scholarly journals Influence of Combustion Modifiers on the Cure Kinetics of Glycidyl Azide Polymer Based Propellant-Evaluated through Rheo-Kinetic Approach

Polymers ◽  
2019 ◽  
Vol 11 (4) ◽  
pp. 637 ◽  
Author(s):  
Liming He ◽  
Jun Zhou ◽  
Sulan Dai ◽  
Zhongliang Ma
Keyword(s):  
Measurement Method ◽  
Catalytic Effect ◽  
Cure Kinetics ◽  
Curing Process ◽  
Model Data ◽  
Glycidyl Azide Polymer ◽  
Rheological Measurement ◽  
Curing Reaction ◽  
Kinetics Of ◽  
Glycidyl Azide

To investigate the influence of combustion modifiers on the curing of glycidyl azide polymer spherical propellants (GAPSPs), the curing process of the GAPSPs was explored using an isothermal rheological measurement method. The parameters of cure kinetics were solved to further establish a kinetic model for the curing reaction of GAPSPs. The results showed that the curing process of GAPSPs under isothermal conditions conformed to the Kamal and LSK (Lu–Shim–Kim) models. The model data indicated significant agreement with the experimental data. The influence of four kinds of combustion performance modifiers on the curing process was explored and the results demonstrated that lead phthalate had a catalytic effect on the curing reaction of GAPSPs, whilst oxides of lead and copper, and copper adipate had no influence on the curing reaction.

Warpage Behaviors of System-in-Packages on a Substrate Strip

2018 ◽  
Vol 2018 (1) ◽  
pp. 000344-000348
Author(s):  
Eric Ouyang ◽  
Billy Ahn ◽  
SeonMo Gu ◽  
Jim Hsu ◽  
Yonghyuk Jeong ◽  
...  
Keyword(s):  
Material Characterization ◽  
Epoxy Resins ◽  
Curing Process ◽  
Molding Compound ◽  
Advanced Material ◽  
Curing Reaction ◽  
Different Types ◽  
The Impact ◽  
Compound Materials ◽  
Kinetics Of

Abstract In this paper, the impact of two different types of warpage, strip warpage and system-in-packages (SiP) module warpage, are considered and studied, both experimentally and numerically. An advanced material characterization method is also conducted to study the curing reaction and Pressure-Volume-Temperature-Cure (PVTC) kinetics of the packages. The curing reaction of epoxy resins, as a function of temperature and activation energies, is experimentally determined. During the curing process, the viscosity of epoxy resins change with temperature and conversion rate. The Castro-Macosko model is adopted to describe the rheological properties of epoxy resins. Experimentally, we have prepared substrate strip samples with different component density and molding compound materials. Each substrate strip contains eighteen system-in-packages. The warpages of all substrate strips and all the system-in-package modules were measured, compared, and correlated.

scholarly journals Curing Reaction Kinetics of the EHTPB-Based PBX Binder System and Its Mechanical Properties

Coatings ◽  
2020 ◽  
Vol 10 (12) ◽  
pp. 1266
Author(s):  
Xing Zhang ◽  
Yucun Liu ◽  
Tao Chai ◽  
Zhongliang Ma ◽  
Kanghui Jia
Keyword(s):  
Mechanical Properties ◽  
Thermal Stability ◽  
Reaction Kinetics ◽  
Testing Machine ◽  
Curing Process ◽  
Binder System ◽  
Isophorone Diisocyanate ◽  
Scanning Calorimetry ◽  
Curing Reaction ◽  
Kinetics Of

In this research, differential scanning calorimetry (DSC) was employed to compare the curing reaction kinetics of the epoxidized hydroxyl terminated polybutadiene-isophorone diisocyanate (EHTPB-IPDI) and hydroxyl terminated polybutadiene-isophorone diisocyanate (HTPB-IPDI) binder systems. Glass transition temperature (Tg) and mechanical properties of the EHTPB-IPDI and HTPB-IPDI binder systems were determined using the DSC method and a universal testing machine, respectively. For the EHTPB-IPDI binder system, the change of viscosity during the curing process in the presence of dibutyltin silicate (DBTDL) and tin 2-ethylhexanoate (TECH) catalysts was studied, and the activation energy was estimated. The results show that the activation energies (Ea) of the curing reaction of the EHTPB-IPDI and HTPB-IPDI binder systems are 53.8 and 59.1 kJ·mol−1, respectively. While their average initial curing temperatures of the two systems are 178.2 and 189.5 °C, respectively. The EHTPB-IPDI binder system exhibits a higher reactivity. Compared with the HTPB-IPDI binder system, the Tg of the EHTPB-IPDI binder system is increased by 5 °C. Its tensile strength and tear strength are increased by 12% and 17%, respectively, while its elongation at break is reduced by 10%. Epoxy groups and isocyanates react to form oxazolidinones, thereby improving the mechanical properties and thermal stability of polyurethane materials. These differences indicate that the EHTPB-IPDI binder system has better thermal stability and mechanical properties. During the EHTPB-IPDI binder system’s curing process, the DBTDL catalyst may ensure a higher viscosity growth rate, indicating a better catalytic effect, consistent with the prediction results obtained using the non-isothermal kinetic analysis method.

Kinetics of the Curing Reaction of a Diglycidyl Ether of Bisphenol with a Methanol Etherified Amino Resin

2011 ◽  
Vol 380 ◽  
pp. 60-63 ◽  
Author(s):  
Yong Lv ◽  
Zhu Long ◽  
Shi Yong Luo ◽  
Lei Dai
Keyword(s):  
Cure Kinetics ◽  
Frequency Factor ◽  
Diglycidyl Ether ◽  
Heating Rates ◽  
Scanning Calorimetry ◽  
Curing Reaction ◽  
Before And After ◽  
Amino Resin ◽  
Chemical Products ◽  
Kinetics Of

Subscript text Subscript textEpoxy resins have been widely used for inner coating in food can and other chemical products storage containers. Differential scanning calorimetry (DSC) was used at different heating rates to study the cure kinetics of the diglycidyl ether of bisphenol A (DGEBA) with a methanol etherified amino resin (MEAR). The apparent activation energy derived from Kissinger and Ozawa methods is 35.67KJ/mol and 40.27kJ/mol, respectively. The reaction order evaluated by Crane equation is 0. 95 and the frequency factor is 1.12×104s-1. Reaction mechanism was monitored by FTIR spectra of the reaction mixtures before and after curing. The curing reaction below 200°C is between alkoxylmethyl (>NCH2OCH3) and epoxide group, not between alkoxylmethyl and hydroxyls.

Curing Kinetics of Anisotropic Conductive Adhesive in the Manufacturing Process of RFID Tags

2013 ◽  
Vol 798-799 ◽  
pp. 17-24
Author(s):  
Shou Yuan Fan ◽  
Jian Kui Chen ◽  
Zhou Ping Yin
Keyword(s):  
Activation Energy ◽  
Curing Kinetics ◽  
Conductive Adhesive ◽  
Curing Process ◽  
Heating Rates ◽  
Degree Of Cure ◽  
Anisotropic Conductive Adhesive ◽  
Curing Reaction ◽  
Model Free ◽  
Kinetics Of

The study of the epoxy-based anisotropic conductive adhesive in electronic packaging interconnects applications (chip-on-glass, chip-on-flex, etc. especially in RFID applications) has received particular attention. This is due to its potential advantages of finer pitch printing, reducing environmental contamination. The thermal curing process is critical to develop the ultimate electrical and mechanical properties of the ACA devices. In this article, the curing kinetics of ACA was studied with a differential scanning calorimeter (DSC) under constant heating rates conditions in the range of 520 °C/min. The model free method was used to describe the curing reaction. The degree-of-cure and the activation energy through the whole conversion range were mathematically determined and used to predict the progress of the curing process. Experimental results show that the activation energy of the ACA varies significantly with degree-of-cure during the curing process. The peculiar phenomenon indicates that the ACA underwent a complex series of reactions. The kinetics of curing reaction changes when large conversion values are reached at low heating rates. The change in the reaction kinetics is due to vitrification of the ACA during heating. In addition, the degree-of-cure of the ACA as a function of bonding times during isothermal ACA bonding process was theoretically predicted.

Kinetics modeling of the reaction for an Epoxy/PMMA/MMT ternary system

e-Polymers ◽  
2007 ◽  
Vol 7 (1) ◽  
Author(s):  
Marcelo Hernandez ◽  
Jérôme Dupuy ◽  
Jannick Duchet ◽  
Henry Sautereau
Keyword(s):  
Differential Scanning Calorimetry ◽  
Ternary System ◽  
Catalytic Effect ◽  
Dilution Effect ◽  
Cure Kinetics ◽  
Scanning Calorimetry ◽  
Epoxy Amine ◽  
Cloisite 30B ◽  
Kinetics Of ◽  
Good Agreement

Abstract The effect of thermoplastic PMMA and clay Cloisite 30B addition on the cure kinetics of an epoxy/amine thermosetting system was investigated using differential scanning calorimetry (DSC) and modelled using a single kinetic model. For obtaining a good agreement between the experimental results and theoretical modeling, it was necessary to separate the ternary system in two formulations: matrix/PMMA and matrix/clay systems. It appeared that the addition of PMMA delays the reaction up to the phase separation phenomenon due to a dilution effect of the reactive species. In opposition, the presence of clays accelerates the reaction (probably due to a catalytic effect of some metals ions introduced with the clay) but it has no sensitive effect on the cloud point conversion in the presence of PMMA. The modeling results are in good agreement with those experimentally obtained.

Kinetic Studies on Epoxy Resins Cured with a Novel Polyamine

1992 ◽  
Vol 4 (1) ◽  
pp. 41-48 ◽  
Author(s):  
R. M. V. G. K. Rao ◽  
A. Padma ◽  
H. S. Patel
Keyword(s):  
Activation Energy ◽  
Epoxy Resin ◽  
Epoxy Resins ◽  
Kinetic Studies ◽  
Cure Kinetics ◽  
Curing Process ◽  
Kinetics Of

Differential scanning calorimeny was used to study the cure kinetics of three epoxy resin systems cured with two hardeners: diaminodiphenylmethane (DDM) and a poly (keto-amine) (PA). The results showved that the curing of the epoxy resins by PA occurs at higher temperatures and the activation energy for PA curing was higher compared with the DDM curing process, showing the er reactivity of PA.

Kinetics of glycidyl azide polymer-based urethane network formation

2008 ◽  
Vol 110 (2) ◽  
pp. 908-914 ◽  
Author(s):  
S. K. Manu ◽  
V. Sekkar ◽  
K. J. Scariah ◽  
T. L. Varghese ◽  
S. Mathew
Keyword(s):  
Network Formation ◽  
Glycidyl Azide Polymer ◽  
Kinetics Of ◽  
Glycidyl Azide
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