scholarly journals Rapid Inkjet-Printed Miniaturized Interdigitated Electrodes for Electrochemical Sensing of Nitrite and Taste Stimuli

Micromachines ◽  
2021 ◽  
Vol 12 (9) ◽  
pp. 1037
Author(s):  
Sohan Dudala ◽  
Sangam Srikanth ◽  
Satish Kumar Dubey ◽  
Arshad Javed ◽  
Sanket Goel
Keyword(s):  
Inkjet Printing ◽  
Glass Substrate ◽  
Printed Circuit Board ◽  
Electrochemical Impedance ◽  
Single Step ◽  
Electrochemical Sensing ◽  
Circuit Board ◽  
Interdigitated Electrodes ◽  
Sensing Applications ◽  
Direct Laser

This paper reports on single step and rapid fabrication of interdigitated electrodes (IDEs) using an inkjet printing-based approach. A commercial inkjet-printed circuit board (PCB) printer was used to fabricate the IDEs on a glass substrate. The inkjet printer was optimized for printing IDEs on a glass substrate using a carbon ink with a specified viscosity. Electrochemical impedance spectroscopy in the frequency range of 1 Hz to 1 MHz was employed for chemical sensing applications using an electrochemical workstation. The IDE sensors demonstrated good nitrite quantification abilities, detecting a low concentration of 1 ppm. Taste simulating chemicals were used to experimentally analyze the ability of the developed sensor to detect and quantify tastes as perceived by humans. The performance of the inkjet-printed IDE sensor was compared with that of the IDEs fabricated using maskless direct laser writing (DLW)-based photolithography. The DLW–photolithography-based fabrication approach produces IDE sensors with excellent geometric tolerances and better sensing performance. However, inkjet printing provides IDE sensors at a fraction of the cost and time. The inkjet printing-based IDE sensor, fabricated in under 2 min and costing less than USD 0.3, can be adapted as a suitable IDE sensor with rapid and scalable fabrication process capabilities.

Well-defined polyindole–Au NPs nanobrush as a platform for electrochemical oxidation of ethanol

2021 ◽  
Vol 0 (0) ◽  
Author(s):  
Magdalena Warczak ◽  
Marianna Gniadek ◽  
Kamil Hermanowski ◽  
Magdalena Osial
Keyword(s):  
Conducting Polymers ◽  
Hybrid Material ◽  
Noble Metals ◽  
Electrochemical Impedance ◽  
Electrochemical Sensing ◽  
Alkaline Media ◽  
X Ray Diffraction ◽  
Long Term Stability ◽  
Sensing Applications ◽  
Energy Conversion Devices

Abstract Over the recent decades, conducting polymers have received great interest in many fields including microelectronics, energy conversion devices, and biosensing due to their unique properties like electrical conductivity, stability, and simple synthesis. Modification of conducting polymers with noble metals e.g. gold enhances their properties and opens new opportunities to also apply them in other fields like electrocatalysis. Here, we focus on the synthesis of hybrid material based on polyindole (PIN) nanobrush modified with gold nanoparticles and its application towards electrooxidation of ethanol. The paper presents systematic studies from synthesis to electrochemical sensing applications. For the characterization of PIN–Au composites, scanning electron microscopy and X-ray diffraction analyses were used. The electrocatalytic performance of the proposed hybrid material towards alcohol oxidation was studied in alkaline media by cyclic voltammetry, chronoamperometry, and electrochemical impedance spectroscopy techniques. The results show that PIN–Au hybrid can be employed as an effective and sensitive platform for the detection of alcohols, which makes it a promising material in electrocatalysis or sensors. Moreover, the proposed composite exhibits electrocatalytic activity towards ethanol oxidation, which combined with its good long-term stability opens the opportunity for its application in fuel cells.

A Comparison of Immersion Gold and Tin Surface Finishes on Sensing Electrodes for PCB Environmental Saltwater Concentration Sensors

2016 ◽  
Vol 2016 (1) ◽  
pp. 000557-000562
Author(s):  
Robert N. Dean ◽  
Frank T. Werner ◽  
Michael J. Bozack
Keyword(s):  
Surface Finish ◽  
Printed Circuit Board ◽  
Chemical Constituents ◽  
Low Cost ◽  
Circuit Board ◽  
Testing Environment ◽  
Printed Circuit ◽  
Sensor Performance ◽  
Sensing Applications ◽  
Surface Finishes

Abstract Printed circuit board (PCB) sensors using low-cost commercial printed circuit board fabrication processes have been demonstrated for environmental sensing applications. One configuration of these sensors uses exposed electrodes to measure saltwater concentration in freshwater/seawater mixtures, through monitoring the resistance between the electrodes when they are immersed in the saltwater/freshwater solution. The lowest cost commercial PCB processes use an immersion Sn HASL surface finish on exposed copper cladding, including the sensing electrodes. This commercial PCB process has been demonstrated to make an effective, low-cost, short-lifetime sensor for saltwater concentration testing. The Sn finish, however, may not be optimal for this application. Sn oxidizes, which can interfere with sensor performance. Additionally, Sn and Sn oxides are potentially reactive with chemical constituents in seawater and seawater/freshwater solutions. An immersion Au (ENIG) surface finish is certainly less reactive with the atmosphere and chemicals likely present in the testing environment. However, an immersion Au finish increases the cost of the sensors by 30% to 40%. To investigate if the possible benefits of the more expensive Au surface finish are worth the extra expense, a study was performed where identical PCB sensors were procured from a commercial vendor with their standard low-cost Sn HASL finish and with their standard ENIG surface finish. Both sets of sensors were then evaluated in concentrations of seawater and freshwater, from 0% to 100% seawater concentration, using freshwater samples from a natural freshwater source near the coast where the seawater was obtained. Testing demonstrated an insignificant difference in sensor performance between the Sn HASL and the ENIG coated sensing electrodes. The results of this investigation indicated that for applications where the sensors will not be used for long periods of time, the added expense of an immersion Au surface finish is not worth the added cost.

scholarly journals AlN-on-Si Square Diaphragm Piezoelectric Micromachined Ultrasonic Transducer with Extended Range of Detection

Proceedings ◽  
2018 ◽  
Vol 2 (13) ◽  
pp. 913 ◽  
Author(s):  
Suresh Alasatri ◽  
Libor Rufer ◽  
Joshua En-Yuan Lee
Keyword(s):  
Printed Circuit Board ◽  
Ultrasonic Transducer ◽  
Ultrasonic Transducers ◽  
Circuit Board ◽  
Detection Range ◽  
Range Finding ◽  
Sensing Applications ◽  
Current State ◽  
Wire Bonds ◽  
Extended Range

We present aluminum nitride (AlN) on silicon (Si) CMOS-compatible piezoelectric micromachined ultrasonic transducers (pMUTs) with an extended detection range of up to 140 cm for touchless sensing applications. The reported performance surpasses the current state-of-art for AlN-based pMUTs in terms of the maximum range of detection using just a pair of pMUTs (as opposed to an array of pMUTs). The extended range of detection has been realized by using a larger diaphragm allowed by fabricating a thicker diaphragm than most other pMUTs reported to date. Using a pair of pMUTs, we experimentally demonstrate the capability of range-finding by correlating the time-of-flight (TOF) between the transmit (TX) and receive (RX) pulse. The results were obtained using an experimental setup where the MEMS chip was interconnected with a customized printed circuit board (PCB) using Al wire bonds.

Nanomonitor Technology for Glycosylation Analysis

2009 ◽  
Vol 1236 ◽  
Author(s):  
Gaurav Chatterjee ◽  
Manish Bothara ◽  
Srivatsa Aithal ◽  
Vinay J Nagraj ◽  
Peter Wiktor ◽  
...  
Keyword(s):  
Double Layer ◽  
Electrical Double Layer ◽  
Printed Circuit Board ◽  
Electrochemical Impedance ◽  
Electrochemical Techniques ◽  
Protein Glycosylation ◽  
Circuit Board ◽  
Biological Macromolecules ◽  
Label Free ◽  
Alumina Membrane

AbstractChanges in protein glycosylation have great potential as markers for the early diagnosis of cancer and other diseases. The current analytical tools for the analysis of glycan structures need expensive instrumentation, advanced expertise, is time consuming and therefore not practical for routine screening of glycan biomarkers from human samples in a clinical setting.We are developing a novel ultrasensitive diagnostic platform called ‘NanoMonitor’ to enable rapid label-free glycosylation analysis. The technology is based on electrochemical impedance spectroscopy where capacitance changes are measured at the electrical double layer interface as a result of interaction of two molecules.The NanoMonitor platform consists of a printed circuit board with array of electrodes forming multiple sensor spots. Each sensor spot is overlaid with a nanoporous alumina membrane that forms a high density of nanowells. Lectins, proteins that bind to and recognize specific glycan structures, are conjugated to the surface of nanowells. When specific glycoproteins from a test sample bind to lectins in the nanowells, it produces a perturbation to the electrical double layer at the solid/liquid interface at the base of each nanowell. This perturbation results in a change in the impedance of the double layer which is dominated by the capacitance changes within the electrical double layer.The nanoscale confinement or crowding of biological macromolecules within the nanowells is likely to enhance signals from the interaction of glycoproteins with the lectins leading to a high sensitivity of detection with the NanoMonitor as compared to other electrochemical techniques.Using a panel of lectins, we were able to detect subtle changes in the glycosylation of fetuin protein as well as differentiate glycoproteins from normal versus cancerous cells. Our results indicate that NanoMonitor can be used as a cost-effective miniature electronic biosensor for the detection of glycan biomarkers.

3D SiP Assembly and Reliability for Glass Substrate with Through Vias

2016 ◽  
Vol 2016 (1) ◽  
pp. 000282-000287
Author(s):  
Ra-Min Tain ◽  
Dyi-Chung Hu ◽  
Kai-Ming Yang ◽  
Yu-Hua Chen ◽  
Jui-Tang Chen ◽  
...  
Keyword(s):  
Glass Substrate ◽  
High Performance ◽  
Printed Circuit Board ◽  
Dielectric Material ◽  
Mechanical Test ◽  
Circuit Board ◽  
Material Structure ◽  
Back Side ◽  
Glass Technology ◽  
Resistance Change

Abstract Applications of Glass substrate for high performance system-in-package (SiP) products have gradually become a promising technology in recent years. Research and development activities are reported in many journal papers and conferences [1,2]. Consortiums and Alliances are also formed to gather worldwide efforts for developing glass technology. In the past, we have published our development efforts on the process of producing glass substrate with through via and build-up redistribution circuit layers (RDLs) [3]. N. Koizumi [4] first reported glass reliability issues in 2013; and the phenomena he called SE-WA-RE has caused a great concern of using glass as a substrate. Model simulations have indicated that the glass crack is related to the stress buildup by the materials and structure. In this study, we selected a dielectric material/structure set that is designed to be less stressful to the glass substrate. A better reliability result can be expected. In this paper, we will discuss an assembly structure of SiP module using the glass substrate with through-glass via (TGV) where the diameter of TGV is 100μm with thickness at 200μm. The copper plating technique to form the through via conductor is called direct-metal-on-glass (DMoG) which deposits titanium and copper directly on glass both in the wall of through vias and on glass surfaces of both sides. The first RDL is formed on both surfaces of glass substrate by semi-additive plating (SAP); then followed by build-up RDLs on top of the DMoG RDLs on both sides of the substrate also by SAP with interconnect vias to form connections between DMoG RDLs and build-up RDLs. Finally, solder mask is applied on both sides of the glass substrate leaving pad openings (SRO) for surface finish, die mounting and printed-circuit board connection purposes. At die mounting side, the SRO is 60μm in diameter with minimum pitch at 150μm. The TGV conductors connect the DMoG RDLs on both sides of the substrate. A mechanical test die with 18μm bump diameter is mounted on the build-up RDL at the substrate top side with daisy-chain design both in the test die and TGV substrate RDLs. Thus, the daisy-chain connection can go from the build-up RDL of the substrate back side to the test die on the top side of the substrate. 200 thermal-cycling test (TCT) has been performed and the daisy-chain resistances are measured before and after the 200 TCTs. It is found that 96% of daisy-chains have less than 10% of resistance change after 200 TCTs.

Patterned ZnO Nanowires between Interdigitated Electrodes by Integrating Hydrothermal Approach with Photolithography Process

2020 ◽  
Vol 990 ◽  
pp. 283-287
Author(s):  
Yaw Jen Chang
Keyword(s):  
Copper Foil ◽  
Printed Circuit Board ◽  
Simple Approach ◽  
Zno Nanowires ◽  
Circuit Board ◽  
Interdigitated Electrodes ◽  
Printed Circuit ◽  
Lift Off ◽  
Hydrothermal Approach ◽  
Photolithography Process

This paper presents a simple approach to selectively synthesize the ZnO nanowires between interdigitated electrodes by integrating the hydrothermal method with the photolithography process. The printed circuit board (PCB) was adopted as the substrate. Interdigitated electrodes were fabricated by etching the copper foil of PCB. Then, both the positive and negative photoresists were used to control the growth of nanowires through lift-off concept. No costly materials and expensive apparatuses are required. Biotin–streptavidin reaction was used as an example to examine this proposed device. When histidine-tagged biotin was added and the reaction of biotin–streptavidin was completed, the distinguishable I-V curves were detected, respectively. The experimental results reveal that this proposed device is sensitive.

PDMS-based microfluidic device with multi-height structures fabricated by single-step photolithography using printed circuit board as masters

The Analyst ◽  
2003 ◽  
Vol 128 (9) ◽  
pp. 1137 ◽  
Author(s):  
Cheuk-Wing Li ◽  
Chung Nam Cheung ◽  
Jun Yang ◽  
Chi Hung Tzang ◽  
Mengsu Yang
Keyword(s):  
Microfluidic Device ◽  
Printed Circuit Board ◽  
Single Step ◽  
Circuit Board ◽  
Printed Circuit

scholarly journals Printable graphene BioFETs for DNA quantification in Lab-on-PCB microsystems

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Sotirios Papamatthaiou ◽  
Pedro Estrela ◽  
Despina Moschou
Keyword(s):  
Printed Circuit Board ◽  
Point Of Care ◽  
Dna Amplification ◽  
Electrochemical Sensing ◽  
Circuit Board ◽  
Label Free ◽  
Transistor Channel ◽  
Lab On Chip ◽  
Passive Electrode ◽  
On Chip

AbstractLab-on-Chip is a technology that aims to transform the Point-of-Care (PoC) diagnostics field; nonetheless a commercial production compatible technology is yet to be established. Lab-on-Printed Circuit Board (Lab-on-PCB) is currently considered as a promising candidate technology for cost-aware but simultaneously high specification applications, requiring multi-component microsystem implementations, due to its inherent compatibility with electronics and the long-standing industrial manufacturing basis. In this work, we demonstrate the first electrolyte gated field-effect transistor (FET) DNA biosensor implemented on commercially fabricated PCB in a planar layout. Graphene ink was drop-casted to form the transistor channel and PNA probes were immobilized on the graphene channel, enabling label-free DNA detection. It is shown that the sensor can selectively detect the complementary DNA sequence, following a fully inkjet-printing compatible manufacturing process. The results demonstrate the potential for the effortless integration of FET sensors into Lab-on-PCB diagnostic platforms, paving the way for even higher sensitivity quantification than the current Lab-on-PCB state-of-the-art of passive electrode electrochemical sensing. The substitution of such biosensors with our presented FET structures, promises further reduction of the time-to-result in microsystems combining sequential DNA amplification and detection modules to few minutes, since much fewer amplification cycles are required even for low-abundance nucleic acid targets.

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