scholarly journals Thin-Film MEMS Resistors with Enhanced Lifetime for Thermal Inkjet

Micromachines ◽  
2020 ◽  
Vol 11 (5) ◽  
pp. 499
Author(s):  
Elkana Bar-Levav ◽  
Moshe Witman ◽  
Moshe Einat
Keyword(s):  
Thin Film ◽  
Electric Field ◽  
Hot Spots ◽  
Failure Mechanisms ◽  
Thermal Failure ◽  
Thin Film Resistors ◽  
Order Of Magnitude ◽  
Strong Relation ◽  
Simulation And Experiment ◽  
3D Printers

In this paper, the failure mechanisms of the thermal inkjet thin-film resistors are recognized. Additionally, designs of resistors to overcome these mechanisms are suggested and tested by simulation and experiment. The resulting resistors are shown to have improved lifetimes, spanning an order of magnitude up to 2 × 109 pulses. The thermal failure mechanisms were defined according to the electric field magnitude in three critical points—the resistor center, the resistor–conductor edge, and the resistor thermal “hot spots”. Lowering the thermal gradients between these points will lead to the improved lifetime of the resistors. Using MATLAB PDE simulations, various resistors shapes, with different electric field ratios in the hot spots, were designed and manufactured on an 8″ silicon wafer. A series of lifetime experiments were conducted on the resistors, and a strong relation between the shape and the lifetime of the resistor was found. These results have immediate ramifications regarding the different printing apparatuses which function with thermal inkjet technology, allowing the commercial production of larger thermal printheads with high MTBF rate. Such heads may fit fast and large 3D printers.

scholarly journals Tripod-Loop Metasurfaces for Terahertz-Sensing Applications: A Comparison

2020 ◽  
Vol 10 (18) ◽  
pp. 6504
Author(s):  
Irati Jáuregui-López ◽  
Bakhtiyar Orazbayev ◽  
Victor Pacheco-Peña ◽  
Miguel Beruete
Keyword(s):  
Thin Film ◽  
Electric Field ◽  
Field Intensity ◽  
Electric Field Intensity ◽  
Ring Resonators ◽  
Film Sensor ◽  
Average Value ◽  
Sensing Applications ◽  
Order Of Magnitude ◽  
Hole Arrays

The high electric field intensity achieved on the surface of sensors based on metasurfaces (metasensors) makes them an excellent alternative for sensing applications where the volume of the sample to be identified is tiny (for instance, thin-film sensing devices). Various shapes and geometries have been proposed recently for the design of these metasensors unit-cells (meta-atoms) such as split ring resonators or hole arrays, among others. In this paper, we propose, design, and evaluate two types of tripod metasurfaces with different complexity in their geometry. An in-depth comparison of their performance is presented when using them as thin-film sensor devices. The meta-atoms of the proposed metasensors consist of a simple tripod and a hollow tripod structure. From numerical calculations, it is shown that the best geometry to perform thin-film sensing is the compact hollow tripod (due to the highest electric field on its surface) with a mean sensitivity of 3.72 × 10−5 nm−1. Different modifications are made to this structure to improve this value, such as introducing arms in the design and rotating the metallic pattern 30 degrees. The best sensitivity achieved for extremely thin film analytes (5–25 nm thick) has an average value of 1.42 × 10−4 nm, which translates into an extremely high improvement of 381% with respect to the initial hollow tripod structure. Finally, a comparison with other designs found in the literature shows that our design is at the top of the ranking, improving the overall performance by more than one order of magnitude. These results highlight the importance of using metastructures with more complex geometries so that a higher electric field intensity distribution and, therefore, designs with better performance can be obtained.

On the role of tin underlays for the prevention of thermal grooving in thin gold films

1986 ◽  
Vol 44 ◽  
pp. 732-733
Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff
Keyword(s):  
Thin Film ◽  
Free Surface ◽  
Grain Boundary ◽  
Beneficial Effect ◽  
Failure Mechanism ◽  
Failure Mechanisms ◽  
Distinct Advantage ◽  
Gold Films ◽  
Gold Thin Film

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.

scholarly journals Current Noise in Thick and Thin Film Resistors

1983 ◽  
Vol 10 (2-3) ◽  
pp. 81-85 ◽  
Author(s):  
S. Demolder ◽  
A. Van Calster ◽  
M. Vandendriessche
Keyword(s):  
Thin Film ◽  
Thick Film ◽  
Measured Data ◽  
Measuring Circuit ◽  
Current Noise ◽  
High Quality ◽  
Thin Film Resistors

In this paper a sensitive measuring circuit is described for the measurement of current noise on high quality thin and thick film resistors. Measured data on resistors are presented and analysed.

Electric Field Control of the Magnetic Weyl Fermion in an Epitaxial SrRuO 3 (111) Thin Film

2021 ◽  
pp. 2101316
Author(s):  
Weinan Lin ◽  
Liang Liu ◽  
Qing Liu ◽  
Lei Li ◽  
Xinyu Shu ◽  
...  
Keyword(s):  
Thin Film ◽  
Electric Field ◽  
Field Control ◽  
Weyl Fermion

Preparation and electrical properties of γ form poly(vinylidene fluoride) thin film by vapour deposition in the presence of an electric field

1991 ◽  
Vol 202 (2) ◽  
pp. 213-220 ◽  
Author(s):  
Akiyoshi Takeno ◽  
Norimasa Okui ◽  
Tetsuji Kitoh ◽  
Michiharu Muraoka ◽  
Susumu Umemoto ◽  
...  
Keyword(s):  
Thin Film ◽  
Electrical Properties ◽  
Electric Field ◽  
Vapour Deposition ◽  
Vinylidene Fluoride ◽  
Poly Vinylidene Fluoride

scholarly journals Layer- and gate-tunable spin-orbit coupling in a high-mobility few-layer semiconductor

2021 ◽  
Vol 7 (5) ◽  
pp. eabe2892
Author(s):  
Dmitry Shcherbakov ◽  
Petr Stepanov ◽  
Shahriar Memaran ◽  
Yaxian Wang ◽  
Yan Xin ◽  
...  
Keyword(s):  
Electric Field ◽  
High Mobility ◽  
Orbit Coupling ◽  
Spin Splitting ◽  
Spin Orbit Coupling ◽  
Spin Orbit ◽  
Quantum Oscillations ◽  
Out Of Plane ◽  
Order Of Magnitude ◽  
Spin Degeneracy

Spin-orbit coupling (SOC) is a relativistic effect, where an electron moving in an electric field experiences an effective magnetic field in its rest frame. In crystals without inversion symmetry, it lifts the spin degeneracy and leads to many magnetic, spintronic, and topological phenomena and applications. In bulk materials, SOC strength is a constant. Here, we demonstrate SOC and intrinsic spin splitting in atomically thin InSe, which can be modified over a broad range. From quantum oscillations, we establish that the SOC parameter α is thickness dependent; it can be continuously modulated by an out-of-plane electric field, achieving intrinsic spin splitting tunable between 0 and 20 meV. Unexpectedly, α could be enhanced by an order of magnitude in some devices, suggesting that SOC can be further manipulated. Our work highlights the extraordinary tunability of SOC in 2D materials, which can be harnessed for in operando spintronic and topological devices and applications.

scholarly journals Analysis of Threshold Voltage Shift for Full VGS/VDS/Oxygen-Content Span under Positive Bias Stress in Bottom-Gate Amorphous InGaZnO Thin-Film Transistors

Micromachines ◽  
2021 ◽  
Vol 12 (3) ◽  
pp. 327
Author(s):  
Je-Hyuk Kim ◽  
Jun Tae Jang ◽  
Jong-Ho Bae ◽  
Sung-Jin Choi ◽  
Dong Myong Kim ◽  
...  
Keyword(s):  
Thin Film ◽  
Electric Field ◽  
Oxygen Content ◽  
Threshold Voltage ◽  
Thin Film Transistors ◽  
Electron Trapping ◽  
Threshold Voltage Shift ◽  
Voltage Shift ◽  
Drain Side ◽  
Bottom Gate

In this study, we analyzed the threshold voltage shift characteristics of bottom-gate amorphous indium-gallium-zinc-oxide (IGZO) thin-film transistors (TFTs) under a wide range of positive stress voltages. We investigated four mechanisms: electron trapping at the gate insulator layer by a vertical electric field, electron trapping at the drain-side GI layer by hot-carrier injection, hole trapping at the source-side etch-stop layer by impact ionization, and donor-like state creation in the drain-side IGZO layer by a lateral electric field. To accurately analyze each mechanism, the local threshold voltages of the source and drain sides were measured by forward and reverse read-out. By using contour maps of the threshold voltage shift, we investigated which mechanism was dominant in various gate and drain stress voltage pairs. In addition, we investigated the effect of the oxygen content of the IGZO layer on the positive stress-induced threshold voltage shift. For oxygen-rich devices and oxygen-poor devices, the threshold voltage shift as well as the change in the density of states were analyzed.

Hot-Wire Deposited Amorphous Silicon Thin-Film Transistors

1996 ◽  
Vol 424 ◽  
Author(s):  
R. E. I. Schropp ◽  
K. F. Feenstra ◽  
C. H. M. Van Der Werf ◽  
J. Holleman ◽  
H. Meiling
Keyword(s):  
Thin Film ◽  
Amorphous Silicon ◽  
Thin Film Transistors ◽  
Gate Dielectric ◽  
Chemical Vapor ◽  
Current Crowding ◽  
Hot Wire ◽  
Saturation Regime ◽  
Silicon Thin Film ◽  
Order Of Magnitude

AbstractWe present the first thin film transistors (TFTs) incorporating a low hydrogen content (5 - 9 at.-%) amorphous silicon (a-Si:H) layer deposited by the Hot-Wire Chemical Vapor Deposition (HWCVD) technique. This demonstrates the possibility of utilizing this material in devices. The deposition rate by Hot-Wire CVD is an order of magnitude higher than by Plasma Enhanced CVD. The switching ratio for TFTs based on HWCVD a-Si:H is better than 5 orders of magnitude. The field-effect mobility as determined from the saturation regime of the transfer characteristics is still quite poor. The interface with the gate dielectric needs further optimization. Current crowding effects, however, could be completely eliminated by a H2 plasma treatment of the HW-deposited intrinsic layer. In contrast to the PECVD reference device, the HWCVD device appears to be almost unsensitive to bias voltage stressing. This shows that HW-deposited material might be an approach to much more stable devices.

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