scholarly journals Melt Blown Fiber-Assisted Solvent-Free Device Fabrication at Low-Temperature

Micromachines ◽  
2020 ◽  
Vol 11 (12) ◽  
pp. 1091
Author(s):  
Minjong Lee ◽  
Joohoon Kang ◽  
Young Tack Lee
Keyword(s):  
Transition Metal Dichalcogenides ◽  
Hole Mobility ◽  
Device Fabrication ◽  
Solvent Free ◽  
Oxide Semiconductor ◽  
Drain Voltage ◽  
Cmos Inverter ◽  
Current Ratio ◽  
Metal Dichalcogenides ◽  
P Type

In this paper, we propose a solvent-free device fabrication method using a melt-blown (MB) fiber to minimize potential chemical and thermal damages to transition-metal-dichalcogenides (TMDCs)-based semiconductor channel. The fabrication process is composed of three steps; (1) MB fibers alignment as a shadow mask, (2) metal deposition, and (3) lifting-up MB fibers. The resulting WSe2-based p-type metal-oxide-semiconductor (PMOS) device shows an ON/OFF current ratio of ~2 × 105 (ON current of ~−40 µA) and a remarkable linear hole mobility of ~205 cm2/V·s at a drain voltage of −0.1 V. These results can be a strong evidence supporting that this MB fiber-assisted device fabrication can effectively suppress materials damage by minimizing chemical and thermal exposures. Followed by an MoS2-based n-type MOS (NMOS) device demonstration, a complementary MOS (CMOS) inverter circuit application was successfully implemented, consisted of an MoS2 NMOS and a WSe2 PMOS as a load and a driver transistor, respectively. This MB fiber-based device fabrication can be a promising method for future electronics based on chemically reactive or thermally vulnerable materials.

scholarly journals High hole mobility in physical vapour deposition-grown tellurium-based transistors

2021 ◽  
Vol 8 (8) ◽  
pp. 210554
Author(s):  
Lin Tao ◽  
Lixiang Han ◽  
Qian Yue ◽  
Bin Yao ◽  
Yujue Yang ◽  
...  
Keyword(s):  
High Performance ◽  
Carrier Mobility ◽  
Vapour Deposition ◽  
Field Effect Transistors ◽  
Transition Metal Dichalcogenides ◽  
High Mobility ◽  
Hole Mobility ◽  
Physical Vapour Deposition ◽  
Metal Dichalcogenides ◽  
P Type

Carrier mobility is one of most important figures of merit for materials that can determine to a large extent the corresponding device performances. So far, extensive efforts have been devoted to the mobility improvement of two-dimensional (2D) materials regarded as promising candidates to complement the conventional semiconductors. Graphene has amazing mobility but suffers from zero bandgap. Subsequently, 2D transition-metal dichalcogenides benefit from their sizable bandgap while the mobility is limited. Recently, the 2D elemental materials such as the representative black phosphorus can combine the high mobility with moderate bandgap; however the air-stability is a challenge. Here, we report air-stable tellurium flakes and wires using the facile and scalable physical vapour deposition (PVD) method. The prototype field-effect transistors were fabricated to exhibit high hole mobility up to 1485 cm 2 V −1 s −1 at room temperature and 3500 cm 2 V −1 s −1 at low temperature (2 K). This work can attract numerous attentions on this new emerging 2D tellurium and open up a new way for exploring high-performance optoelectronics based on the PVD-grown p-type tellurium.

Ambipolar Thin-Film Transistors Fabricated by PECVD Nanocrystalline Silicon

2006 ◽  
Vol 910 ◽  
Author(s):  
Czang-Ho Lee ◽  
Andrei Sazonov ◽  
Mohammad R. E. Rad ◽  
G. Reza Chaji ◽  
Arokia Nathan
Keyword(s):  
Thin Film ◽  
Thin Film Transistors ◽  
Field Effect ◽  
Chemical Vapor ◽  
Hole Mobility ◽  
Complementary Metal Oxide Semiconductor ◽  
Nanocrystalline Silicon ◽  
Oxide Semiconductor ◽  
Hole Injection ◽  
Current Ratio

AbstractWe report on directly deposited plasma-enhanced chemical vapor deposition (PECVD) nanocrystalline silicon (nc-Si:H) ambipolar thin-film transistors (TFTs) fabricated at 260 °C. The ambipolar operation is achieved adopting Cr metal contacts with high-quality nc-Si:H channel layer, which creates highly conductive Cr silicided drain/source contacts, reducing both electron and hole injection barriers. The n-channel nc-Si:H TFTs show a field-effect electron mobility (meFE) of 150 cm2/Vs, threshold voltage (VT) ~ 2 V, subthreshold slope (S) ~0.3 V/dec, and ON/OFF current ratio of more than 107, while the p-channel nc-Si:H TFTs show a field-effect hole mobility (mhFE) of 26 cm2/Vs, VT ~ -3.8 V, S ~0.25 V/dec, and ON/OFF current ratio of more than 106. Complementary metal-oxide-semiconductor (CMOS) logic integrated with two ambipolar nc-Si:H TFTs shows reasonable transfer characteristics. The results presented here demonstrate that low-temperature nc-Si:H TFT technology is feasible for total integration of active-matrix TFT backplanes.

Hole mobility enhancements in strained Si/Si1−yGey p-type metal-oxide-semiconductor field-effect transistors grown on relaxed Si1−xGex (x

2001 ◽  
Vol 79 (25) ◽  
pp. 4246-4248 ◽  
Author(s):  
C. W. Leitz ◽  
M. T. Currie ◽  
M. L. Lee ◽  
Z.-Y. Cheng ◽  
D. A. Antoniadis ◽  
...  
Keyword(s):  
Metal Oxide ◽  
Field Effect ◽  
Field Effect Transistors ◽  
Hole Mobility ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Strained Si ◽  
P Type

scholarly journals Hole doping effect of MoS2 via electron capture of He+ ion irradiation

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Sang Wook Han ◽  
Won Seok Yun ◽  
Hyesun Kim ◽  
Yanghee Kim ◽  
D.-H. Kim ◽  
...  
Keyword(s):  
Electron Capture ◽  
Ion Irradiation ◽  
Noble Gas ◽  
Transition Metal Dichalcogenides ◽  
General Purpose ◽  
Low Energy ◽  
Hole Doping ◽  
Universal Method ◽  
Metal Dichalcogenides ◽  
P Type

AbstractBeyond the general purpose of noble gas ion sputtering, which is to achieve functional defect engineering of two-dimensional (2D) materials, we herein report another positive effect of low-energy (100 eV) He+ ion irradiation: converting n-type MoS2 to p-type by electron capture through the migration of the topmost S atoms. The electron capture ability via He+ ion irradiation is valid for supported bilayer MoS2; however, it is limited at supported monolayer MoS2 because the charges on the underlying substrates transfer into the monolayer under the current condition for He+ ion irradiation. Our technique provides a stable and universal method for converting n-type 2D transition metal dichalcogenides (TMDs) into p-type semiconductors in a controlled fashion using low-energy He+ ion irradiation.

scholarly journals High Performance P-Type Perovskite Lagao3 Thin Film Field Effect Transistor Prepared by Solution-Processed

2022 ◽  
Vol 2152 (1) ◽  
pp. 012008
Author(s):  
Qian Chen
Keyword(s):  
Thin Film ◽  
High Performance ◽  
Low Cost ◽  
Thin Film Transistor ◽  
Solution Process ◽  
Hole Mobility ◽  
Oxide Semiconductor ◽  
Future Design ◽  
Different Temperatures ◽  
P Type

Abstract Metal oxide semiconductor (MOS) is essential to compose high-performance electronic devices, however, the investigation on p-type MOS is relatively rare compared with its n-type counterpart. In this work, LaGaO3 thin films with superior p-type conductivity have been prepared via a facile solution process. Moreover, we have implemented Al2O3 and SiO2 as the dielectric of the p-channel LaGaO3 thin film transistors (TFTs) annealed at different temperatures. Particularly, the LaGaO3/Al2O3 TFTs annealed at 700 °C exhibit an ultrahigh hole mobility of 12.4 cm2V-1s-1, Under the same conditions, LaGaO3/Al2O3 thin film transistor is two orders of magnitude higher than LaGaO3/SiO2 thin film transistor. The advanced p-type characteristics of the LaGaO3 thin film, along with its facile low-cost fabrication process can shed new light on future design of high-performance complementary MOS circuit with other optimized facile-integrated dielectrics.

scholarly journals Experimental demonstration of high-gain CMOS inverter operation at low Vdd down to 0.5 V consisting of WSe2 n/p FETs

2021 ◽  
Author(s):  
Takamasa KAWANAGO ◽  
Takahiro Matsuzaki ◽  
Ryosuke Kajikawa ◽  
Iriya Muneta ◽  
Takuya HOSHII ◽  
...  
Keyword(s):  
Gate Dielectric ◽  
Supply Voltage ◽  
Transition Metal Dichalcogenides ◽  
High Gain ◽  
Oxide Semiconductor ◽  
Poly Vinyl Alcohol ◽  
Gate Stack ◽  
Cmos Inverter ◽  
Power Supply Voltage ◽  
Doping Technique

Abstract In this paper, we report on the device concepts for high-gain operation of a tungsten diselenide (WSe2) complementary metal-oxide-semiconductor (CMOS) inverter at a low power supply voltage (Vdd), which was realized by developing a doping technique and gate stack technology. A spin-coating with a fluoropolymer and poly(vinyl alcohol) (PVA) results in the doping of both electrons and holes to WSe2. A hybrid self-assembled monolayer (SAM)/aluminum oxide (AlOx) gate dielectric is viable for achieving high gate capacitance and superior interfacial properties. By developing the doping technique and gate stack technology, we experimentally realized a high gain of 9 at Vdd of 0.5 V in the WSe2 CMOS inverter. This study paves the way for the research and development of transition metal dichalcogenides (TMDC)-based devices and circuits.

scholarly journals Precise Layer Control of MoTe2 by Ozone Treatment

Nanomaterials ◽  
2019 ◽  
Vol 9 (5) ◽  
pp. 756 ◽  
Author(s):  
Qiyuan Wang ◽  
Jing Chen ◽  
Youwei Zhang ◽  
Laigui Hu ◽  
Ran Liu ◽  
...  
Keyword(s):  
Transition Metal Dichalcogenides ◽  
Atomic Scale ◽  
Ozone Treatment ◽  
Layer By Layer ◽  
Precise Control ◽  
Metal Dichalcogenides ◽  
Multiple Cycles ◽  
P Type ◽  
Device Properties ◽  
Layer Control

Transition metal dichalcogenides (TMDCs) demonstrate great potential in numerous applications. However, these applications require a precise control of layer thickness at the atomic scale. In this work, we present an in-situ study of the self-limiting oxidation process in MoTe2 by ozone (O3) treatment. A precise layer-by-layer control of MoTe2 flakes can be achieved via multiple cycles of oxidation and wet etching. The thinned MoTe2 flakes exhibit comparable optical properties and film quality to the pristine exfoliated ones. Besides, an additional p-type doping is observed after O3 oxidation. Such a p-doping effect converts the device properties of MoTe2 from electron-dominated to hole-dominated ambipolar characteristics.

scholarly journals Photoelectric Characteristics of a Large-Area n-MoS2/p-Si Heterojunction Structure Formed through Sulfurization Process

Sensors ◽  
2020 ◽  
Vol 20 (24) ◽  
pp. 7340
Author(s):  
Yoonsok Kim ◽  
Taeyoung Kim ◽  
Eun Kyu Kim
Keyword(s):  
Near Infrared ◽  
2D Materials ◽  
Transition Metal Dichalcogenides ◽  
Large Area ◽  
Heterojunction Structure ◽  
Sulfurization Process ◽  
Decay Times ◽  
Materials Research ◽  
Metal Dichalcogenides ◽  
P Type

Two-dimensional (2D) materials, such as molybdenum disulfide (MoS2) of the transition metal dichalcogenides family, are widely investigated because of their outstanding electrical and optical properties. However, not much of the 2D materials research completed to date has covered large-area structures comprised of high-quality heterojunction diodes. We fabricated a large-area n-MoS2/p-Si heterojunction structure by sulfurization of MoOx film, which is thermally evaporated on p-type silicon substrate. The n-MoS2/p-Si structure possessed excellent diode characteristics such as ideality factor of 1.53 and rectification ratio in excess of 104. Photoresponsivity and detectivity of the diode showed up to 475 mA/W and 6.5 × 1011 Jones, respectively, in wavelength ranges from visible to near-infrared. The device appeared also the maximum external quantum efficiency of 72%. The rise and decay times of optical transient response were measured about 19.78 ms and 0.99 ms, respectively. These results suggest that the sulfurization process for large-area 2D heterojunction with MoS2 can be applicable to next-generation electronic and optoelectronic devices.

scholarly journals Spintronics in Two-Dimensional Materials

2020 ◽  
Vol 12 (1) ◽  
Author(s):  
Yanping Liu ◽  
Cheng Zeng ◽  
Jiahong Zhong ◽  
Junnan Ding ◽  
Zhiming M. Wang ◽  
...  
Keyword(s):  
Spin Relaxation ◽  
High Efficiency ◽  
2D Materials ◽  
Spin Injection ◽  
Transition Metal Dichalcogenides ◽  
Information Storage ◽  
Oxide Semiconductor ◽  
Two Dimensional ◽  
Spintronic Devices ◽  
Metal Dichalcogenides

AbstractSpintronics, exploiting the spin degree of electrons as the information vector, is an attractive field for implementing the beyond Complemetary metal-oxide-semiconductor (CMOS) devices. Recently, two-dimensional (2D) materials have been drawing tremendous attention in spintronics owing to their distinctive spin-dependent properties, such as the ultra-long spin relaxation time of graphene and the spin–valley locking of transition metal dichalcogenides. Moreover, the related heterostructures provide an unprecedented probability of combining the different characteristics via proximity effect, which could remedy the limitation of individual 2D materials. Hence, the proximity engineering has been growing extremely fast and has made significant achievements in the spin injection and manipulation. Nevertheless, there are still challenges toward practical application; for example, the mechanism of spin relaxation in 2D materials is unclear, and the high-efficiency spin gating is not yet achieved. In this review, we focus on 2D materials and related heterostructures to systematically summarize the progress of the spin injection, transport, manipulation, and application for information storage and processing. We also highlight the current challenges and future perspectives on the studies of spintronic devices based on 2D materials.

Sign in / Sign up

Export Citation Format

Share Document