scholarly journals UV Polymerization of Methacrylates—Preparation and Properties of Novel Copolymers

Polymers ◽  
2021 ◽  
Vol 13 (10) ◽  
pp. 1659
Author(s):  
Marta Worzakowska
Keyword(s):  
Thermal Stability ◽  
Glass Transition ◽  
Methyl Methacrylate ◽  
Chemical Resistance ◽  
Polymeric Materials ◽  
Monomer Content ◽  
Methacrylate Monomer ◽  
Methacrylate Monomers ◽  
Thermal Stability Of ◽  
Citronellyl Methacrylate

More environmentally friendly polymeric materials for use in corrosive conditions were obtained in the process of UV polymerization of terpene methacrylate monomers: geranyl methacrylate and citronellyl methacrylate and the commercially available monomer methyl methacrylate. Selected properties (solvent resistance, chemical resistance, glass transition temperature, thermal stability, and decomposition course during heating) were evaluated. It was found that the properties of the materials directly depended on the monomer percentage and the conditioning temperatures used. An increase in the geranyl or citronellyl methacrylate monomer content in the copolymers reduced the solubility and chemical resistance of the materials post-cured at 50 °C. The samples post-cured at 120 °C were characterized by high resistance to polar and non-polar solvents and the chemical environment, regardless of the percentage composition. The glass transition temperatures for samples conditioned at 120 °C increased with increasing content of methyl methacrylate in the copolymers. The thermal stability of copolymers depended on the conditioning temperatures used. It was greater than 200 °C for most copolymers post-cured at 120 °C. The process of pyrolysis of copolymers led to the emission of geranyl methacrylate, citronellyl methacrylate, and methyl methacrylate monomers as the main pyrolysis volatiles.

Novel Copolymers of N-[(4-bromo-3,5- difluorine) phenyl] acryl- amide with Methyl Methacrylate: Synthesis, Characterization and Thermal Properties

2013 ◽  
Vol 750-752 ◽  
pp. 1125-1129
Author(s):  
Xin Ding Yao ◽  
Rui Na Fang ◽  
Hong Jian Pang ◽  
Zong Wu Wang ◽  
Guo Ji Liu
Keyword(s):  
Thermal Stability ◽  
Glass Transition ◽  
Thermal Properties ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Thermogravimetric Analysis ◽  
Methyl Methacrylate ◽  
1H Nmr ◽  
Nmr Spectra ◽  
Thermal Stability Of

Copolymers of N-[(4-bromo-3,5-difluorine) phenyacrylamide (BDPA), with methyl methacrylate (MMA) were synthesized in N,N-Dimethylformamide at 75±1°C using 2,2-azobisisobutyronitrile (AIBN) as an initiator with different monomer-to-monomer ratios in the feed. The copolymers were characterized by FTIR and 1H NMR spectra. The glass transition temperature of the copolymers decreases with increase in BDPA content. The thermogravimetric analysis of the polymers showed that the thermal stability of the copolymer decreases with BDPA content.

The effect of methyl and methoxy substituents on dianilines for a thermosetting polyimide system

2020 ◽  
Vol 32 (7) ◽  
pp. 801-822 ◽  
Author(s):  
John J La Scala ◽  
Greg Yandek ◽  
Jason Lamb ◽  
Craig M Paquette ◽  
William S Eck ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Molecular Weight ◽  
Glass Transition ◽  
Elevated Temperature ◽  
Methyl Substituent ◽  
Glass Transition Temperatures ◽  
High Performing ◽  
Methoxy Substituent ◽  
Acidic Conditions ◽  
Thermal Stability Of

4,4′-Methylenedianiline (MDA) is widely used in high-temperature polyimide resins, including polymerization of monomer reactants-15. The toxicity of MDA significantly limits the manufacturability using this resin. Modifying the substitution and electronics of MDA could allow for the reduction of toxicity while maintaining the high-performing properties of the materials derived from the modified MDA. The addition of a single methyl substituent, methoxy substituent, location of these substituents, and location of the amine relative to the phenolic bridge were modified as were other non-aniline diamines. Various anilines were condensed with paraformaldehyde under acidic conditions to yield dianilines. These dianilines and diamines were reacted with nadic anhydride and 3,3′,4,4′-benzophenonetetracarboxylic dianhydride in methanol to form the polyamic acid oligomers and heated at elevated temperature to form polyimide oligomers. It was found that the molecular weight of the oligomers derived from MDA alternatives was generally lower than that of MDA oligomers resulting in lower glass transition temperatures ( T gs) and degradation temperatures. Additionally, methoxy substituents further reduce the T g of the polymers versus methyl substituents and reduce the thermal stability of the resin. Methyl-substituted alternatives produced polyimides with similar T gs and degradation temperatures. The toxicity of the MDA alternatives was examined. Although a few were identified with reduced toxicities, the alternatives with properties similar to that of MDA also had high toxicities.

Nanocomposite Epoxy Resin for SiC Module

2011 ◽  
Vol 2011 (HITEN) ◽  
pp. 000196-000200 ◽  
Author(s):  
Kenji Okamoto ◽  
Yuji Takematsu ◽  
Miyako Hitomi ◽  
Yoshinari Ikeda ◽  
Yoshikazu Takahashi
Keyword(s):  
Thermal Stability ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Epoxy Resin ◽  
Molecular Motion ◽  
Experimental Results ◽  
Power Module ◽  
Operation Temperature ◽  
Thermal Stability Of

There is a demand to improve the thermal stability of epoxy molding resins used in the power module of SiC power chips operating at temperatures of 200°C or more. This paper describes a technique for increasing the thermal stability of the resin by decreasing molecular motion through the addition of nanofiller. The experimental results showed that the glass transition temperature (Tg) of the epoxy resin increased by approximately 30°C when the silica nanofiller was added. The epoxy resin added nanofiller was investigated in order to achieve the operation temperature 200°C of power module.

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