scholarly journals 3D Thermal Network Supported by CF Felt for Improving the Thermal Performance of CF/C/Epoxy Composites

Polymers ◽  
2021 ◽  
Vol 13 (6) ◽  
pp. 980
Author(s):  
Xinfeng Wu ◽  
Yuan Gao ◽  
Tao Jiang ◽  
Lingyu Zheng ◽  
Ying Wang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Electronic Devices ◽  
Epoxy Composites ◽  
Operating Efficiency ◽  
Impregnation Method ◽  
Molding Method ◽  
Needle Punching ◽  
3D Network ◽  
Network Method ◽  
Process Method

The heat generated by a high-power device will seriously affect the operating efficiency and service life of electronic devices, which greatly limits the development of the microelectronic industry. Carbon fiber (CF) materials with excellent thermal conductivity have been favored by scientific researchers. In this paper, CF/carbon felt (CF/C felt) was fabricated by CF and phenolic resin using the “airflow network method”, “needle-punching method” and “graphitization process method”. Then, the CF/C/Epoxy composites (CF/C/EP) were prepared by the CF/C felt and epoxy resin using the “liquid phase impregnation method” and “compression molding method”. The results show that the CF/C felt has a 3D network structure, which is very conducive to improving the thermal conductivity of the CF/C/EP composite. The thermal conductivity of the CF/C/EP composite reaches 3.39 W/mK with 31.2 wt% CF/C, which is about 17 times of that of pure epoxy.

scholarly journals Simultaneously Enhanced Thermal Conductivity and Dielectric Breakdown Strength in Sandwich AlN/Epoxy Composites

Nanomaterials ◽  
2021 ◽  
Vol 11 (8) ◽  
pp. 1898
Author(s):  
Zhengdong Wang ◽  
Xiaozhuo Wang ◽  
Silong Wang ◽  
Jieyu He ◽  
Tong Zhang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Layer Thickness ◽  
Dielectric Breakdown ◽  
Breakdown Strength ◽  
Electronic Devices ◽  
Epoxy Composites ◽  
Power Equipment ◽  
Power Electronic ◽  
Sandwich Composites ◽  
Dielectric Breakdown Strength

Polymer-based composites with high thermal conductivity and dielectric breakdown strength have gained increasing attention due to their significant application potential in both power electronic devices and power equipment. In this study, we successfully prepared novel sandwich AlN/epoxy composites with various layer thicknesses, showing simultaneously and remarkably enhanced dielectric breakdown strength and thermal conductivity. The most optimized sandwich composite, with an outer layer thickness of 120 μm and an inner layer thickness of 60 μm (abbreviated as 120-60) exhibits a high through-plane thermal conductivity of 0.754 W/(m·K) (4.1 times of epoxy) and has a dielectric breakdown strength of 69.7 kV/mm, 8.1% higher compared to that of epoxy. The sandwich composites also have higher in-plane thermal conductivity (1.88 W/(m·K) for 120-60) based on the novel parallel models. The sandwich composites with desirable thermal and electrical properties are very promising for application in power electronic devices and power equipment.

Novel micro-nano epoxy composites for electronic packaging application: Balance of thermal conductivity and processability

2021 ◽  
Vol 209 ◽  
pp. 108760
Author(s):  
Yang Hu ◽  
Chao Chen ◽  
Yingfeng Wen ◽  
Zhigang Xue ◽  
Xingping Zhou ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Electronic Packaging ◽  
Epoxy Composites

Ultrahigh Thermal Conductivity of Epoxy Composites with Hybrid Carbon Fiber and Graphene Filler

2021 ◽  
Author(s):  
Zulfiqar Ali ◽  
Xiangdong Kong ◽  
Maohua Li ◽  
Xiao Hou ◽  
Linhong Li ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Carbon Fiber ◽  
Epoxy Composites ◽  
Hybrid Carbon

Carbon nano-onions as a nanofiller for enhancing thermal conductivity of epoxy composites

2021 ◽  
Author(s):  
Xianzhe Wei ◽  
Guoqiang Yin ◽  
Xiangyang Zhou ◽  
Linhong Li ◽  
Maohua Li ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Epoxy Composites
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