scholarly journals Wireless sEMG System with a Microneedle-Based High-Density Electrode Array on a Flexible Substrate

Sensors ◽  
2017 ◽  
Vol 18 (2) ◽  
pp. 92 ◽  
Author(s):  
Minjae Kim ◽  
Gangyong Gu ◽  
Kyoung Cha ◽  
Dong Kim ◽  
Wan Chung
Keyword(s):  
Flexible Substrate ◽  
Electrode Array ◽  
High Density

scholarly journals A Gel‐Free Ti 3 C 2 T x ‐Based Electrode Array for High‐Density, High‐Resolution Surface Electromyography

2020 ◽  
Vol 5 (8) ◽  
pp. 2000325 ◽  
Author(s):  
Brendan B. Murphy ◽  
Patrick J. Mulcahey ◽  
Nicolette Driscoll ◽  
Andrew G. Richardson ◽  
Gregory T. Robbins ◽  
...  
Keyword(s):  
High Resolution ◽  
Surface Electromyography ◽  
Electrode Array ◽  
High Density

Optimizing System-on-Film (SOF) Design Using Finite Element Analysis

2011 ◽  
Author(s):  
Vikram Venkatadri ◽  
Mark Downey ◽  
Xiaojie Xue ◽  
Dipak Sengupta ◽  
Daryl Santos ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Flip Chip ◽  
Flexible Substrate ◽  
High Density ◽  
Design Solution ◽  
Design Parameters ◽  
Optimized Design ◽  
Element Analysis ◽  
Bonding Parameters

System-On-Film (SOF) module is a complex integration of a fine pitch high density die and surface mounted discrete devices on a polyimide (PI) film laminate. The die is connected to the film using a thermo-compression flip-chip bonding (TCB) process which is capable of providing a very high density interconnect at less than 50um pitch. Several design and bonding parameters have to be controlled in order to achieve a reliable bond between the Au bumps on the die and the Sn plated Cu traces on the PI film. In the current work, the TCB process is studied using Finite Element Analysis (FEA) to optimize the design parameters and assure proper process margins. The resultant forces acting on the bump-to-trace interfaces are quantified across the different potential geometrical combinations. Baseline simulations showed higher stresses on specific bump locations and stress gradients acting on the bumps along the different sides of the die. These observations were correlated to both the failures and near failures on the actual test vehicles. Further simulations were then utilized to optimize and navigate design tradeoffs at both the die and flexible substrate design levels for a more robust design solution. Construction analysis performed on parts built using optimized design parameters showed significant improvements and correlated well with the simulation results.

High Density Multiple-electrode Array Mapping is Feasible in Tissue and small Animal Atria

2010 ◽  
Vol 19 ◽  
pp. S87-S88
Author(s):  
D. Lau ◽  
L. Mackenzie ◽  
N. Shipp ◽  
P. Kuklik ◽  
H. Dimitri ◽  
...  
Keyword(s):  
Electrode Array ◽  
Small Animal ◽  
High Density ◽  
Multiple Electrode

Fabrication of high-density In3Sb1Te2phase change nanoarray on glass-fabric reinforced flexible substrate

2012 ◽  
Vol 23 (25) ◽  
pp. 255301 ◽  
Author(s):  
Jong Moon Yoon ◽  
Dong Ok Shin ◽  
You Yin ◽  
Hyeon Kook Seo ◽  
Daewoon Kim ◽  
...  
Keyword(s):  
Flexible Substrate ◽  
High Density ◽  
Glass Fabric

A thin, flexible multielectrode grid for high-density surface EMG

2004 ◽  
Vol 96 (1) ◽  
pp. 327-336 ◽  
Author(s):  
B. G. Lapatki ◽  
J. P. van Dijk ◽  
I. E. Jonas ◽  
M. J. Zwarts ◽  
D. F. Stegeman
Keyword(s):  
Clinical Application ◽  
Electrode Array ◽  
Skin Surface ◽  
High Density ◽  
Adhesive Tape ◽  
Two Dimensional ◽  
Single Motor Unit ◽  
Facial Musculature ◽  
Density Surface ◽  
Broad Clinical Application

Although the value of high-density surface electromyography (sEMG) has already been proven in fundamental research and for specific diagnostic questions, there is as yet no broad clinical application. This is partly due to limitations of construction principles and application techniques of conventional electrode array systems. We developed a thin, highly flexible, two-dimensional multielectrode sEMG grid, which is manufactured by using flexprint techniques. The material used as electrode carrier (Polyimid, 50 μm thick) allows grids to be cut out in any required shape or size. One universal grid version can therefore be used for many applications, thereby reducing costs. The reusable electrode grid is attached to the skin by using specially prepared double-sided adhesive tape, which allows the selective application of conductive cream only directly below the detection surfaces. To explore the practical possibilities, this technique was applied in single motor unit analysis of the facial musculature. The high mechanical flexibility allowed the electrode grid to follow the skin surface even in areas with very uneven contours, resulting in good electrical connections in the whole recording area. The silverchloride surfaces of the electrodes and their low electrode-to-skin impedances guaranteed high baseline stability and a low signal noise level. The electrode-to-skin attachment proved to withstand saliva and great tensile forces due to mimic contractions. The inexpensive, universally adaptable and minimally obstructive sensor allows the principal advantages of high-density sEMG to be extended to all skeletal muscles accessible from the skin surface and may lay the foundation for more broad clinical application of this noninvasive, two-dimensional sEMG technique.

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