scholarly journals Theoretical Study on Synchronous Characterization of Surface and Interfacial Mechanical Properties of Thin-Film/Substrate Systems with Residual Stress Based on Pressure Blister Test Technique

Polymers ◽  
2018 ◽  
Vol 10 (1) ◽  
pp. 49 ◽  
Author(s):  
Zhi-xin Yang ◽  
Jun-yi Sun ◽  
Ke Li ◽  
Yong-sheng Lian ◽  
Xiao-ting He ◽  
...  
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Residual Stress ◽  
Theoretical Study ◽  
Test Technique ◽  
Blister Test ◽  
Film Substrate

Effect of the Mechanical Properties and Geometric Parameters on the Crack Density of the Thin Film/Substrate System under Residual Stress and Uniaxial Tensile Loading

2013 ◽  
Vol 470 ◽  
pp. 521-524
Author(s):  
Ban Quan Yang ◽  
Jun Du ◽  
Xue Jun Chen ◽  
Wei Hai Sun ◽  
Hong Qian Chen ◽  
...  
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Residual Stress ◽  
Crack Density ◽  
Tensile Loading ◽  
Interface Layer ◽  
Geometric Parameters ◽  
Uniaxial Tensile ◽  
Uniaxial Tensile Loading ◽  
Film Substrate

The effect of the mechanical properties and geometric parameters on the crack density of the thin film/substrate system under residual stress and uniaxial tensile loading is investigated in this work. The numerical results show that the crack density of the thin film increases with the increase of the Youngs modulus of the thin film and (or) the shear modules of the interface layer, and it decreases with the increase of the thickness of the thin film and (or) the fracture strength of the thin film. These results can help us more deeply understand the fracture behavior of the brittle thin film on the substrate under residual stress and external tensile loading.

Microstructural and fractographic characterization of B4C-Al cermets tested under dynamic and static loading

1989 ◽  
Vol 47 ◽  
pp. 562-563
Author(s):  
Gyeung Ho Kim ◽  
Mehmet Sarikaya ◽  
D. L. Milius ◽  
I. A. Aksay
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Fracture Toughness ◽  
Static Loading ◽  
Carbon Deposition ◽  
Full Density ◽  
Unique Combination ◽  
Strong Component ◽  
Reaction Products

Cermets are designed to optimize the mechanical properties of ceramics (hard and strong component) and metals (ductile and tough component) into one system. However, the processing of such systems is a problem in obtaining fully dense composite without deleterious reaction products. In the lightweight (2.65 g/cc) B4C-Al cermet, many of the processing problems have been circumvented. It is now possible to process fully dense B4C-Al cermet with tailored microstructures and achieve unique combination of mechanical properties (fracture strength of over 600 MPa and fracture toughness of 12 MPa-m1/2). In this paper, microstructure and fractography of B4C-Al cermets, tested under dynamic and static loading conditions, are described.The cermet is prepared by infiltration of Al at 1150°C into partially sintered B4C compact under vacuum to full density. Fracture surface replicas were prepared by using cellulose acetate and thin-film carbon deposition. Samples were observed with a Philips 3000 at 100 kV.

Measurements of Residual Stress in the Layers of Thin Film Micro-Gas Sensors

2000 ◽  
Vol 657 ◽  
Author(s):  
Youngman Kim ◽  
Sung-Ho Choo
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Residual Stress ◽  
Gas Sensor ◽  
Gas Sensors ◽  
Micro Gas Sensor ◽  
Thin Film Layer ◽  
Film Layer ◽  
The Difference ◽  
Stress States

ABSTRACTThe mechanical properties of thin film materials are known to be different from those of bulk materials, which are generally overlooked in practice. The difference in mechanical properties can be misleading in the estimation of residual stress states in micro-gas sensors with multi-layer structures during manufacturing and in service.In this study the residual stress of each film layer in a micro-gas sensor was measured according to the five difference sets of film stacking structure used for the sensor. The Pt thin film layer was found to have the highest tensile residual stress, which may affect the reliability of the micro-gas sensor. For the Pt layer the changes in residual stress were measured as a function of processing variables and thermal cycling.

scholarly journals The Effect of Stress on the Nanomechanical Properties of Au Surfaces

1996 ◽  
Vol 440 ◽  
Author(s):  
J. E. Houston
Keyword(s):  
Thin Film ◽  
Residual Stress ◽  
Local Level ◽  
Maximum Shear Stress ◽  
Critical Role ◽  
Film Stress ◽  
Indentation Modulus ◽  
Nanomechanical Properties ◽  
Average Grain Size ◽  
Film Substrate

AbstractStress in thin films plays a critical role in many technologically important areas. The role is a beneficial one in strained layer superlattices where semiconductor electrical and optical properties can be tailored with film stress. On the negative side, residual stress in thin-film interconnects in microelectronics can lead to cracking and delamination. In spite of their importance, however, surface and thin-film stresses are difficult to measure and control, especially on a local level. In recent studies, we used the Interfacial Force Microscope (IFM) in a nanoindenter mode to survey the nanomechanical properties of Au films grown on various substrates. Quantitative tabulations of the indentation modulus and the maximum shear stress at the plastic threshold showed consistent values over individual samples but a wide variation from substrate to substrate. These values were compared with film properties such as surface roughness, average grain size and interfacial adhesion and no correlation was found. However, in a subsequent analysis of the results, we found consistencies which support the integrity of the data and point to the fact that the results are sensitive to some property of the various film/substrate combinations. In recent measurements on two of the original substrate materials we found a direct correlation between the nanomechanical values and the residual stress in the films, as measured globally by a wafer warping technique. In the present paper, we review these earlier results and show recent measurements dealing with stresses externally applied to the films which supports our earlier conclusion concerning the role of stress on our measurements. In addition, we present very recent results concerning morphological effects on nanomechanical properties which add additional support to the suggestion that near-threshold indentation holds promise of being able to measure stress on a very local level

X-ray Standing Waves in X-ray Specular Reflection and Fluorescence Study of Nano-Films

1997 ◽  
Vol 30 (5) ◽  
pp. 833-838 ◽  
Author(s):  
S. I. Zheludeva ◽  
M. V. Kovalchuk ◽  
N. N. Novikova ◽  
A. N. Sosphenov ◽  
N. N. Salaschenko ◽  
...  
Keyword(s):  
Thin Film ◽  
Specular Reflection ◽  
Fluorescence Study ◽  
Reflection Curve ◽  
X Ray ◽  
Inorganic Films ◽  
Film Substrate ◽  
Mode Formation ◽  
Ultra Thin Film

The analysis of the wavefield intensity distribution connected with X-ray standing wave (XRSW) generation above the mirror surface at total reflection (TR) is presented for a vacuum/film/substrate sample along with experimental examples for organic and inorganic films for cases where the refractive index of the film is greater than that of the substrate. The thickness of an ultra-thin film may be estimated from the value of the XRSW period formed above the film/substrate interface at TR. In some cases, the thickness of an ultra-thin film may be roughly obtained just from the form of the X-ray reflection curve at incident angles smaller than the critical angle of the substrate. It is demonstrated that interference phenomena at TR, leading to waveguide mode formation inside the layered structure and responsible for a modulation of the X-ray reflection and fluorescence angular dependence, can be used for characterization of nano-films.

Characterization of Mechanical Properties and Residual Stress in API 5L X80 Steel Welded Joints

2017 ◽  
Vol 27 (1) ◽  
pp. 124-137 ◽  
Author(s):  
Amilton de Sousa Lins ◽  
Luís Felipe Guimarães de Souza ◽  
Maria Cindra Fonseca
Keyword(s):  
Mechanical Properties ◽  
Residual Stress ◽  
Welded Joints ◽  
X80 Steel
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