scholarly journals Editorial for the Special Issue on Gas Flows in Microsystems

Micromachines ◽  
2019 ◽  
Vol 10 (8) ◽  
pp. 494
Author(s):  
Stéphane Colin ◽  
Lucien Baldas

The last two decades have witnessed a rapid development of microelectromechanical systems (MEMS) involving gas microflows in various technical fields [...]

2018 ◽  
Vol 20 (1) ◽  
pp. 34-39 ◽  
Author(s):  
Tsutomu Arakawa ◽  
Yoshiko Kita

Previously, we have reviewed in this journal (Arakawa, T., Kita, Y., Curr. Protein Pept. Sci., 15, 608-620, 2014) the interaction of arginine with proteins and various applications of this solvent additive in the area of protein formulations and downstream processes. In this special issue, we expand the concept of protein-solvent interaction into the analysis of the effects of solvent additives on various column chromatography, including mixed-mode chromatography. Earlier in our research, we have studied the interactions of such a variety of solvent additives as sugars, salts, amino acids, polymers and organic solvents with a variety of proteins, which resulted in mechanistic understanding on their protein stabilization and precipitation effects, the latter known as Hofmeister series. While such a study was then a pure academic research, rapid development of genetic engineering technologies and resultant biotechnologies made it a valuable knowledge in fully utilizing solvent additives in manipulation of protein solution, including column chromatography.


2021 ◽  
Vol 7 (1) ◽  
Author(s):  
Xue Dong ◽  
Geng Tong ◽  
Xuankun Song ◽  
Xingchen Xiao ◽  
Yiting Yu

AbstractAs one of the most common hyperspectral microscopy (HSM) techniques, line-scanning HSM is currently utilized in many fields. However, its scanning efficiency is still considered to be inadequate since many biological and chemical processes occur too rapidly to be captured. Accordingly, in this work, a digital micromirror device (DMD) based on microelectromechanical systems (MEMS) is utilized to demonstrate a flexible multiline scanning HSM system. To the best of our knowledge, this is the first line-scanning HSM system in which the number of scanning lines N can be tuned by simply changing the DMD’s parallel scanning units according to diverse applications. This brilliant strategy of effortless adjustability relies only on on-chip scanning methods and totally exploits the benefits of parallelization, aiming to achieve nearly an N-time improvement in the detection efficiency and an N-time decrease in the scanning time and data volume compared with the single-line method under the same operating conditions. To validate this, we selected a few samples of different spectral wavebands to perform reflection imaging, transmission imaging, and fluorescence imaging with varying numbers of scanning lines. The results show the great potential of our DMD-based HSM system for the rapid development of cellular biology, material analysis, and so on. In addition, its on-chip scanning process eliminates the inherent microscopic architecture, making the whole system compact, lightweight, portable, and not subject to site constraints.


Micromachines ◽  
2020 ◽  
Vol 11 (10) ◽  
pp. 928 ◽  
Author(s):  
Haoran Wang ◽  
Yifei Ma ◽  
Hao Yang ◽  
Huabei Jiang ◽  
Yingtao Ding ◽  
...  

Photoacoustic imaging (PAI) is drawing extensive attention and gaining rapid development as an emerging biomedical imaging technology because of its high spatial resolution, large imaging depth, and rich optical contrast. PAI has great potential applications in endoscopy, but the progress of endoscopic PAI was hindered by the challenges of manufacturing and assembling miniature imaging components. Over the last decade, microelectromechanical systems (MEMS) technology has greatly facilitated the development of photoacoustic endoscopes and extended the realm of applicability of the PAI. As the key component of photoacoustic endoscopes, micromachined ultrasound transducers (MUTs), including piezoelectric MUTs (pMUTs) and capacitive MUTs (cMUTs), have been developed and explored for endoscopic PAI applications. In this article, the recent progress of pMUTs (thickness extension mode and flexural vibration mode) and cMUTs are reviewed and discussed with their applications in endoscopic PAI. Current PAI endoscopes based on pMUTs and cMUTs are also introduced and compared. Finally, the remaining challenges and future directions of MEMS ultrasound transducers for endoscopic PAI applications are given.


2012 ◽  
Vol 220-223 ◽  
pp. 915-920
Author(s):  
Jeng Haur Horng ◽  
Jen Fin Lin ◽  
Shin Yuh Chern ◽  
Chin Chung Wei ◽  
Chun Yueh Chen

With the rapid development of microelectromechanical systems (MEMS) technology, materials such as silicon, metal, and polymers are widely used in the MEMS field. One of the reliability concerns related to Si MEMS is unwanted wear and adhesion. Therefore, SiC film is a possible choice for surfaces because of its favorable friction and wear properties such as used in cutting tool and transmission system of wind turbine. In this study, biocompatible SAM film (ODS) was used to decrease the adhesion force and the friction coefficient of SiC surface. Experimental results show that ODS can increase the contact angle and decrease the surface roughness value of SiC surfaces for the different roughness values and roughness directions. For Si, SiC film and SAMs film on surfaces, larger normal forces lead to smaller friction coefficients and cross roughness pattern have a smaller friction coefficient than that of straight roughness pattern. In addition, ODS film can decrease the friction coefficient on cross topography with relative small roughness value more effectively than can straight topography of SiC surfaces.


Author(s):  
В.О. Подрыга ◽  
С.В. Поляков

Статья посвящена параллельной реализации многомасштабного подхода для расчета течений газов в микроканалах сложных технических систем. Многомасштабный подход сочетает решения уравнений квазигазодинамики (КГД) и молекулярной динамики (МД). Представлена параллельная реализация подхода, основанная на методах расщепления по физическим процессам и разделения областей. Реализация ориентирована на использование вычислительных систем с центральной и гибридной архитектурами. Разработанные параллельные алгоритмы обладают хорошей масштабируемостью. Полученные результаты подтвердили эффективность разработанного подхода. С его помощью методами МД были получены основные коэффициентные зависимости для КГД-системы, произведен расчет трехмерного течения. This paper is devoted to a parallel implementation of multiscale approach to the numerical study of gas flows in microchannels of complex technical systems. The multiscale approach combines the solutions of quasigasdynamic (QGD) equations and molecular dynamics (MD) equations. The proposed parallel implementation of this approach is based on the method of splitting into physical processes and the domain decomposition method. The implementation is oriented for using computer systems with central and hybrid architectures. The developed parallel algorithms show a good scalability. The obtained results confirm the efficiency of the approach under consideration. This approach was used to find the basic coefficient dependences for the QGD system by MD methods and to study a three-dimensional gas flow numerically.


2020 ◽  
Vol 2 (2) ◽  
pp. 062-062

Flexible electronics have attracted great attention due to their salient features and significant roles in the fields of energy, information, sensing, displays, smart skins, wearable systems, biomedical diagnostics, and artificial intelligence, etc. The past years have witnessed the rapid development of advanced materials and devices for flexible electronics. This special issue aims to collect high quality articles focused on thin-film materials, devices and carrier dynamics in flexible electronics and optoelectronics. It is desirable to search a variety of functional films including metallic, organic, inorganic, hybrid and composite materials for developing different types of flexible transistors, sensors, actuators, photodetectors, photovoltaic devices, light-emitting devices and beyond. It may contain, but not limited to material design, thin-film processing, structure regulation, property optimization, structure-property relationship, device engineering, and potential applications. Meanwhile, fundamental investigations on surface and interface characteristics, energy level alignments, charge and energy transfer processes, device operation mechanisms, and carrier dynamics related with advanced techniques such as ultrafast transient absorption and time-resolved (TR) spectroscopy, are welcome for understanding the thin-film materials and flexible devices. I kindly invite you to submit a manuscript(s) for this Special Issue. Full papers, communications, and reviews are all welcome.


Materials ◽  
2020 ◽  
Vol 13 (18) ◽  
pp. 4046
Author(s):  
Jingwei Zhao ◽  
Zhengyi Jiang ◽  
Leszek A. Dobrzański ◽  
Chong Soo Lee ◽  
Fuxiao Yu

Product miniaturization is a trend for facilitating product usage, enabling product functions to be implemented in microscale geometries, and aimed at reducing product weight, volume, cost and pollution. Driven by ongoing miniaturization in diverse areas including medical devices, precision equipment, communication devices, micro-electromechanical systems (MEMS) and microsystems technology (MST), the demands for micro metallic products have increased tremendously. Such a trend requires development of advanced micromanufacturing technology of metallic materials for producing high-quality micro metallic products that possess excellent dimensional tolerances, required mechanical properties and improved surface quality. Micromanufacturing differs from conventional manufacturing technology in terms of materials, processes, tools, and machines and equipment, due to the miniaturization nature of the whole micromanufacturing system, which challenges the rapid development of micromanufacturing technology. Against such a background, the Special Issue “Micromanufacturing of Metallic Materials” was proposed to present the recent developments of micromanufacturing technologies of metallic materials. The papers collected in the Special Issue include research articles, literature review and technical notes, which have been highlighted in this editorial.


Sensors ◽  
2020 ◽  
Vol 20 (6) ◽  
pp. 1662 ◽  
Author(s):  
Siyuan Liang ◽  
Weilong Zhu ◽  
Feng Zhao ◽  
Congyi Wang

With the rapid development of microelectromechanical systems (MEMS) technology, low-cost MEMS inertial devices have been widely used for inertial navigation. However, their application range is greatly limited in some fields with high precision requirements because of their low precision and high noise. In this paper, to improve the performance of MEMS inertial devices, we propose a highly efficient optimal estimation algorithm for MEMS arrays based on wavelet compressive fusion (WCF). First, the algorithm uses the compression property of the multiscale wavelet transform to compress the original signal, fusing the compressive data based on the support. Second, threshold processing is performed on the fused wavelet coefficients. The simulation result demonstrates that the proposed algorithm performs well on the output of the inertial sensor array. Then, a ten-gyro array system is designed for collecting practical data, and the frequency of the embedded processor in our verification environment is 800 MHz. The experimental results show that, under the normal working conditions of the MEMS array system, the 100 ms input array data require an approximately 75 ms processing delay when employing the WCF algorithm to support real-time processing. Additionally, the zero-bias instability, angle random walk, and rate slope of the gyroscope are improved by 8.0, 8.0, and 9.5 dB, respectively, as compared with the original device. The experimental results demonstrate that the WCF algorithm has outstanding real-time performance and can effectively improve the accuracy of low-cost MEMS inertial devices.


2003 ◽  
Vol 15 (6) ◽  
pp. 581-581
Author(s):  
Hidenori Ishihara ◽  

Micromechatronics has become a key issue in engineering. Robotics and mechatronics are a global concern. Micromechatronics contributes especially to the development of electrical and mechanical systems through miniaturization and advanced functions. Micromechatronics was defined by Prof. Fukuda, Prof. Fujita et. al in the 1980's. In 1980's, Microelectromechanical Systems (MEMS) was developed in the USA and then expanded to Japan and Germany. In the same time frame, devices based on precious machining technology were miniaturized in Japan and Switzerland as Michromachine. MEMS combines electronics and mechatronics and promotes new-conceptual devices such as intellectual sensors, e.g., pressure and acceleration sensors. Precious machining has improved manufacturing and achieved the find control. Thorough these development, Micromechatronics was born as an integrated technology. This special issue introduces basic technologies and applications of micromechatronics, which includes such vital technologies as mechanical, electric, and electrical engineering, machining, and MEMS. This issue, which features several topics on micromechatronics, will give readers a welcome chance to acquaint themselves with state-of-the-art information on micromechatronics. This issue contains nine technical papers on micro robots, intelligent microsensors, and their applications, together with related letters. It opens with a paper on microsensors by Fujiyoshi et al. and the application of miniaturized motors to a robotic hand by Nishibori et al. Included also are articles on micro robots by Aoyama, Torii, Wakimoto and Guo, work on unique micromanipulation systems by Nakamura et al., and the application of micro units to robotic systems by Yamada et al. Letters discuss objectives and achievements of micro robot contests held in Japan that serve to popularize and disseminate unique mechanisms and new concepts in this exciting field. I am certain this issue will provide readers with information that is both interesting and informative. In closing, I would like to thank the authors, members of the editorial board, and the publisher, without whose hard work and careful consideration this issue would not have been possible.


2017 ◽  
Vol 64 ◽  
pp. 1
Author(s):  
Arjan J.H. Frijns ◽  
Dimitris Valougeorgis ◽  
Stéphane Colin

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