scholarly journals Lossless Decompression Accelerator for Embedded Processor with GUI

Micromachines ◽  
2021 ◽  
Vol 12 (2) ◽  
pp. 145
Author(s):  
Gwan Beom Hwang ◽  
Kwon Neung Cho ◽  
Chang Yeop Han ◽  
Hyun Woo Oh ◽  
Young Hyun Yoon ◽  
...  
Keyword(s):  
Embedded System ◽  
High Performance ◽  
Complementary Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Clock Frequency ◽  
Embedded Processor ◽  
Mobile Industry ◽  
Field Programmable ◽  
The Embedded System

The development of the mobile industry brings about the demand for high-performance embedded systems in order to meet the requirement of user-centered application. Because of the limitation of memory resource, employing compressed data is efficient for an embedded system. However, the workload for data decompression causes an extreme bottleneck to the embedded processor. One of the ways to alleviate the bottleneck is to integrate a hardware accelerator along with the processor, constructing a system-on-chip (SoC) for the embedded system. In this paper, we propose a lossless decompression accelerator for an embedded processor, which supports LZ77 decompression and static Huffman decoding for an inflate algorithm. The accelerator is implemented on a field programmable gate array (FPGA) to verify the functional suitability and fabricated in a Samsung 65 nm complementary metal oxide semiconductor (CMOS) process. The performance of the accelerator is evaluated by the Canterbury corpus benchmark and achieved throughput up to 20.7 MB/s at 50 MHz system clock frequency.

scholarly journals The Design of a 2D Graphics Accelerator for Embedded Systems

Electronics ◽  
2021 ◽  
Vol 10 (4) ◽  
pp. 469
Author(s):  
Hyun Woo Oh ◽  
Ji Kwang Kim ◽  
Gwan Beom Hwang ◽  
Seung Eun Lee
Keyword(s):  
Embedded Systems ◽  
Embedded System ◽  
Real Time ◽  
Line Drawing ◽  
Cmos Process ◽  
Embedded Processor ◽  
Processor Core ◽  
Field Programmable ◽  
The Embedded System ◽  
Graphics Processing

Recently, advances in technology have enabled embedded systems to be adopted for a variety of applications. Some of these applications require real-time 2D graphics processing running on limited design specifications such as low power consumption and a small area. In order to satisfy such conditions, including a specific 2D graphics accelerator in the embedded system is an effective method. This method reduces the workload of the processor in the embedded system by exploiting the accelerator. The accelerator assists the system to perform 2D graphics processing in real-time. Therefore, a variety of applications that require 2D graphics processing can be implemented with an embedded processor. In this paper, we present a 2D graphics accelerator for tiny embedded systems. The accelerator includes an optimized line-drawing operation based on Bresenham’s algorithm. The optimized operation enables the accelerator to deal with various kinds of 2D graphics processing and to perform the line-drawing instead of the system processor. Moreover, the accelerator also distributes the workload of the processor core by removing the need for the core to access the frame buffer memory. We measure the performance of the accelerator by implementing the processor, including the accelerator, on a field-programmable gate array (FPGA), and ascertaining the possibility of realization by synthesizing using the 180 nm CMOS process.

scholarly journals Ab initio perspective of ultra-scaled CMOS from 2D-material fundamentals to dynamically doped transistors

2021 ◽  
Vol 5 (1) ◽  
Author(s):  
Aryan Afzalian
Keyword(s):  
Field Effect ◽  
High Performance ◽  
Field Effect Transistor ◽  
High Mobility ◽  
Complementary Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Grand Challenge ◽  
Gate Length ◽  
Delay Performance ◽  
Effect Transistor

AbstractUsing accurate dissipative DFT-NEGF atomistic-simulation techniques within the Wannier-Function formalism, we give a fresh look at the possibility of sub-10-nm scaling for high-performance complementary metal oxide semiconductor (CMOS) applications. We show that a combination of good electrostatic control together with high mobility is paramount to meet the stringent roadmap targets. Such requirements typically play against each other at sub-10-nm gate length for MOS transistors made of conventional semiconductor materials like Si, Ge, or III–V and dimensional scaling is expected to end ~12 nm gate-length (pitch of 40 nm). We demonstrate that using alternative 2D channel materials, such as the less-explored HfS2 or ZrS2, high-drive current down to ~6 nm is, however, achievable. We also propose a dynamically doped field-effect transistor concept, that scales better than its MOSFET counterpart. Used in combination with a high-mobility material such as HfS2, it allows for keeping the stringent high-performance CMOS on current and competitive energy-delay performance, when scaling down to virtually 0 nm gate length using a single-gate architecture and an ultra-compact design (pitch of 22 nm). The dynamically doped field-effect transistor further addresses the grand-challenge of doping in ultra-scaled devices and 2D materials in particular.

scholarly journals Phase Change Metasurfaces by Continuous or Quasi-Continuous Atoms for Active Optoelectronic Integration

Materials ◽  
2021 ◽  
Vol 14 (5) ◽  
pp. 1272
Author(s):  
Zhihua Fan ◽  
Qinling Deng ◽  
Xiaoyu Ma ◽  
Shaolin Zhou
Keyword(s):  
Phase Change ◽  
Phase Change Materials ◽  
Complementary Metal Oxide Semiconductor ◽  
Photonic Devices ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Nanophotonic Devices ◽  
Optoelectronic Integration ◽  
Hybrid Devices ◽  
Micro Electromechanical System

In recent decades, metasurfaces have emerged as an exotic and appealing group of nanophotonic devices for versatile wave regulation with deep subwavelength thickness facilitating compact integration. However, the ability to dynamically control the wave–matter interaction with external stimulus is highly desirable especially in such scenarios as integrated photonics and optoelectronics, since their performance in amplitude and phase control settle down once manufactured. Currently, available routes to construct active photonic devices include micro-electromechanical system (MEMS), semiconductors, liquid crystal, and phase change materials (PCMs)-integrated hybrid devices, etc. For the sake of compact integration and good compatibility with the mainstream complementary metal oxide semiconductor (CMOS) process for nanofabrication and device integration, the PCMs-based scheme stands out as a viable and promising candidate. Therefore, this review focuses on recent progresses on phase change metasurfaces with dynamic wave control (amplitude and phase or wavefront), and especially outlines those with continuous or quasi-continuous atoms in favor of optoelectronic integration.

scholarly journals A Novel Ultrasonic TOF Ranging System Using AlN Based PMUTs

Micromachines ◽  
2021 ◽  
Vol 12 (3) ◽  
pp. 284
Author(s):  
Yihsiang Chiu ◽  
Chen Wang ◽  
Dan Gong ◽  
Nan Li ◽  
Shenglin Ma ◽  
...  
Keyword(s):  
Clock Cycle ◽  
High Accuracy ◽  
Ultrasonic Waves ◽  
Oxide Semiconductor ◽  
Average Error ◽  
Cmos Process ◽  
Clock Frequency ◽  
Time Frequency ◽  
Range Finding ◽  
Wide Range

This paper presents a high-accuracy complementary metal oxide semiconductor (CMOS) driven ultrasonic ranging system based on air coupled aluminum nitride (AlN) based piezoelectric micromachined ultrasonic transducers (PMUTs) using time of flight (TOF). The mode shape and the time-frequency characteristics of PMUTs are simulated and analyzed. Two pieces of PMUTs with a frequency of 97 kHz and 96 kHz are applied. One is used to transmit and the other is used to receive ultrasonic waves. The Time to Digital Converter circuit (TDC), correlating the clock frequency with sound velocity, is utilized for range finding via TOF calculated from the system clock cycle. An application specific integrated circuit (ASIC) chip is designed and fabricated on a 0.18 μm CMOS process to acquire data from the PMUT. Compared to state of the art, the developed ranging system features a wide range and high accuracy, which allows to measure the range of 50 cm with an average error of 0.63 mm. AlN based PMUT is a promising candidate for an integrated portable ranging system.

scholarly journals Universal Filter Based on Compact CMOS Structure of VDDDA

Sensors ◽  
2021 ◽  
Vol 21 (5) ◽  
pp. 1683
Author(s):  
Winai Jaikla ◽  
Fabian Khateb ◽  
Tomasz Kulej ◽  
Koson Pitaksuttayaprot
Keyword(s):  
Metal Oxide ◽  
Dynamic Range ◽  
Complementary Metal Oxide Semiconductor ◽  
Metal Oxide Semiconductor ◽  
Experimental Results ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Voltage Gain ◽  
Universal Filter ◽  
Mos Transistor

This paper proposes the simulated and experimental results of a universal filter using the voltage differencing differential difference amplifier (VDDDA). Unlike the previous complementary metal oxide semiconductor (CMOS) structures of VDDDA that is present in the literature, the present one is compact and simple, owing to the employment of the multiple-input metal oxide semiconductor (MOS) transistor technique. The presented filter employs two VDDDAs, one resistor and two grounded capacitors, and it offers low-pass: LP, band-pass: BP, band-reject: BR, high-pass: HP and all-pass: AP responses with a unity passband voltage gain. The proposed universal voltage mode filter has high input impedances and low output impedance. The natural frequency and bandwidth are orthogonally controlled by using separated transconductance without affecting the passband voltage gain. For a BP filter, the root mean square (RMS) of the equivalent output noise is 46 µV, and the third intermodulation distortion (IMD3) is −49.5 dB for an input signal with a peak-to peak of 600 mV, which results in a dynamic range (DR) of 73.2 dB. The filter was designed and simulated in the Cadence environment using a 0.18-µm CMOS process from Taiwan semiconductor manufacturing company (TSMC). In addition, the experimental results were obtained by using the available commercial components LM13700 and AD830. The simulation results are in agreement with the experimental one that confirmed the advantages of the filter.

Millimeter-wave dual-mode and dual-band switchable Gilbert up-conversion mixer in 65-nm CMOS process

2021 ◽  
pp. 1-5
Author(s):  
Fang Zhu ◽  
Guo Qing Luo
Keyword(s):  
Millimeter Wave ◽  
Complementary Metal Oxide Semiconductor ◽  
Local Oscillator ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Dual Band ◽  
Cmos Process ◽  
Pumping Power ◽  
Dual Mode ◽  
Dc Power

Abstract In this paper, a millimeter-wave (MMW) dual-mode and dual-band switchable Gilbert up-conversion mixer in a commercial 65-nm complementary metal oxide semiconductor (CMOS) process is presented. By simply changing the bias, the proposed CMOS Gilbert up-conversion mixer can be switched between subharmonic and fundamental operation modes for MMW dual-band applications. With a low local oscillator pumping power of 3 dBm and low dc power consumption of 6 mW, the proposed CMOS Gilbert up-conversion mixer exhibits a measured conversion gain of −0.5 ± 1.5 dB from 37 to 50 GHz and 2.5 ± 1.5 dB from 17.5 to 32 GHz for the subharmonic and fundamental modes, respectively.

scholarly journals Toward High Throughput Core-CBCM CMOS Capacitive Sensors for Life Science Applications: A Novel Current-Mode for High Dynamic Range Circuitry

Sensors ◽  
2018 ◽  
Vol 18 (10) ◽  
pp. 3370 ◽  
Author(s):  
Saghi Forouhi ◽  
Rasoul Dehghani ◽  
Ebrahim Ghafar-Zadeh
Keyword(s):  
High Performance ◽  
Life Science ◽  
Dynamic Range ◽  
Current Mode ◽  
Capacitive Sensor ◽  
Oxide Semiconductor ◽  
Capacitance Measurement ◽  
Biological Research ◽  
Cmos Process ◽  
Capacitive Sensors

This paper proposes a novel charge-based Complementary Metal Oxide Semiconductor (CMOS) capacitive sensor for life science applications. Charge-based capacitance measurement (CBCM) has significantly attracted the attention of researchers for the design and implementation of high-precision CMOS capacitive biosensors. A conventional core-CBCM capacitive sensor consists of a capacitance-to-voltage converter (CVC), followed by a voltage-to-digital converter. In spite of their high accuracy and low complexity, their input dynamic range (IDR) limits the advantages of core-CBCM capacitive sensors for most biological applications, including cellular monitoring. In this paper, after a brief review of core-CBCM capacitive sensors, we address this challenge by proposing a new current-mode core-CBCM design. In this design, we combine CBCM and current-controlled oscillator (CCO) structures to improve the IDR of the capacitive readout circuit. Using a 0.18 μm CMOS process, we demonstrate and discuss the Cadence simulation results to demonstrate the high performance of the proposed circuitry. Based on these results, the proposed circuit offers an IDR ranging from 873 aF to 70 fF with a resolution of about 10 aF. This CMOS capacitive sensor with such a wide IDR can be employed for monitoring cellular and molecular activities that are suitable for biological research and clinical purposes.

scholarly journals Performance Comparison of Carry-Lookahead and Carry-Select Adders Based on Accurate and Approximate Additions

Electronics ◽  
2018 ◽  
Vol 7 (12) ◽  
pp. 369 ◽  
Author(s):  
Padmanabhan Balasubramanian ◽  
Nikos Mastorakis
Keyword(s):  
High Speed ◽  
Digital Signal ◽  
Complementary Metal Oxide Semiconductor ◽  
Performance Comparison ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Least Significant Bit ◽  
Design Metrics ◽  
Ripple Carry Adder ◽  
Speed Performance

Addition is a fundamental operation in microprocessing and digital signal processing hardware, which is physically realized using an adder. The carry-lookahead adder (CLA) and the carry-select adder (CSLA) are two popular high-speed, low-power adder architectures. The speed performance of a CLA architecture can be improved by adopting a hybrid CLA architecture which employs a small-size ripple-carry adder (RCA) to replace a sub-CLA in the least significant bit positions. On the other hand, the power dissipation of a CSLA employing full adders and 2:1 multiplexers can be reduced by utilizing binary-to-excess-1 code (BEC) converters. In the literature, the designs of many CLAs and CSLAs were described separately. It would be useful to have a direct comparison of their performances based on the design metrics. Hence, we implemented homogeneous and hybrid CLAs, and CSLAs with and without the BEC converters by considering 32-bit accurate and approximate additions to facilitate a comparison. For the gate-level implementations, we considered a 32/28 nm complementary metal-oxide-semiconductor (CMOS) process targeting a typical-case process–voltage–temperature (PVT) specification. The results show that the hybrid CLA/RCA architecture is preferable among the CLA and CSLA architectures from the speed and power perspectives to perform accurate and approximate additions.

Characterization of High-Performance Polycrystalline Silicon Complementary Metal–Oxide–Semiconductor Circuits

2007 ◽  
Vol 46 (1) ◽  
pp. 51-55 ◽  
Author(s):  
Genshiro Kawachi ◽  
Yoshiaki Nakazaki ◽  
Hiroyuki Ogawa ◽  
Masayuki Jyumonji ◽  
Noritaka Akita ◽  
...  
Keyword(s):  
Metal Oxide ◽  
Polycrystalline Silicon ◽  
High Performance ◽  
Complementary Metal Oxide Semiconductor ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Semiconductor Circuits

scholarly journals A Multiplexed Chemical Sensing CMOS Imager

2021 ◽  
Author(s):  
Di Wang ◽  
Fenni Zhang ◽  
Kyle Mallires ◽  
Vishal Tipparaju ◽  
Jingjing Yu ◽  
...  
Keyword(s):  
Chemical Sensing ◽  
High Performance ◽  
Health Management ◽  
Complementary Metal Oxide Semiconductor ◽  
Spot Size ◽  
Oxide Semiconductor ◽  
Colorimetric Sensing ◽  
Widespread Application ◽  
Cmos Imager ◽  
Cmos Chip

Abstract A miniaturized and multiplexed chemical sensing technology is urgently needed to empower mobile devices, Internet-of-Things (IoTs) and robots for various new applications. Here, we show that a complementary metal-oxide-semiconductor (CMOS) imager can be turned into a multiplexed colorimetric sensing chip by coating micron-scale colorimetric sensing spots on the imager surface. Each sensing spot contains chemical sensing materials and nanoparticles for colorimetric signal enhancement. The sensitivity is spot-size invariant, and high-performance chemical sensing can be achieved on sensing spot as small as ~ 10 µm. This great scalability combined with millions of pixels of a CMOS imager offers a promising platform for highly integrated chemical sensors. Moreover, the chemical CMOS chip can be readily integrated with mobile electronics. As a proof-of-concept, we have built a smartphone accessary based on this chemical CMOS chip for personal health management. We anticipate that this new platform will pave the way for the widespread application of chemical sensing, such as mobile health (mHealth), IoTs, electronic nose, and smart homes.

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