scholarly journals Digital Platform for Wafer-Level MEMS Testing and Characterization Using Electrical Response

Sensors ◽  
2016 ◽  
Vol 16 (9) ◽  
pp. 1553 ◽  
Author(s):  
Nuno Brito ◽  
Carlos Ferreira ◽  
Filipe Alves ◽  
Jorge Cabral ◽  
João Gaspar ◽  
...  
Keyword(s):  
Electrical Response ◽  
Wafer Level ◽  
Digital Platform ◽  
Mems Testing

Use of fractals to describe microstructures of porous thick-film platinum electrodes

1992 ◽  
Vol 50 (1) ◽  
pp. 314-315
Author(s):  
Steven D. Toteda
Keyword(s):  
Fractal Dimension ◽  
Power Plants ◽  
Electrical Response ◽  
Cubic Phase ◽  
Platinum Electrodes ◽  
Fine Grained ◽  
Impedance Response ◽  
Platinum Particles ◽  
Energy Surfaces ◽  
Highly Porous

Zirconia oxygen sensors, in such applications as power plants and automobiles, generally utilize platinum electrodes for the catalytic reaction of dissociating O2 at the surface. The microstructure of the platinum electrode defines the resulting electrical response. The electrode must be porous enough to allow the oxygen to reach the zirconia surface while still remaining electrically continuous. At low sintering temperatures, the platinum is highly porous and fine grained. The platinum particles sinter together as the firing temperatures are increased. As the sintering temperatures are raised even further, the surface of the platinum begins to facet with lower energy surfaces. These microstructural changes can be seen in Figures 1 and 2, but the goal of the work is to characterize the microstructure by its fractal dimension and then relate the fractal dimension to the electrical response. The sensors were fabricated from zirconia powder stabilized in the cubic phase with 8 mol% percent yttria. Each substrate was sintered for 14 hours at 1200°C. The resulting zirconia pellets, 13mm in diameter and 2mm in thickness, were roughly 97 to 98 percent of theoretical density. The Engelhard #6082 platinum paste was applied to the zirconia disks after they were mechanically polished ( diamond). The electrodes were then sintered at temperatures ranging from 600°C to 1000°C. Each sensor was tested to determine the impedance response from 1Hz to 5,000Hz. These frequencies correspond to the electrode at the test temperature of 600°C.

Dynamic electrical response of YBaCuO thin films as a function of microstructure in view of applications to agile electronics

2001 ◽  
Vol 11 (PR11) ◽  
pp. Pr11-121-Pr11-125
Author(s):  
F. Abbott ◽  
A. F. Dégardin ◽  
A. De Luca ◽  
O. Schneegans ◽  
É. Caristan ◽  
...  
Keyword(s):  
Thin Films ◽  
Electrical Response

THE CONCEPT OF COMPETITIVE VALUE CHAINS IN PRODUCTION SYSTEMS AS AN INSTITUTIONAL STRUCTURE OPERATING ON NETWORK PRINCIPLES

2019 ◽  
Vol 6 (3) ◽  
pp. 61-67
Author(s):  
Niyaz Mustjakimovich Abdikeev ◽  
Anton Alekseevich Losev ◽  
Andrey Ivanovich Gaydamaka
Keyword(s):  
Business Processes ◽  
Production Systems ◽  
Institutional Structure ◽  
Cognitive Models ◽  
Value Chains ◽  
High Tech ◽  
Practical Implementation ◽  
Digital Platform ◽  
Software Product ◽  
The Creation

The Concept of competitive value chains in production systems, as an institutional structure operating on network principles, was the impetus for the development of a system of models of inter-industry digital platform for the management and optimization of cooperation of high-tech network production systems. The article describes the ways of integration into business processes of production systems of simulation and cognitive models. The practical implementation of the system of these models is a separate software product - an interdisciplinary digital platform for participants in the creation of new high-tech products and their components.

MEMS Wafer-level Packaging Technology Using LTCC Wafer

2012 ◽  
Vol 132 (8) ◽  
pp. 246-253 ◽  
Author(s):  
Mamoru Mohri ◽  
Masayoshi Esashi ◽  
Shuji Tanaka
Keyword(s):  
Wafer Level ◽  
Packaging Technology ◽  
Wafer Level Packaging

Silicon Migration Seal Wafer-Level Vacuum Encapsulation

2020 ◽  
Vol 140 (7) ◽  
pp. 165-169
Author(s):  
Yukio Suzuki ◽  
Dupuit Victor ◽  
Toshiya Kojima ◽  
Yoshiaki Kanamori ◽  
Shuji Tanaka
Keyword(s):  
Wafer Level

Development of Wafer Level Chip Size Packaging Process and its Application to the CMOS Image Sensor Module for Medical Device

2017 ◽  
Vol 137 (2) ◽  
pp. 48-58
Author(s):  
Noriyuki Fujimori ◽  
Takatoshi Igarashi ◽  
Takahiro Shimohata ◽  
Takuro Suyama ◽  
Kazuhiro Yoshida ◽  
...  
Keyword(s):  
Medical Device ◽  
Cmos Image Sensor ◽  
Image Sensor ◽  
Wafer Level ◽  
Packaging Process ◽  
Sensor Module ◽  
Chip Size
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