scholarly journals Prediction of Lap Shear Strength and Impact Peel Strength of Epoxy Adhesive by Machine Learning Approach

Nanomaterials ◽  
2021 ◽  
Vol 11 (4) ◽  
pp. 872
Author(s):  
Haisu Kang ◽  
Ji Hee Lee ◽  
Youngson Choe ◽  
Seung Geol Lee

In this study, an artificial neural network (ANN), which is a machine learning (ML) method, is used to predict the adhesion strength of structural epoxy adhesives. The data sets were obtained by testing the lap shear strength at room temperature and the impact peel strength at −40 °C for specimens of various epoxy adhesive formulations. The linear correlation analysis showed that the content of the catalyst, flexibilizer, and the curing agent in the epoxy formulation exhibited the highest correlation with the lap shear strength. Using the analyzed data sets, we constructed an ANN model and optimized it with the selection set and training set divided from the data sets. The obtained root mean square error (RMSE) and R2 values confirmed that each model was a suitable predictive model. The change of the lap shear strength and impact peel strength was predicted according to the change in the content of components shown to have a high linear correlation with the lap shear strength and the impact peel strength. Consequently, the contents of the formulation components that resulted in the optimum adhesive strength of epoxy were obtained by our prediction model.

Author(s):  
Panta Jojibabu ◽  
M. Jagannatham ◽  
Prathap Haridoss ◽  
G.D. Janaki Ram ◽  
Abhijit P. Deshpande ◽  
...  

2019 ◽  
Vol 97 (2) ◽  
pp. 117-139 ◽  
Author(s):  
Sunil Kumar Gupta ◽  
Dharmendra Kumar Shukla ◽  
Dhake Kaustubh Ravindra

2007 ◽  
Vol 1 (1) ◽  
pp. 56-63 ◽  
Author(s):  
Sung-Woo Cho ◽  
Henrik Ullsten ◽  
Mikael Gällstedt ◽  
Mikael S. Hedenqvist

The impulse heat-sealing properties of wheat gluten films were investigated. Films containing 30 wt% glycerol were compression molded at 100–130 °C and then sealed in a lap-shear or peel-test geometry at 120–175 °C. The tensile properties of the pristine films and the lap-shear and peel strength of the sealed films were evaluated and the seals were examined by scanning electron microscopy. Glycerol was added to the film surfaces prior to sealing in an attempt to enhance the seal strength. It was observed that the wheat gluten films were readily sealable. At a 120 °C sealing temperature and without glycerol as adhesive, the lap-shear strength was greater than or similar to that of polyethylene film, although the peel strength was poorer. The sealing temperature had a negligible effect on the lap-shear strength, but the peel strength increased with sealing temperature. The lap-shear strength increased with increasing mold temperature and the failure mode changed, especially in the absence of glycerol adhesive, from a cohesive (material failure) to an adhesive type. From previous results, it is known that the high-temperature (130 °C) compression-molded film was highly cross-linked and aggregated, and this prevents molecular interdiffusion and entanglement and thus leads to incomplete seal fusion and, in general, adhesive failure. The presence of glycerol adhesive had a beneficial affect on the peel strength but no, or only a minor, effect on the lap-shear strength.


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