that the cell concentration and capacitance are inversely correlated, and the cell concentration range of 103–106 CFU∙mL−1 is achieved. In addition, the rate of capacitance change matches that of state-of-the-art biosensors reported. A program is developed to find the optimal voltage and frequency for linear fitting between the capacitance change and cell concentration. Future work will employ machine learning-based data analysis to drug resistance sensitivity test of cell lines and cell survival status.

scholarly journals Low temperature co-fired ceramic packaging of CMOS capacitive sensor chip towards cell viability monitoring

2016 ◽  
Vol 7 ◽  
pp. 1871-1877 ◽  
Author(s):  
Niina Halonen ◽  
Joni Kilpijärvi ◽  
Maciej Sobocinski ◽  
Timir Datta-Chaudhuri ◽  
Antti Hassinen ◽  
...  
Keyword(s):  
Low Temperature ◽  
Cell Viability ◽  
Integrated Circuit ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Capacitive Sensor ◽  
Circuit Board ◽  
Sensor Chip ◽  
Microfluidic Channels ◽  
Label Free

Cell viability monitoring is an important part of biosafety evaluation for the detection of toxic effects on cells caused by nanomaterials, preferably by label-free, noninvasive, fast, and cost effective methods. These requirements can be met by monitoring cell viability with a capacitance-sensing integrated circuit (IC) microchip. The capacitance provides a measurement of the surface attachment of adherent cells as an indication of their health status. However, the moist, warm, and corrosive biological environment requires reliable packaging of the sensor chip. In this work, a second generation of low temperature co-fired ceramic (LTCC) technology was combined with flip-chip bonding to provide a durable package compatible with cell culture. The LTCC-packaged sensor chip was integrated with a printed circuit board, data acquisition device, and measurement-controlling software. The packaged sensor chip functioned well in the presence of cell medium and cells, with output voltages depending on the medium above the capacitors. Moreover, the manufacturing of microfluidic channels in the LTCC package was demonstrated.

scholarly journals One-chip analog circuits for a new type of plasma wave receiver on board space missions

2017 ◽  
Vol 6 (1) ◽  
pp. 159-167 ◽  
Author(s):  
Takahiro Zushi ◽  
Hirotsugu Kojima ◽  
Hiroshi Yamakawa
Keyword(s):  
Plasma Wave ◽  
Analog Circuits ◽  
Integrated Circuit ◽  
Dynamic Range ◽  
Test System ◽  
Analog To Digital ◽  
Application Specific Integrated Circuit ◽  
New Type ◽  
Narrow Dynamic Range ◽  
Asic Chip

Abstract. Plasma waves are important observational targets for scientific missions investigating space plasma phenomena. Conventional fast Fourier transform (FFT)-based spectrum plasma wave receivers have the disadvantages of a large size and a narrow dynamic range. This paper proposes a new type of FFT-based spectrum plasma wave receiver that overcomes the disadvantages of conventional receivers. The receiver measures and calculates the whole spectrum by dividing the observation frequency range into three bands: bands 1, 2, and 3, which span 1 Hz to 1 kHz, 1 to 10 kHz, and 10 to 100 kHz, respectively. To reduce the size of the receiver, its analog section was realized using application-specific integrated circuit (ASIC) technology, and an ASIC chip was successfully developed. The dimensions of the analog circuits were 4.21 mm  ×  1.16 mm. To confirm the performance of the ASIC, a test system for the receiver was developed using the ASIC, an analog-to-digital converter, and a personal computer. The frequency resolutions for bands 1, 2, and 3 were 3.2, 32, and 320 Hz, respectively, and the average time resolution was 384 ms. These frequency and time resolutions are superior to those of conventional FFT-based receivers.

Electrical and Mechanical Performance of Quilt Packaging with Solder Paste by Pin Transfer

2012 ◽  
Vol 2012 (1) ◽  
pp. 000441-000446
Author(s):  
Quanling Zheng ◽  
M. Ashraf Khan ◽  
Alfred M. Kriman ◽  
Gary H. Bernstein
Keyword(s):  
Integrated Circuit ◽  
Mechanical Performance ◽  
Test System ◽  
The Self ◽  
Solder Paste ◽  
Mechanical Reliability ◽  
Pull Force ◽  
Pull Test ◽  
2D System ◽  
Quilt Packaging

Electrical and mechanical performance of Quilt Packaging (QP), a 2D system-in-package chip-to-chip interconnection, is presented. QP employs contacts at the edges of integrated circuit dies along their vertical surfaces. Based on 3D HFSS simulations, the self-inductance of QP can be less than 0.01 nH, and the self-capacitance can be less than 0.034 pF due to the shortness of the interconnection path. QP interconnection using solder paste with pin transfer is presented, and mechanical reliability is evaluated. A new pull test system specifically designed for QP is presented. The pull force that causes failure in a set of edge interconnects totaling 3 mm width of nodules is about 658 gram-force for Sn63Pb37 and 953 gram-force for SAC305.

Pretension Analysis for Piezoelectric Stack Actuator in Nano-Positioning Stage

2017 ◽  
Author(s):  
Meng Zhang ◽  
Zhigang Liu ◽  
Mingfan Bu ◽  
Yu Zhu
Keyword(s):  
High Speed ◽  
Capacitive Sensor ◽  
Force Sensor ◽  
Fast Response ◽  
Test System ◽  
Flexible Hinge ◽  
Sensor Module ◽  
Positioning Stage ◽  
Tensile Forces ◽  
Piezoelectric Stack Actuator

Taking advantages of high stiffness, fast response, high-bandwidth as well as large pushing force capability, piezoelectric stack actuators have been widely used in the fields of high speed nano-positioning stages and precision systems. An inevitable disadvantage of piezoelectric actuators is that they are highly intolerant to shear and tensile forces. During high speed scanning operations, the inertial forces due to the effective mass of the stage may cause the actuators to withstand excessive shear or tension forces. To protect the actuators, preload is often applied to compensate for these forces. Flexures have been used to supply preload to the piezoelectric stack actuators in many high-speed nano-positioning stages. Nevertheless, for nano-positioning stages with stiff flexures, it is a difficult job to displace the flexures and slide the actuators in place to preload them. This paper proposed a novel preloading nano-positioning stage which allows the piezoelectric stack actuator to be preloaded and mounted easily without obviously reducing the stiffness and speed of the nano-positioning stage. A preloading nano-positioning stage is designed and the flexible hinge and piezoelectric stack actuator of the stage are analyzed. The stiffness and resonance frequency of flexible hinge and optimal preload for the proposed stage is obtained by kinetics analysis. In order to verify the effectiveness of preloading nano-positioning stage, an online test system is established. The system mainly composed by a force sensor module, a capacitive sensor module and the preloading nano-positioning stage. A force sensor is applied between piezoelectric actuator and flexible hinge which can directly measure the preload in real time. The displacement of the flexible hinge is measured by a capacitive sensor to evaluate the positioning accuracy. Experiments are conducted, and the results demonstrate the effectiveness of the proposed approach.

A computer-controlled environmental test system for high pin-count integrated circuit packages

1993 ◽  
Vol 9 (2) ◽  
pp. 95-104
Author(s):  
John Barrett ◽  
John Ó Donavan ◽  
Thomas Hayes ◽  
Seán C.Ó Mathúna
Keyword(s):  
Integrated Circuit ◽  
Test System ◽  
Environmental Test ◽  
Computer Controlled

Uncooled Infrared Bolometer Arrays with α-Si and Metal Films

2010 ◽  
Vol 663-665 ◽  
pp. 421-424
Author(s):  
Huan Liu ◽  
Shan Shan Wang ◽  
Chang Long Cai ◽  
Shun Zhou
Keyword(s):  
Stress State ◽  
Integrated Circuit ◽  
Chemical Vapor ◽  
Metal Films ◽  
Test System ◽  
Film Stress ◽  
Technological Parameters ◽  
Sensitive Material ◽  
Stress Equilibrium ◽  
Si Films

A bolometer with stress equilibrium based on α-Si and metal films is proposed in this paper. The sensitive and support material α-Si films are prepared by plasma enhanced chemical vapor deposition（PECVD）, their stress and deposition rate are studied, and the technological parameter of the low stress and higher temperature coefficient of resistance (TCR) α-Si film are obtained. The result shows that the stress of the α-Si films can be adjusted between positive and negative. Pt films are deposited by electron-beam evaporating equipment. Their square resistance, TCR and stress are tested by four point resistivity test system and film-stress interferometer. The result shows this material is a good heat-sensitive material, and at the same time it can balance the stress of α-Si film. Finally it is found that Pt film is in compressive stress state in the selected technological parameters, and α-Si thin film is in tensile stress state, so the stress of micro-bridge structure can be balanced by this method. In the final, 160×120 infrared micro-bridge array on the wafer and read out integrated circuit (ROIC) chip are successfully fabricated.

Sensor Sticker for Detection of Fungi Spore Contamination on Bananas

2016 ◽  
Vol 100 ◽  
pp. 130-133
Author(s):  
Poornachandra Papireddy Vinayaka ◽  
Maryam Kahali Moghaddam ◽  
Sander van den Driesche ◽  
Roland Blank ◽  
Walter Lang ◽  
...  
Keyword(s):  
Culture Medium ◽  
Capacitive Sensor ◽  
Fixed Time ◽  
Time Interval ◽  
Capacitance Change ◽  
Fixed Time Interval ◽  
Transport Losses ◽  
Capacitive Element ◽  
Medium Layer ◽  
Air Cavities

Fungi growth on bananas during transportation not only results in loss of food but it also incurs considerable transport losses. To investigate the influence of spores on the development of fungi growth on the bananas we present a sensor sticker. The sticker can be put on the banana surface for the detection of spore concentration. The designed sensor comprises of a thin layer of culture medium (PDA agarose) coated on a capacitive sensor fabricated on a polyimide foil (5 μm). As spores germinate, the capacitance of the culture medium changes which is measured by the interdigital capacitive element that contains 2 electrodes (with 428 fingers) that have a length of 3 mm, a width and a gap of 7 μm. In addition to the culture medium one of the major requirements for the fungi to grow is air. As air cannot diffuse through the sticker, air cavities are integrated in the culture medium layer to provide the necessary amount of air for fungi growth. This method was successfully applied to determine different concentrations of Fusarium Oxysporum, a major fungi species responsible for banana contamination. Measured capacitance change after a fixed time interval depends on the initial concentration of spores. The measurement takes typically 6 hours.

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