scholarly journals Wettability and Infiltration of Liquid Silicon on Graphite Substrates

Metals ◽  
2019 ◽  
Vol 9 (3) ◽  
pp. 300 ◽  
Author(s):  
Almudena Casado ◽  
Jose Torralba ◽  
Srdjan Milenkovic
Keyword(s):  
Sessile Drop ◽  
Triple Line ◽  
Passive Layer ◽  
Sessile Drop Method ◽  
Purification Process ◽  
Key Factors ◽  
Vacuum Refining ◽  
New Methods ◽  
Solar Silicon ◽  
Infiltration Behavior

The energy crisis has stimulated a rapid growth of developments in the photovoltaic industry in recent years. To reduce the high cost and the toxicity of classical metallurgical routes, new methods, such as vacuum refining of silicon, have been developed. Moreover, at the industry level, parameters such as the porosity in crucibles and dies are not controlled, so wettability, infiltration, and reaction between silicon and graphite are the key factors in the purification process. In this work, the behavior of several refractory substrates against melted silicon was studied by the classic sessile drop method. The most important phenomena, i.e., wettability and infiltration, were compared with the properties of the substrates. According to the results, for the carbonaceous materials, the reaction of triple line silicon-graphite manages these phenomena, whereas for alumina, a passive layer is formed due to the presence of oxygen, which is subsequently eliminated by the chemical reactions, delaying the process. Regarding the contact angle and infiltration behavior, alumina showed the best results, but due to its reactivity, it contaminates Si, so that this material is not recommended for solar silicon application. However, composite 2 is compatible with the application, as it shows good results in comparison with the other materials.

Wettability and Interfacial Characteristic of Sn-Ag-Cu Solder on Ni Substrates at Elevated Temperatures

2012 ◽  
Vol 554-556 ◽  
pp. 703-708
Author(s):  
Li Kun Zang ◽  
Zhang Fu Yuan Yuan ◽  
Hong Liang Yan ◽  
Xin Xue Li
Keyword(s):  
Integrated Circuits ◽  
Elevated Temperatures ◽  
Sessile Drop ◽  
Triple Line ◽  
Contact Angles ◽  
Sessile Drop Method ◽  
Reactive Wetting ◽  
Ni Substrate ◽  
Eds Analysis ◽  
Interfacial Characteristic

Wettability and interfacial characteristic of the Sn-3.0Ag-0.5Cu/Ni system are investigated by sessile drop method at the temperature range of 503~673K. The reactive wetting processes demonstrate that: contact angles between the solder and Ni substrate decrease as exponential decay and the equilibrium contact angles decrease monotonously with the temperature increasing. Triple-line mobility is enhanced as the temperature increases. Interface of the Sn-3.0Ag-0.5Cu /Ni interface are identified by EPMA and EDS analysis as (Cu,Ni)6Sn5 adjacent to the solder and Ni3Sn4 adjacent to the Ni substrate, respectively. Cu is condensed at the interface, the composition of (Cu,Ni)6Sn5 is (23.16~23.46)Ni- (36.56~37.52) Cu-(39.02~40.27)Sn (atom %). The formation of the (Cu,Ni)6Sn5 IMC was known to greatly improve the reliability of the solder joints in integrated circuits.

Wetting Behavior and Interfacial Characteristic of the Sn-3.5Ag Alloy on Ni Substrates

2013 ◽  
Vol 834-836 ◽  
pp. 335-339
Author(s):  
Li Kun Zang ◽  
Hong Liang Yan ◽  
Zhang Fu Yuan ◽  
Li Ying Lu
Keyword(s):  
Integrated Circuits ◽  
Sessile Drop ◽  
Triple Line ◽  
Contact Angles ◽  
Sessile Drop Method ◽  
Reactive Wetting ◽  
Wetting Behavior ◽  
Ni Substrate ◽  
Eds Analysis ◽  
Interfacial Characteristic

Wetting behavior and interfacial characteristic of the Sn-3.5Ag/Ni system are investigated by sessile drop method at the temperature range of 523~773K. The reactive wetting processes demonstrate that: contact angles between the solder and Ni substrate decrease as exponential decay and the equilibrium contact angles decrease monotonously with the temperature increasing. Triple-line mobility is enhanced as the temperature increases. Compositions of the Sn-3.5Ag/Ni interface are identified by EPMA and EDS analysis as Ni3Sn4adjacent to the solder and Ni3Sn adjacent to the Ni substrate, respectively. The formation of the interface IMC was known to greatly improve the reliability of the solder joints in integrated circuits.

A Sessile Drop Method for Facile and Robust Spheroid Cultures

2021 ◽  
pp. 2100972
Author(s):  
Bangyong Sun ◽  
Yi Zhao ◽  
Qiang Zhao ◽  
Gang Li
Keyword(s):  
Sessile Drop ◽  
Sessile Drop Method ◽  
Drop Method

Use of the Sessile Drop Method to Understand the Behaviour of Self Healing Ceramic Matrix Composite

2008 ◽  
Vol 595-598 ◽  
pp. 1173-1180
Author(s):  
Sébastien Wery ◽  
Francis Teyssandier
Keyword(s):  
Glass Ceramic ◽  
Sessile Drop ◽  
Ceramic Matrix Composite ◽  
Ceramic Matrix ◽  
Sessile Drop Method ◽  
Self Healing ◽  
Infiltration Process ◽  
Drop Method ◽  
Sic Composites ◽  
Sealing Glass

Surface and interfacial properties of borosilicate glass/ceramic systems have been investigated using the sessile drop method. The purpose is to compare and understand the reactivity of the sealing glass in C / SiC and SiC / SiC composites. A hot wall reactor has been designed to measure the variation of the contact angle and the spreading kinetic according to the temperature (500 to 1100°C) and the atmosphere (Ar, Ar + O2 and Ar + H2O). Chemical and morphological analyses underline (i) the strong reactivity between the liquid and the ceramic, (ii) the influence of the infiltration process and (iii) the strong influence of the oxidizing agent on the wetting behaviour of the glass/ceramic systems.

Synthesis of Porous Heat-Insulating Material from Industrial Waste

2018 ◽  
Vol 284 ◽  
pp. 82-89
Author(s):  
Liudmila Shtirc ◽  
Svetlana G. Vlasova ◽  
K. Zemlyanoi
Keyword(s):  
Surface Tension ◽  
Industrial Waste ◽  
Sessile Drop ◽  
Foam Glass ◽  
Temperature Drop ◽  
Sessile Drop Method ◽  
Insulating Material ◽  
Stable Temperature ◽  
Crystallization Ability ◽  
Glass Compositions

We chose two glass compositions suitable for the synthesis of foam glass. The influence of additive at the amorphous silica charge in the amount of 20% and 100%, a by-product in the leaching of serpentinite, was studied. By the method of stable temperature drop, the crystallization ability of the welded glass compositions was studied. The surface tension was measured by the sessile drop method.

Numerical computation of wetting angles of Sn–(3−x)Ag–0.5Cu−x(Bi,In) quaternary Pb-free solder alloy systems on Cu substrate

2020 ◽  
Vol 31 (09) ◽  
pp. 2050119
Author(s):  
Ahmet Mustafa Erer ◽  
Mukaddes Ökten Turacı
Keyword(s):  
Numerical Model ◽  
Numerical Computation ◽  
Solder Alloy ◽  
Empirical Model ◽  
Sessile Drop ◽  
Sessile Drop Method ◽  
Experimental Results ◽  
Cu Substrate ◽  
Free Solder ◽  
Alloy Systems

This paper was aimed to study of the wetting angle ([Formula: see text]) of Sn–Ag–Cu, Sn–([Formula: see text])Ag–0.5Cu–([Formula: see text])Bi and Sn–([Formula: see text])Ag–0.5Cu–([Formula: see text])In ([Formula: see text], 1 and 2 in wt.%) Pb-free solder alloy systems at various temperatures (250, 280 and 310∘C) on Cu substrate in Ar atmosphere. The new Sn–([Formula: see text])Ag–0.5Cu–xBi and Sn–([Formula: see text])Ag–0.5Cu[Formula: see text]([Formula: see text]) In systems, low Ag content quaternary Pb-free solder alloys, were produced by adding 0.5%, 1% and 2% Bi and In separately to the near-eutectic Sn-3[Formula: see text]wt.%Ag–0.5[Formula: see text]wt.%Cu (SAC305) alloy. The wetting angles of new alloys, Sn[Formula: see text]2.5[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]0.5[Formula: see text]wt.%Bi (SAC-0.5Bi), Sn[Formula: see text]2[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]1[Formula: see text]wt.%Bi(SAC-1Bi), Sn[Formula: see text]1[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]2[Formula: see text]wt.%Bi(SAC-2Bi), Sn[Formula: see text]2.5[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]0.5[Formula: see text]wt.%In (SAC-0.5In), Sn[Formula: see text]2[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]1[Formula: see text]wt.%In (SAC-1In) and Sn[Formula: see text]1[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt%.Cu[Formula: see text]2[Formula: see text]wt.%In (SAC-2In) were measured by sessile drop method. Experimental results showed that additions of Bi and In separately to SAC305 resulted in a continuous decrease in the [Formula: see text] up to 1[Formula: see text]wt.% above which the [Formula: see text] value was increased and it is appeared that a correlation among the [Formula: see text], alloys compositions and the test temperatures exists which recommended an empirical model to estimate the [Formula: see text] at a given Bi and In content and temperature for a given alloy systems. The numerical model estimates the [Formula: see text] understandably well with the present work.

Wettability Study of Red Ceramic and Glaze from Dimension Stone Waste

2017 ◽  
Vol 899 ◽  
pp. 289-294
Author(s):  
Maria Vitória Machado Rosetti ◽  
R.A. Carvalho ◽  
S.P. Taguchi ◽  
L.A. Borges
Keyword(s):  
Contact Angle ◽  
Melting Point ◽  
Optical Microscopy ◽  
Sessile Drop ◽  
Longitudinal Section ◽  
Sessile Drop Method ◽  
Ceramic Plate ◽  
Dimension Stone ◽  
Drop Method ◽  
Stone Industry

The dimension stone industry produces large amount of residue. An alternative to reduce this environmental liability is to apply as glaze in coating ceramic. This research is about the wettability between glaze and red ceramic, applying the sessile drop method. The waste and additives were mixed, pressed, and put over red ceramic plate previously sintered. The system was heated until the melting point of the glaze and the contact angle decreasing was measured in function of the temperature, and in a function of the time at 750 °C and 800 °C. The minimum contact angle value was near 6 ° at 994 °C in the testing changing the temperature, and presents 19 ° and 10 °, respectively, at 750 °C and 800 °C, when the time was varied. The longitudinal section of the samples was analyzed using optical microscopy, showing physical wettability in all testing. This glaze presents good wettability on red ceramic with potential as coating ceramic.

scholarly journals Influence of Experimental Variables on the Measure of Contact Angle in Metals Using the Sessile Drop Method

2015 ◽  
Vol 8 ◽  
pp. 742-751 ◽  
Author(s):  
Jonathan M. Schuster ◽  
Carlos E. Schvezov ◽  
Mario R. Rosenberger
Keyword(s):  
Contact Angle ◽  
Sessile Drop ◽  
Sessile Drop Method ◽  
Drop Method
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