scholarly journals Design and Analysis of a Turning Dynamometer Embedded in Thin-Film Sensor

Micromachines ◽  
2019 ◽  
Vol 10 (3) ◽  
pp. 210 ◽  
Author(s):  
Yuntao Zhang ◽  
Wenge Wu ◽  
Yanwen Han ◽  
Haijun Wen ◽  
Yunping Cheng ◽  
...  
Keyword(s):  
Thin Film ◽  
Sensitivity Coefficient ◽  
Bending Test ◽  
Strain Effect ◽  
Strain Sensitivity ◽  
Measurement Sensitivity ◽  
Element Analysis ◽  
Film Sensor ◽  
K Value ◽  
Mechanism Model

This paper proposes a high-strain sensitivity turning dynamometer that combines several thin-film resistor grids into three Wheatstone full-bridge circuits that can measure triaxial cutting forces. This dynamometer can replace different cutter heads using flange connections. In order to improve the strain effect of the dynamometer, the strain film sensor is fixed on the regular octagonal connection plates on both ends of the elastomer by vacuum brazing, and the stepped groove structure is also designed inside the elastomer. The dynamometer model is simplified as a four-segment cantilever beam which has different sections. The measurement mechanism model of the dynamometer system is established by the transformation relationship between deflection and strain, under external force. The standard turning tool of 20 mm square is used as a reference. The influence of the structural dimensions of the dynamometer on its strain sensitivity coefficient K is studied. The applicability of the theoretical model of dynamometer strain is verified by finite element analysis. Finally, the dynamometer with the largest K value is subjected to the bending test and compared with a standard turning tool. The experimental results show that the measurement sensitivity of the dynamometer is 2.32 times greater than that of the standard turning tool. The results also show that this dynamometer can effectively avoid the influence of the pasting process on strain transmission, thus indicating its great potential for measuring cutting force in the future.

Research on Failure Mechanism and Thermal Stress of Thin-film Thermocouple at High Temperature

2022 ◽  
Vol 905 ◽  
pp. 184-191
Author(s):  
Ting Chun Hu ◽  
Jia Fei Wang ◽  
Yi Yun Xi ◽  
Yu Feng Sun
Keyword(s):  
Thin Film ◽  
Thermal Stress ◽  
High Temperature ◽  
Failure Mechanism ◽  
Turbine Blades ◽  
Theoretical Models ◽  
Element Analysis ◽  
Film Sensor ◽  
Thin Film Thermocouple ◽  
Layer Thin Film

Aiming at the reliability of thin-film thermocouples applied to turbine blades at high temperatures, combined with high-temperature tests and finite element analysis, this paper studies its failure mechanism and thermal stress under thermal load. Multi-layer thin-film thermocouple samples were prepared on ceramic substrate, and high-temperature tests were carried out under different temperature loads, and the phenomenon of film shedding and cracking was observed using electron microscope. This paper analyzes the failure mechanism of the film sensor based on the function and structure, and uses ANSYS to analyze the thermal stress distribution of the film under high temperature load. Combining several existing theoretical models, this paper analyzes the factors affecting the thermal stress of the film and conducts simulation verification.

Strain sensitivity of thin-film InSb transistor

1973 ◽  
Vol 61 (1) ◽  
pp. 129-130 ◽  
Author(s):  
F.C. Luo ◽  
M. Epstein
Keyword(s):  
Thin Film ◽  
Strain Sensitivity

scholarly journals STUDY OF DNA-DIETHYLSTILBOESTROL INTERACTION USING GRAPHENE-BASED THIN-FILM SENSOR AND UV-VIS SPECTROSCOPY

2018 ◽  
Vol 63 (1) ◽  
pp. 3795-3798
Author(s):  
Meifeng Chen ◽  
Xinying Ma ◽  
Xia Li ◽  
Mingjing Yin ◽  
Yanyun Li ◽  
...  
Keyword(s):  
Thin Film ◽  
Film Sensor ◽  
Thin Film Sensor ◽  
Vis Spectroscopy

Effect of Temperature on the Electrical and Gas Sensing Properties of Polyaniline and Multiwall Carbon Nanotube Doped Polyaniline Composite Thin Films

2011 ◽  
Vol 254 ◽  
pp. 167-170 ◽  
Author(s):  
Subodh Srivastava ◽  
Sumit Kumar ◽  
Vipin Kumar Jain ◽  
Y.K. Vijay
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Gas Sensing ◽  
Hydrogen Gas ◽  
Composite Thin Film ◽  
Effect Of Temperature ◽  
Multiwall Carbon Nanotube ◽  
Film Sensor ◽  
Composite Thin Films ◽  
Pani Composite

In the present work we have reported the effect of temperature on the gas sensing properties of pure Polyaniline (PANI) and Multiwall carbon nanotube (MWNT) doped PANI composite thin film based chemiresistor type gas sensors for hydrogen gas sensing application. PANI and MWNT doped PANI composite were synthesized by in situ chemical oxidative polymerization of aniline using ammonium persulfate in an acidic medium. The thin sensing film of chemically synthesized PANI and MWNT doped PANI composite were deposited onto finger type Cu-interdigited electrodes using spin cast technique to prepared chemiresistor type gas sensor. The electrical properties of these composite thin films were characterized by I-V measurements as function of temperature. The I-V measurement revealed that conductivity of composite thin films increased as the temperature increased. The changes in resistance of the composite thin film sensor were utilized for detection of hydrogen gas. It was observed that at room temperature, MWNT doped PANI composite sensor shows higher response value and sensitivity with good repeatability in comparison to pure PANI thin film sensor. It was also observed that both PANI and MWNT doped PANI composite thin film based sensors showed unstable behavior as the temperature increased. The surface morphology of these composite thin films has also been characterized by scanning electron microscopy (SEM) measurement.

A Finite Element Analysis for Magnetostrictive Thin Film Structures and Its Experimental Verification

2006 ◽  
Vol 306-308 ◽  
pp. 1151-1156 ◽  
Author(s):  
Chong Du Cho ◽  
Heung Shik Lee ◽  
Chang Boo Kim ◽  
Hyeon Gyu Beom
Keyword(s):  
Thin Film ◽  
Finite Element Analysis ◽  
Finite Element ◽  
Geometric Feature ◽  
Hysteresis Phenomenon ◽  
Finite Element Code ◽  
Element Analysis ◽  
Element Mesh ◽  
Magnetostrictive Actuators ◽  
Large Length

In this paper, a finite element code especially for micro-magnetostrictive actuators was developed. Two significant characteristics of the presented finite element code are: (1) the magnetostrictive hysteresis phenomenon is effectively taken into account; (2) intrinsic geometric feature of typical thin film structures of large length to thickness ratio, which makes it very difficult to construct finite element mesh in the region of the thin film, is considered reasonably in modeling micro-magneostrictive actuators. For verification purpose, magnetostrictive thin films were fabricated and tested in the form of a cantilevered actuator. The Tb-Fe film and Sm-Fe film are sputtered on the Si and Polyimide substrates individually. The magnetic and magnetostrictive properties of the sputtered magnetostrictive films are measured. The measured magnetostrictive coefficients are compared with the numerically calculated ones.

A simple and cost-effective zinc oxide thin film sensor for propane gas detection

2015 ◽  
Vol 157 ◽  
pp. 169-171 ◽  
Author(s):  
Vinoth Kumar Jayaraman ◽  
Arturo Maldonado Álvarez ◽  
María de la Luz Olvera Amador
Keyword(s):  
Thin Film ◽  
Zinc Oxide ◽  
Cost Effective ◽  
Gas Detection ◽  
Oxide Thin Film ◽  
Zinc Oxide Thin Film ◽  
Film Sensor ◽  
Thin Film Sensor

An Interfacial Delamination Analysis for Multichip Module Thin Film Interconnects

1996 ◽  
Vol 118 (4) ◽  
pp. 206-213 ◽  
Author(s):  
K. X. Hu ◽  
C. P. Yeh ◽  
X. S. Wu ◽  
K. Wyatt
Keyword(s):  
Thin Film ◽  
Phase Angle ◽  
Structural Reliability ◽  
Thermal Loading ◽  
Multichip Module ◽  
Crack Model ◽  
Element Analysis ◽  
Delamination Growth ◽  
Interfacial Delamination ◽  
Functional Behavior

Analysis of interfacial delamination for multichip module thin-film interconnects (MCM/TFI) is the primary objective of this paper. An interface crack model is integrated with finite-element analysis to allow for accurate numerical evaluation of the magnitude and phase angle of the complex stress intensity factor. Under the assumption of quasi-static delamination growth, the fate of an interfacial delamination after inception of propagation is determined. It is established that whether an interfacial delamination will continue to grow or become arrested depends on the functional behavior of the energy release rate and loading phase angle over the history of delamination growth. This functional behavior is numerically obtained for a typical MCM/TFI structure with delamination along die and via base, subjected to thermal loading condition. The effect of delamination interactions on the structural reliability is also investigated. It is observed that the delamination along via wall and polymer thin film can provide a benevolent mechanism to relieve thermal constraints, leading to via stress relaxation.

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