scholarly journals MEMS Actuators for Optical Microendoscopy

Micromachines ◽  
2019 ◽  
Vol 10 (2) ◽  
pp. 85 ◽  
Author(s):  
Zhen Qiu ◽  
Wibool Piyawattanametha
Keyword(s):  
High Performance ◽  
Microelectromechanical Systems ◽  
Fabrication Technology ◽  
Optical Components ◽  
Research Institutes ◽  
Mems Fabrication ◽  
Batch Fabrication ◽  
Mems Actuators ◽  
Mems Technology ◽  
Manufacturing Methods

Growing demands for affordable, portable, and reliable optical microendoscopic imaging devices are attracting research institutes and industries to find new manufacturing methods. However, the integration of microscopic components into these subsystems is one of today’s challenges in manufacturing and packaging. Together with this kind of miniaturization more and more functional parts have to be accommodated in ever smaller spaces. Therefore, solving this challenge with the use of microelectromechanical systems (MEMS) fabrication technology has opened the promising opportunities in enabling a wide variety of novel optical microendoscopy to be miniaturized. MEMS fabrication technology enables abilities to apply batch fabrication methods with high-precision and to include a wide variety of optical functionalities to the optical components. As a result, MEMS technology has enabled greater accessibility to advance optical microendoscopy technology to provide high-resolution and high-performance imaging matching with traditional table-top microscopy. In this review the latest advancements of MEMS actuators for optical microendoscopy will be discussed in detail.

RF-MEMS Components and Networks for High-Performance Reconfigurable Telecommunication and Wireless Systems

2012 ◽  
Vol 81 ◽  
pp. 65-74 ◽  
Author(s):  
Jacopo Iannacci ◽  
Giuseppe Resta ◽  
Paola Farinelli ◽  
Roberto Sorrentino
Keyword(s):  
High Performance ◽  
Microelectromechanical Systems ◽  
Rf Mems ◽  
Low Cost ◽  
Impedance Matching ◽  
Phase Shifters ◽  
Rf Systems ◽  
Mems Technology ◽  
And Performance ◽  
Rf Performance

MEMS (MicroElectroMechanical-Systems) technology applied to the field of Radio Frequency systems (i.e. RF-MEMS) has emerged in the last 10-15 years as a valuable and viable solution to manufacture low-cost and very high-performance passive components, like variable capacitors, inductors and micro-relays, as well as complex networks, like tunable filters, reconfigurable impedance matching networks and phase shifters, and so on. The availability of such components and their integration within RF systems (e.g. radio transceivers, radars, satellites, etc.) enables boosting the characteristics and performance of telecommunication systems, addressing for instance a significant increase of their reconfigurability. The benefits resulting from the employment of RF-MEMS technology are paramount, being some of them the reduction of hardware redundancy and power consumption, along with the operability of the same RF system according to multiple standards. After framing more in detail the whole context of RF MEMS technology, this paper will provide a brief introduction on a typical RF-MEMS technology platform. Subsequently, some relevant examples of lumped RF MEMS passive elements and complex reconfigurable networks will be reported along with their measured RF performance and characteristics.

MEMS-Enabled Smart Beam-Steering Antennas

2014 ◽  
pp. 183-203
Author(s):  
Hadi Mirzajani ◽  
Habib Badri Ghavifekr ◽  
Esmaeil Najafi Aghdam
Keyword(s):  
Microelectromechanical Systems ◽  
Rf Mems ◽  
Beam Steering ◽  
Smart Antennas ◽  
Phase Shifters ◽  
Rapid Rate ◽  
Mems Devices ◽  
Batch Fabrication ◽  
Mems Technology ◽  
Smart Beam

In recent years, Microelectromechanical Systems (MEMS) technology has seen a rapid rate of evolution because of its great potential for advancing new products in a broad range of applications. The RF and microwave devices and components fabricated by this technology offer unsurpassed performance such as near-zero power consumption, high linearity, and cost effectiveness by batch fabrication in respect to their conventional counterparts. This chapter aims to give an in-depth overview of the most recently published methods of designing MEMS-based smart antennas. Before embarking into the different techniques of beam steering, the concept of smart antennas is introduced. Then, some fundamental concepts of MEMS technology such as micromachining technologies (bulk and surface micromachining) are briefly discussed. After that, a number of RF MEMS devices such as switches and phase shifters that have applications in beam steering antennas are introduced and their operating principals are completely explained. Finally, various configurations of MEMS-enabled beam steering antennas are discussed in detail.

Thermomechanics of High-Pressure MEMS Sensors

2007 ◽  
Author(s):  
Ryszard J. Pryputniewicz
Keyword(s):  
High Pressure ◽  
High Performance ◽  
Microelectromechanical Systems ◽  
Hybrid Approach ◽  
Mems Sensors ◽  
Temperature Changes ◽  
Sensing Technology ◽  
Piezoresistive Sensor ◽  
Mems Fabrication ◽  
Increasing Demand

Increasing demand for high performance, stable, and affordable sensors for applications in process control industry has led to development of a miniature pressure sensor. This development, made possible by recent advances in microelectromechanical systems (MEMS) fabrication, utilizes polysilicon-sensing technology. The unique polysilicon piezoresistive sensor (PPS) measures differential pressure (DP) based on deformations of a multilayer/multimaterial diaphragm, which is about 2 μm thick. Deformations of a diaphragm, subjected to changes in pressure, are sensed by the piezoresistive bridge elements. Determination of the loading pressures from strains of the piezoresistors is based on computations relying on a number of material specific and process dependent coefficients that, because of their nature, can vary, which may lead to uncertainties in displayed results, especially when temperature changes also. To establish an independent means for measurements of the thermomechanical (TM) deformations of the PPS diaphragms and to validate the coefficients used, a hybrid methodology, based on measurements using optoelectronic laser interferometric microscope (OELIM) and finite element method (FEM) computations coupled with uncertainty analysis provided by unique closed form formulations, was developed. This methodology allows highly accurate and precise measurements of TM deformations of diaphragms, as well as their computational modeling/simulations, and is a basis for “design by analysis” approach to efficient and effective developments of new MEMS sensors. In this paper the hybrid approach is described and its use is illustrated by representative examples addressing high-pressure MEMS sensors.

scholarly journals 3D Printed MEMS Technology—Recent Developments and Applications

Micromachines ◽  
2020 ◽  
Vol 11 (4) ◽  
pp. 434 ◽  
Author(s):  
Tomasz Blachowicz ◽  
Andrea Ehrmann
Keyword(s):  
3D Printing ◽  
Microelectromechanical Systems ◽  
Measurement Technology ◽  
Mems Fabrication ◽  
Recent Developments ◽  
Mems Technology ◽  
New Ideas ◽  
3D Printed ◽  
New Applications ◽  
The Internet Of Things

Microelectromechanical systems (MEMS) are of high interest for recent electronic applications. Their applications range from medicine to measurement technology, from microfluidics to the Internet of Things (IoT). In many cases, MEMS elements serve as sensors or actuators, e.g., in recent mobile phones, but also in future autonomously driving cars. Most MEMS elements are based on silicon, which is not deformed plastically under a load, as opposed to metals. While highly sophisticated solutions were already found for diverse MEMS sensors, actuators, and other elements, MEMS fabrication is less standardized than pure microelectronics, which sometimes blocks new ideas. One of the possibilities to overcome this problem may be the 3D printing approach. While most 3D printing technologies do not offer sufficient resolution for MEMS production, and many of the common 3D printing materials cannot be used for this application, there are still niches in which the 3D printing of MEMS enables producing new structures and thus creating elements for new applications, or the faster and less expensive production of common systems. Here, we give an overview of the most recent developments and applications in 3D printing of MEMS.

scholarly journals In-Situ Integration of 3D C-MEMS Microelectrodes with Bipolar Exfoliated Graphene for Label-Free Electrochemical Cancer Biomarkers Aptasensor

Micromachines ◽  
2022 ◽  
Vol 13 (1) ◽  
pp. 104
Author(s):  
Shahrzad Forouzanfar ◽  
Nezih Pala ◽  
Chunlei Wang
Keyword(s):  
High Performance ◽  
Microelectromechanical Systems ◽  
Point Of Care ◽  
High Sensitivity ◽  
Label Free ◽  
Lab On Chip ◽  
Electrochemical Label ◽  
Mems Technology ◽  
On Chip

The electrochemical label-free aptamer-based biosensors (also known as aptasensors) are highly suitable for point-of-care applications. The well-established C-MEMS (carbon microelectromechanical systems) platforms have distinguishing features which are highly suitable for biosensing applications such as low background noise, high capacitance, high stability when exposed to different physical/chemical treatments, biocompatibility, and good electrical conductivity. This study investigates the integration of bipolar exfoliated (BPE) reduced graphene oxide (rGO) with 3D C-MEMS microelectrodes for developing PDGF-BB (platelet-derived growth factor-BB) label-free aptasensors. A simple setup has been used for exfoliation, reduction, and deposition of rGO on the 3D C-MEMS microelectrodes based on the principle of bipolar electrochemistry of graphite in deionized water. The electrochemical bipolar exfoliation of rGO resolves the drawbacks of commonly applied methods for synthesis and deposition of rGO, such as requiring complicated and costly processes, excessive use of harsh chemicals, and complex subsequent deposition procedures. The PDGF-BB affinity aptamers were covalently immobilized by binding amino-tag terminated aptamers and rGO surfaces. The turn-off sensing strategy was implemented by measuring the areal capacitance from CV plots. The aptasensor showed a wide linear range of 1 pM–10 nM, high sensitivity of 3.09 mF cm−2 Logc−1 (unit of c, pM), and a low detection limit of 0.75 pM. This study demonstrated the successful and novel in-situ deposition of BPE-rGO on 3D C-MEMS microelectrodes. Considering the BPE technique’s simplicity and efficiency, along with the high potential of C-MEMS technology, this novel procedure is highly promising for developing high-performance graphene-based viable lab-on-chip and point-of-care cancer diagnosis technologies.

scholarly journals A comprehensive overview of recent developments in RF-MEMS technology-based high-performance passive components for applications in the 5G and future telecommunications scenarios

2021 ◽  
Vol 34 (3) ◽  
pp. 333-366
Author(s):  
Girolamo Tagliapietra ◽  
Jacopo Iannacci
Keyword(s):  
High Performance ◽  
Microelectromechanical Systems ◽  
Rf Mems ◽  
Beam Steering ◽  
Multiple Input Multiple Output ◽  
Phase Shifters ◽  
Comprehensive Overview ◽  
Passive Components ◽  
High Data ◽  
Mems Technology

The goal of this work is to provide an overview about the current development of radio-frequency microelectromechanical systems technology, with special attention towards those passive components bearing significant application potential in the currently developing 5G paradigm. Due to the required capabilities of such communication standard in terms of high data rates, extended allocated spectrum, use of massive MIMO (Multiple- Input-Multiple-Output) systems, beam steering and beam forming, the focus will be on devices like switches, phase shifters, attenuators, filters, and their packaging/integration. For each of the previous topics, several valuable contributions appeared in the last decade, underlining the improvements produced in the state of the art and the chance for RFMEMS technology to play a prominent role in the actual implementation of the 5G infrastructure.

scholarly journals A Peristaltic Micropump Based on the Fast Electrochemical Actuator: Design, Fabrication, and Preliminary Testing

Actuators ◽  
2021 ◽  
Vol 10 (3) ◽  
pp. 62
Author(s):  
Ilia Uvarov ◽  
Pavel Shlepakov ◽  
Artem Melenev ◽  
Kechun Ma ◽  
Vitaly Svetovoy ◽  
...  
Keyword(s):  
High Performance ◽  
Drug Delivery Systems ◽  
Main Part ◽  
Fabrication Technology ◽  
Fabrication Procedure ◽  
Order Of Magnitude ◽  
Peristaltic Micropump ◽  
Biomedical Field ◽  
Lift Off ◽  
Actuator Design

Microfluidic devices providing an accurate delivery of fluids at required rates are of considerable interest, especially for the biomedical field. The progress is limited by the lack of micropumps, which are compact, have high performance, and are compatible with standard microfabrication. This paper describes a micropump based on a new driving principle. The pump contains three membrane actuators operating peristaltically. The actuators are driven by nanobubbles of hydrogen and oxygen, which are generated in the chamber by a series of short voltage pulses of alternating polarity applied to the electrodes. This process guaranties the response time of the actuators to be much shorter than that of any other electrochemical device. The main part of the pump has a size of about 3 mm, which is an order of magnitude smaller in comparison with conventional micropumps. The pump is fabricated in glass and silicon wafers using standard cleanroom processes. The channels are formed in SU-8 photoresist and the membrane is made of SiNx. The channels are sealed by two processes of bonding between SU-8 and SiNx. Functionality of the channels and membranes is demonstrated. A defect of electrodes related to the lift-off fabrication procedure did not allow a demonstration of the pumping process although a flow rate of 1.5 µl/min and dosage accuracy of 0.25 nl are expected. The working characteristics of the pump make it attractive for the use in portable drug delivery systems, but the fabrication technology must be improved.

Novel die-sinking micro-electro discharge machining process using microelectromechanical systems technology

2006 ◽  
Vol 220 (9) ◽  
pp. 1481-1487 ◽  
Author(s):  
J-B Li ◽  
K Jiang ◽  
G J Davies
Keyword(s):  
Microelectromechanical Systems ◽  
Machining Process ◽  
Metallic Surface ◽  
Manufacturing Cost ◽  
Sem Images ◽  
Deep Reactive Ion Etching ◽  
Electro Discharge Machining ◽  
Mems Technology ◽  
Fabrication Condition ◽  
Edm Process

A novel die-sinking micro-electro discharge machining (EDM) process is presented for volume fabrication of metallic microcomponents. In the process, a high-precision silicon electrode is fabricated using deep reactive ion etching (DRIE) process of microelectromechanical systems (MEMS) technology and then coated with a thin layer of copper to increase the conductivity. The metalized Si electrode is used in the EDM process to manufacture metallic microcomponents by imprinting the electrode onto a flat metallic surface. The two main advantages of this process are that it enables the fabrication of metallic microdevices and reduces manufacturing cost and time. The development of the new EDM process is described. A silicon component was produced using the Surface Technology Systems plasma etcher and the DRIE process. Such components can be manufactured with a precision in nanometres. The minimum feature of the component is 50 μm. In the experiments, the Si component was coated with copper and then used as the electrode on an EDM machine of 1 μm resolution. In the manufacturing process, 130 V and 0.2 A currents were used for a period of 5 min. The SEM images of the resulting device show clear etched areas, and the electric discharge wave chart indicates a good fabrication condition. The experimental results have been analysed and the new micro-EDM process is found to be able to fabricate 25 μm features.

New Hybrid Methodology for the Development of MEMS Multivariable Sensors

2001 ◽  
Author(s):  
Emily J. Pryputniewicz ◽  
John P. Angelosanto ◽  
Gordon C. Brown ◽  
Cosme Furlong ◽  
Ryszard J. Pryputniewicz
Keyword(s):  
Process Control ◽  
Microelectromechanical Systems ◽  
Absolute Pressure ◽  
Single Chip ◽  
Specific Test ◽  
Mems Sensor ◽  
Test Conditions ◽  
Mems Technology ◽  
Functional Operation ◽  
Hybrid Methodology

Abstract Using recent advances in microelectromechanical systems (MEMS) technology, a new multivariable sensor was developed. This MEMS sensor, capable of measuring temperature, absolute pressure, and differential pressure on a single chip, is particularly suitable for applications in process control industry. However, functional operation of the sensor depends on validation of its performance under specific test conditions. We have developed a hybrid methodology, based on analysis and measurements, that allows such validation. In this paper, the MEMS multivariable sensor is described, the hybrid methodology is outlined, and its use is illustrated with representative results.

scholarly journals Towards a biomimetic gyroscope inspired by the fly's haltere using microelectromechanical systems technology

2014 ◽  
Vol 11 (99) ◽  
pp. 20140573 ◽  
Author(s):  
H. Droogendijk ◽  
R. A. Brookhuis ◽  
M. J. de Boer ◽  
R. G. P. Sanders ◽  
G. J. M. Krijnen
Keyword(s):  
Microelectromechanical Systems ◽  
Damping Ratio ◽  
Fast Response ◽  
Gyroscopic System ◽  
Drive Mode ◽  
Mems Gyroscope ◽  
Coriolis Forces ◽  
Mems Technology ◽  
Large Measurement ◽  
Theoretical Performance

Flies use so-called halteres to sense body rotation based on Coriolis forces for supporting equilibrium reflexes. Inspired by these halteres, a biomimetic gimbal-suspended gyroscope has been developed using microelectromechanical systems (MEMS) technology. Design rules for this type of gyroscope are derived, in which the haltere-inspired MEMS gyroscope is geared towards a large measurement bandwidth and a fast response, rather than towards a high responsivity. Measurements for the biomimetic gyroscope indicate a (drive mode) resonance frequency of about 550 Hz and a damping ratio of 0.9. Further, the theoretical performance of the fly's gyroscopic system and the developed MEMS haltere-based gyroscope is assessed and the potential of this MEMS gyroscope is discussed.

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