scholarly journals Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials

Polymers ◽  
2021 ◽  
Vol 13 (1) ◽  
pp. 147
Author(s):  
William Anderson Lee Sanchez ◽  
Chen-Yang Huang ◽  
Jian-Xun Chen ◽  
Yu-Chian Soong ◽  
Ying-Nan Chan ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Flip Chip ◽  
Coefficient Of Thermal Expansion ◽  
Decomposition Temperature ◽  
Infrared Images ◽  
Hybrid Filler ◽  
Thermal Infrared Images ◽  
The Impact ◽  
Enhanced Thermal Conductivity

In this study, a thermal conductivity of 0.22 W·m−1·K−1 was obtained for pristine epoxy (EP), and the impact of a hybrid filler composed of two-dimensional (2D) flake-like boron nitride (BN) and zero-dimensional (0D) spherical micro-sized aluminum oxide (Al2O3) on the thermal conductivity of epoxy resin was investigated. With 80 wt.% hybrid Al2O3–BN filler contents, the thermal conductivity of the EP composite reached 1.72 W·m−1·K−1, increasing approximately 7.8-fold with respect to the pure epoxy matrix. Furthermore, different important properties for the application were analyzed, such as Fourier-transform infrared (FTIR) spectra, viscosity, morphology, coefficient of thermal expansion (CTE), glass transition temperature (Tg), decomposition temperature (Td), dielectric properties, and thermal infrared images. The obtained thermal performance is suitable for specific electronic applications such as flip-chip underfill packaging.

scholarly journals 3D Printing of PDMS-Like Polymer Nanocomposites with Enhanced Thermal Conductivity: Boron Nitride Based Photocuring System

Nanomaterials ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 373 ◽  
Author(s):  
Lorenzo Pezzana ◽  
Giacomo Riccucci ◽  
Silvia Spriano ◽  
Daniele Battegazzore ◽  
Marco Sangermano ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Analysis ◽  
Boron Nitride ◽  
Thermal Analyses ◽  
Tensile Tests ◽  
Morphological Characterization ◽  
Digital Light Processing ◽  
Form Complex ◽  
K Value ◽  
Enhanced Thermal Conductivity

This study demonstrates the possibility of forming 3D structures with enhanced thermal conductivity (k) by vat printing a silicone–acrylate based nanocomposite. Polydimethylsiloxane (PDSM) represent a common silicone-based polymer used in several applications from electronics to microfluidics. Unfortunately, the k value of the polymer is low, so a composite is required to be formed in order to increase its thermal conductivity. Several types of fillers are available to reach this result. In this study, boron nitride (BN) nanoparticles were used to increase the thermal conductivity of a PDMS-like photocurable matrix. A digital light processing (DLP) system was employed to form complex structures. The viscosity of the formulation was firstly investigated; photorheology and attenuate total reflection Fourier-transform infrared spectroscopy (ATR-FTIR) analyses were done to check the reactivity of the system that resulted as suitable for DLP printing. Mechanical and thermal analyses were performed on printed samples through dynamic mechanical thermal analysis (DMTA) and tensile tests, revealing a positive effect of the BN nanoparticles. Morphological characterization was performed by scanning electron microscopy (SEM). Finally, thermal analysis demonstrated that the thermal conductivity of the material was improved, maintaining the possibility of producing 3D printable formulations.

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