scholarly journals Reconstructing of Embedded High-Aspect-Ratio Nano-Voids Generated by Ultrafast Laser Bessel Beams

Micromachines ◽  
2020 ◽  
Vol 11 (7) ◽  
pp. 671 ◽  
Author(s):  
Tianqu Chen ◽  
Guodong Zhang ◽  
Yishan Wang ◽  
Xuelong Li ◽  
Razvan Stoian ◽  
...  

Ultrafast non-diffractive Bessel laser beams provide strong light confinement and show robust advantages for fabricating high-aspect-ratio nanoscale structures inside transparent materials. They take the form of nanoscale voids with typical diameters well below the wavelength and aspect ratio of more than 1000. Delivering 3D morphologies of such nanoscale voids is an important issue to evaluate the result for fabrication. However, the characterization of such laser-induced structures is a difficult task. Here, an accurate and time-saving tomography-like methodology is proposed and adopted for reconstructing the morphology of high-aspect-ratio nano-holes. The technique allows an accurate assertion of laser parameters and position on nano-structured features. The reconstructed configuration reveals that nanoholes morphologies have a close relationship with energy distribution in the focal region. It suggests that the configuration of micro-explosion can be controlled by laser energy deposition in the process of laser-matter interaction down to the nanoscale.

2015 ◽  
Vol 54 (24) ◽  
pp. 7358 ◽  
Author(s):  
Sambit Mitra ◽  
Margaux Chanal ◽  
Raphaël Clady ◽  
Alexandros Mouskeftaras ◽  
David Grojo

2016 ◽  
Vol 120 (1) ◽  
pp. 013102 ◽  
Author(s):  
Valerio Garzillo ◽  
Vytautas Jukna ◽  
Arnaud Couairon ◽  
Robertas Grigutis ◽  
Paolo Di Trapani ◽  
...  

2012 ◽  
Vol 22 (5) ◽  
pp. 055021 ◽  
Author(s):  
Pradeep Dixit ◽  
Tapani Vehmas ◽  
Sami Vähänen ◽  
Philippe Monnoyer ◽  
Kimmo Henttinen

2015 ◽  
Vol 54 (32) ◽  
pp. 9422 ◽  
Author(s):  
Nojan Motamedi ◽  
Salman Karbasi ◽  
Joseph E. Ford ◽  
Vitaliy Lomakin

2010 ◽  
Vol 2010 (1) ◽  
pp. 000703-000706
Author(s):  
Colin Stevens ◽  
Robert Dean ◽  
Samuel Lawrence ◽  
Lee Levine

The Bosch Deep Reactive Ion Etch Process is commonly used for the manufacture of MEMS and MOEMS devices that require deep high aspect ratio trenches. In many cases fully released, high aspect ratio features can be generated in one pass. However the process must be understood to avoid generating some of the defect structures that are characteristic of the process. Defects such as scalloping, silicon grass, and undercutting at the interface of a nonconductive layer can be controlled by process parameters and optimization. Measurement and characterization of the defective structures is a key element of controlling them. The use of SEM measurement techniques for characterizing the small features associated with scalloping and silicon grass is essential. No other technique is capable of providing the large depth of focus required to visualize these features. The use of metallographic techniques furthers understanding of the surface conditions on the side walls of these deep trenches.


Micromachines ◽  
2020 ◽  
Vol 11 (4) ◽  
pp. 378 ◽  
Author(s):  
Hailiang Li ◽  
Changqing Xie

We report a robust, sidewall transfer metal assistant chemical etching scheme for fabricating Al2O3 nanotube arrays with an ultra-high aspect ratio. Electron beam lithography followed by low-temperature Au metal assisted chemical etching (MacEtch) is used to pattern high resolution, high aspect ratio, and vertical silicon nanostructures, used as a template. This template is subsequently transferred by an atomic layer deposition of the Al2O3 layer, followed by an annealing process, anisotropic dry etching of the Al2O3 layer, and a sacrificial silicon template. The process and characterization of the Al2O3 nanotube arrays are discussed in detail. Vertical Al2O3 nanotube arrays with line widths as small as 50 nm, heights of up to 21 μm, and aspect ratios up to 420:1 are fabricated on top of a silicon substrate. More importantly, such a sidewall transfer MacEtch approach is compatible with well-established silicon planar processes, and has the benefits of having a fully controllable linewidth and height, high reproducibility, and flexible design, making it attractive for a broad range of practical applications.


2006 ◽  
Vol 179 (3) ◽  
pp. 708-715 ◽  
Author(s):  
Qi Tao ◽  
Yuanming Zhang ◽  
Xiang Zhang ◽  
Peng Yuan ◽  
Hongping He

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