scholarly journals Thermally Conductive and Electrical Insulation BNNS/CNF Aerogel Nano-Paper

Polymers ◽  
2019 ◽  
Vol 11 (4) ◽  
pp. 660 ◽  
Author(s):  
Wang ◽  
Yu ◽  
Bian ◽  
Wu ◽  
Xiao ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Volume Resistivity ◽  
Electrical Insulation ◽  
Heat Conducting ◽  
Working Process ◽  
Safety Issues ◽  
Blending Method ◽  
Thermally Conductive ◽  
Electrical Insulation Materials ◽  
Insulation Performance

Adding heat conducting particles to a polymer matrix to prepare thermally conductive and electrical insulation materials is an effective approach to address the safety issues arising from the accumulation of heat in the working process of electronic devices. In this work, thermally conductive and electrical insulation nano-paper, consisting of Boron Nitride nano-sheet (BNNS) and cellulose nanofiber (CNF), was prepared using an aerogel 3D skeleton template method. For comparison, BNNS/CNF nano-paper was also produced using a simple blending method. At a BNNS loading of 50 wt%, the thermal conductivity of BNNS/CNF aerogel nano-paper and blended nano-paper at 70 °C are 2.4 W/mK and 1.2 W/mK respectively, revealing an increase of 94.4%. Under similar conditions, the volume resistivity of BNNS/CNF aerogel nano-paper and blended nano-paper are 4.0 × 1014 and 4.2 × 1014 Ω·cm respectively. In view of its excellent thermal conductivity and electrical insulation performance, therefore, BNNS/CNF aerogel nano-paper holds great potential for electronic-related applications.

scholarly journals Enhanced thermal conductivity of graphene nanoplatelets epoxy composites

2017 ◽  
Vol 35 (2) ◽  
pp. 382-389 ◽  
Author(s):  
Lukasz Jarosinski ◽  
Andrzej Rybak ◽  
Karolina Gaska ◽  
Grzegorz Kmita ◽  
Renata Porebska ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Graphene Nanoplatelets ◽  
Electrical Insulation ◽  
Graphene Nanocomposites ◽  
Thermally Conductive ◽  
Conductive Particles ◽  
Proper Performance ◽  
Enhanced Thermal Conductivity

Abstract Efficient heat dissipation from modern electronic devices is a key issue for their proper performance. An important role in the assembly of electronic devices is played by polymers, due to their simple application and easiness of processing. The thermal conductivity of pure polymers is relatively low and addition of thermally conductive particles into polymer matrix is the method to enhance the overall thermal conductivity of the composite. The aim of the presented work is to examine a possibility of increasing the thermal conductivity of the filled epoxy resin systems, applicable for electrical insulation, by the use of composites filled with graphene nanoplatelets. It is remarkable that the addition of only 4 wt.% of graphene could lead to 132 % increase in thermal conductivity. In this study, several new aspects of graphene composites such as sedimentation effects or temperature dependence of thermal conductivity have been presented. The thermal conductivity results were also compared with the newest model. The obtained results show potential for application of the graphene nanocomposites for electrical insulation with enhanced thermal conductivity. This paper also presents and discusses the unique temperature dependencies of thermal conductivity in a wide temperature range, significant for full understanding thermal transport mechanisms.

scholarly journals Aerogel Perfusion-Prepared h-BN/CNF Composite Film with Multiple Thermally Conductive Pathways and High Thermal Conductivity

Nanomaterials ◽  
2019 ◽  
Vol 9 (7) ◽  
pp. 1051 ◽  
Author(s):  
Xiu Wang ◽  
Zhihuai Yu ◽  
Liang Jiao ◽  
Huiyang Bian ◽  
Weisheng Yang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Composite Film ◽  
Hexagonal Boron Nitride ◽  
Traditional Approach ◽  
Synthetic Polymer ◽  
Electrical Insulation ◽  
High Thermal Conductivity ◽  
Polymer Materials ◽  
Thermally Conductive ◽  
Electrical Insulation Properties

Hexagonal boron nitride (h-BN)-based heat-spreading materials have drawn considerable attention in electronic diaphragm and packaging fields because of their high thermal conductivity and desired electrical insulation properties. However, the traditional approach to fabricate thermally conductive composites usually suffers from low thermal conductivity, and cannot meet the requirement of thermal management. In this work, novel h-BN/cellulose-nano fiber (CNF) composite films with excellent thermal conductivity in through plane and electrical insulation properties are fabricated via an innovative process, i.e., the perfusion of h-BN into porous three dimensional (3D) CNF aerogel skeleton to form the h-BN thermally conductive pathways by filling the CNF aerogel voids. When at an h-BN loading of 9.51 vol %, the thermal conductivity of h-BN/CNF aerogel perfusion composite film is 1.488 W·m−1·K−1 at through plane, an increase by 260.3%. The volume resistivity is 3.83 × 1014 Ω·cm, superior to that of synthetic polymer materials (about 109~1013 Ω·cm). Therefore, the resulting h-BN/CNF film is very promising to replace the traditional synthetic polymer materials for a broad spectrum of applications, including the field of electronics.

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