scholarly journals Visualized Multiprobe Electrical Impedance Measurements with STM Tips Using Shear Force Feedback Control

Sensors ◽  
2016 ◽  
Vol 16 (6) ◽  
pp. 757
Author(s):  
Luis Botaya ◽  
Xavier Coromina ◽  
Josep Samitier ◽  
Manel Puig-Vidal ◽  
Jorge Otero
1995 ◽  
Vol 11 (5) ◽  
pp. 760-765 ◽  
Author(s):  
Zheng-Hua Luo ◽  
N. Kitamura ◽  
Bao-Zhu Guo

2013 ◽  
Vol 133 (8) ◽  
pp. 795-803
Author(s):  
Kazuki Nagase ◽  
Shutaro Yorozu ◽  
Takahiro Kosugi ◽  
Yuki Yokokura ◽  
Seiichiro Katsura

Micromachines ◽  
2021 ◽  
Vol 12 (6) ◽  
pp. 632
Author(s):  
Yuan Cao ◽  
Julia Floehr ◽  
Sven Ingebrandt ◽  
Uwe Schnakenberg

In micro-electrical-mechanical systems (MEMS), thick structures with high aspect ratios are often required. Dry film photoresist (DFR) in various thicknesses can be easily laminated and patterned using standard UV lithography. Here, we present a three-level DFR lamination process of SUEX for a microfluidic chip with embedded, vertically arranged microelectrodes for electrical impedance measurements. To trap and fix the object under test to the electrodes, an aperture is formed in the center of the ring-shaped electrodes in combination with a microfluidic suction channel underneath. In a proof-of-concept, the setup is characterized by electrical impedance measurements with polystyrene and ZrO2 spheres. The electrical impedance is most sensitive at approximately 2 kHz, and its magnitudes reveal around 200% higher values when a sphere is trapped. The magnitude values depend on the sizes of the spheres. Electrical equivalent circuits are applied to simulate the experimental results with a close match.


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