scholarly journals Enhanced the Thermal Conductivity of Polydimethylsiloxane via a Three-Dimensional Hybrid Boron Nitride@Silver Nanowires Thermal Network Filler

Polymers ◽  
2021 ◽  
Vol 13 (2) ◽  
pp. 248
Author(s):  
Zhengqiang Huang ◽  
Wei Wu ◽  
Dietmar Drummer ◽  
Chao Liu ◽  
Yi Wang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Silver Nanowires ◽  
Three Dimensional ◽  
Silver Ions ◽  
Hybrid Filler ◽  
Thermal Network ◽  
Hybrid Fillers ◽  
Growth Method

In this work, polydimethylsiloxane (PDMS)-based composites with high thermal conductivity were fabricated via a three-dimensional hybrid boron nitride@silver nanowires (BN@AgNWs) filler thermal network, and their thermal conductivity was investigated. A new thermal conductive BN@AgNWs hybrid filler was prepared by an in situ growth method. Silver ions with the different concentrations were reduced, and AgNWs crystallized and grew on the surface of BN sheets. PDMS-based composites were fabricated by the BN@AgNWs hybrid filler added. SEM, XPS, and XRD were used to characterize the structure and morphology of BN@AgNWs hybrid fillers. The thermal conductivity performances of PDMS-based composites with different silver concentrates were investigated. The results showed that the thermal conductivity of PDMS-based composite filled with 20 vol% BN@15AgNWs hybrid filler is 0.914 W/(m·K), which is 5.05 times that of pure PDMS and 23% higher than the thermal conductivity of 20 vol% PDMS-based composite with BN filled. The enhanced thermal conductivity mechanism was provided based on the hybrid filler structure. This work offers a new way to design and fabricate the high thermal conductive hybrid filler for thermal management materials.

scholarly journals Achieving a 3D Thermally Conductive while Electrically Insulating Network in Polybenzoxazine with a Novel Hybrid Filler Composed of Boron Nitride and Carbon Nanotubes

Polymers ◽  
2020 ◽  
Vol 12 (10) ◽  
pp. 2331
Author(s):  
Yi Wang ◽  
Wei Wu ◽  
Dietmar Drummer ◽  
Chao Liu ◽  
Florian Tomiak ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Boron Nitride ◽  
Condensation Reaction ◽  
Heat Accumulation ◽  
Hybrid Filler ◽  
Excessive Heat ◽  
Hybrid Fillers ◽  
Thermally Conductive ◽  
Treated Carbon

To solve the problem of excessive heat accumulation in the electronic packaging field, a novel series of hybrid filler (BN@CNT) with a hierarchical “line-plane” structure was assembled via a condensation reaction between functional boron nitride(f-BN) and acid treated carbon nanotubes (a-CNTs). The reactions with different mass ratios of BN and CNTs and the effect of the obtained hybrid filler on the composites’ thermal conductivity were studied. According to the results, BN@15CNT exhibited better effects on promoting thermal conductivity of polybenzoxazine(PBz) composites which were prepared via ball milling and hot compression. The thermally conductive coefficient value of PBz composites, which were loaded with 25 wt% of BN@15CNT hybrid fillers, reached 0.794 W· m−1· K−1. The coefficient value was improved to 0.865 W· m−1· K−1 with 15 wt% of BN@15CNT and 10 wt% of BN. Although CNTs were adopted, the PBz composites maintained insulation. Dielectric properties and thermal stability of the composites were also studied. In addition, different thermal conduction models were used to manifest the mechanism of BN@CNT hybrid fillers in enhancing thermal conductivity of PBz composites.

scholarly journals 3D Interconnected Boron Nitride Networks in Epoxy Composites via Coalescence Behavior of SAC305 Solder Alloy as a Bridging Material for Enhanced Thermal Conductivity

Polymers ◽  
2020 ◽  
Vol 12 (9) ◽  
pp. 1954
Author(s):  
Youjin Kim ◽  
Jooheon Kim
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Conductive Filler ◽  
Thermal Curing ◽  
Sac305 Solder ◽  
Hybrid Filler ◽  
Filtration Method ◽  
Vacuum Filtration ◽  
Hybrid Fillers ◽  
Filler Network

In this study, hybrid fillers of spherically shaped aggregated boron nitride (a-BN) attached with SAC305, were fabricated via simple stirring and the vacuum filtration method. a-BN was used as the primary conductive filler incorporated with epoxy resin, and these fillers were interconnected each other via the coalescence behavior of SAC305 during the thermal curing process. Based on controlled a-BN content (1 g) on 3 g of epoxy, the thermal conductivity of the composite filled with hybrid filler (a-BN:SAC305 = 1:0.5) reached 0.95 W/mK (33 wt%) due to the construction of the 3D filler network, whereas that of composite filled with raw a-BN was only 0.60 W/mK (25 wt%). The thermal conductivity of unfilled epoxy was 0.19 W/mK.

scholarly journals Improved Thermal Conductivity of Styrene Acrylic Resin with Carbon Nanotubes, Graphene and Boron Nitride hybrid fillers

2021 ◽  
Author(s):  
Fuhua Jia ◽  
Emmanuel Oluwaseyi Fagbohun ◽  
Qianyu Wang ◽  
Duoyin Zhu ◽  
Jianling Zhang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Boron Nitride ◽  
Acrylic Resin ◽  
Hybrid Fillers

scholarly journals Improving thermal conductivity through welding boron nitride nanosheets onto silver nanowires via silver nanoparticles

2019 ◽  
Vol 177 ◽  
pp. 118-126 ◽  
Author(s):  
Chenjie Fu ◽  
Changzeng Yan ◽  
Linlin Ren ◽  
Xiaoliang Zeng ◽  
Guoping Du ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Silver Nanoparticles ◽  
Boron Nitride ◽  
Silver Nanowires ◽  
Boron Nitride Nanosheets

A thermal interface material based on foam-templated three-dimensional hierarchical porous boron nitride

2018 ◽  
Vol 6 (36) ◽  
pp. 17540-17547 ◽  
Author(s):  
Zhilin Tian ◽  
Jiajia Sun ◽  
Shaogang Wang ◽  
Xiaoliang Zeng ◽  
Shuang Zhou ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Three Dimensional ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Hierarchical Porous ◽  
Templated Method

A high thermal conductivity boron nitride based thermal interface material was developed by a foam-templated method.

Heat dissipative mechanical damping properties of EPDM rubber composites including hybrid fillers of aluminium nitride and boron nitride

Soft Matter ◽  
2020 ◽  
Vol 16 (29) ◽  
pp. 6812-6818 ◽  
Author(s):  
Jung Keun Cho ◽  
Hanna Sun ◽  
Hee Won Seo ◽  
June-Young Chung ◽  
Mina Seol ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Electronic Devices ◽  
Damping Properties ◽  
Critical Factors ◽  
Rubber Composites ◽  
Epdm Rubber ◽  
Hybrid Fillers ◽  
Automotive Parts ◽  
Mechanical Damping

As highly integrated electronic devices and automotive parts are becoming used in high-power and load-bearing systems, thermal conductivity and mechanical damping properties have become critical factors, which could be enhanced by the composites with the different-shaped hybrid fillers.

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