scholarly journals Fabrication of Roughened Electrodeposited Copper Coating on Steel for Dissimilar Joining of Steel and Thermoplastic Resin

Metals ◽  
2021 ◽  
Vol 11 (4) ◽  
pp. 591
Author(s):  
Susumu Arai ◽  
Ryosuke Iwashita ◽  
Masahiro Shimizu ◽  
Junki Inoue ◽  
Masaomi Horita ◽  
...  
Keyword(s):  
Shear Strength ◽  
Thermal Shock ◽  
Bonding Strength ◽  
Steel Substrate ◽  
Copper Film ◽  
Copper Coating ◽  
Thermal Shock Test ◽  
Thermoplastic Resin ◽  
Shock Test ◽  
Lap Shear

Electrodeposition of a roughened copper coating onto steel was carried out to produce a bonding surface for thermoplastic resin (polyphenylenesulfide). The roughened copper film was electrodeposited using a copper sulfate bath containing polyacrylic acid (PAA). Following injection molding of the resin, the bonding strength was evaluated in a tensile lap shear strength test, followed by durability testing at high temperature and humidity (85 ± 2 °C and 85 ± 2% relative humidity, respectively) for 2000 h, and a thermal shock test (−50 °C–150 °C) for 1000 cycles. An analysis of the boundary microstructure showed that the PAA concentration had a large effect on the surface morphology of the copper film. The shear strength of the joint between the coated steel substrate and the resin was more than 40 MPa, and the bonding strength also remained above 40 MPa throughout the durability test. During the thermal shock test, although the bonding strength gradually decreased with increasing number of cycles, it remained at over 20 MPa, even after 1000 cycles. This method achieves not only high initial bonding strength, but also durability for joints between dissimilar materials such as steel and resin.

Degradation Behavior of TiN Coatings with Different Thicknesses after a Pulsed Laser Thermal Shock Test

2013 ◽  
Vol 51 (10) ◽  
pp. 729-734 ◽  
Author(s):  
Seol Jeon ◽  
Youngkue Choi ◽  
Hyun-Gyoo Shin ◽  
Hyun Park ◽  
Heesoo Lee ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Pulsed Laser ◽  
Thermal Shock Test ◽  
Degradation Behavior ◽  
Shock Test ◽  
Tin Coatings

Analysis of the electrical characteristics and structure of Cu-Filled TSV with thermal shock test

2014 ◽  
Vol 10 (3) ◽  
pp. 649-653 ◽  
Author(s):  
Il Ho Jeong ◽  
Myong Hoon Roh ◽  
Flora Jung ◽  
Wan Ho Song ◽  
Michael Mayer ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Thermal Shock Test ◽  
Electrical Characteristics ◽  
Shock Test

Binding Performance of a Zirconia Framework Material and Veneering Porcelain

2010 ◽  
Vol 177 ◽  
pp. 186-189 ◽  
Author(s):  
Long Quan Shao ◽  
Bin Deng ◽  
Yuan Fu Yi ◽  
Qi Liu ◽  
Wei Wei Zhang ◽  
...  
Keyword(s):  
Bond Strength ◽  
Thermal Shock ◽  
Shear Bond Strength ◽  
Chemical Element ◽  
Radial Crack ◽  
Visual Observation ◽  
Thermal Shock Test ◽  
Cross Sectional ◽  
Shock Test ◽  
Cad Cam

In this study, the binding performance of a Cercon-based zirconia framework material and special Cercon Ceram S zirconia veneering porcelain is discussed. Rectangular 30 mm × 20 mm × 2 mm porcelain blocks were made from zirconia using the CAD/CAM system. The 2 mm veneering porcelain was then sintered onto blocks at a temperature of 850-800°C with a loading speed of l mm/min. The shear bond strength of the interface was tested. Sintering was studied by visual observation, scanning electron microscopy, energy dispersive spectroscopy (EDS), thermal shock test and other methods. Excellent sintering results of the zirconia framework material and veneering porcelain can be achieved. The cross-sectional morphology of the samples, observed by SEM, shows a uniform, fine, and smooth texture for the veneering porcelain, whereas that of the zirconia framework material shows a rough surface with a uniform and compact texture. EDS results indicate that a small amount of A12O3 and SiO2 is present in the zirconia area, and no ZrO2 or Y2O3 is detected in the veneering porcelain area. No interlayer radial crack or flaw is found throughout the entire thermal shock test of the samples at 60-240°C. Thus, the cracking temperature of the samples is pegged at T>240°C. The shear bond strength of the interface is 32.62±5.77 MPa. Chemical element infiltration exists between zirconia and the veneering porcelain, indicating the chemical bond between the two. An excellent match between the Cercon-based zirconia framework and the special veneering porcelain can be achieved, which can satisfy clinical requirements.

scholarly journals Critical analysis and innovation propositions to the heat and thermal shock test method of the Brazilian Standard NBR 15575 (2013)

2020 ◽  
Vol 10 (3) ◽  
pp. 364-376
Author(s):  
Luciani Somensi Lorenzi ◽  
Kassio J. Stein ◽  
Luiz Carlos Pinto da Silva Filho
Keyword(s):  
Thermal Shock ◽  
Construction Industry ◽  
Visual Inspection ◽  
Meta Analysis ◽  
Test Method ◽  
Thermal Shock Test ◽  
Shock Test ◽  
Lack Of Information ◽  
Number Of Cycles ◽  
Brazilian Standard

The tests of Brazilian Standard NBR 15575: 2013 are part of the knowledge of the civil construction industry, but the heat and thermal shock test is innovative and does not have a consolidated history. The research objective is to analyze the testing critically and present proposals based on data meta-analysis. Results showed that the test is very inaccurate in describing the procedure and equipment. This study proposed adjustments and innovations in the test to provide more reliable results, but it does not make propositions regarding visual inspection and the number of cycles. The study concluded that the lack of information on the testing has direct responsibility for the results and that the suggested proposals have the potential to be incorporated.

Evaluation of solder joint reliability in flip chip package under thermal shock test

2006 ◽  
Vol 504 (1-2) ◽  
pp. 426-430 ◽  
Author(s):  
Dae-Gon Kim ◽  
Jong-Woong Kim ◽  
Seung-Boo Jung
Keyword(s):  
Solder Joint ◽  
Thermal Shock ◽  
Flip Chip ◽  
Thermal Shock Test ◽  
Solder Joint Reliability ◽  
Shock Test ◽  
Joint Reliability

PRESSURELESS SINTERING OF NANO- AG PASTE WITH LOW POROSITY FOR DIE ATTACH

2014 ◽  
Vol 2014 (1) ◽  
pp. 000092-000098 ◽  
Author(s):  
Sihai Chen ◽  
Guangyu Fan ◽  
Xue Yan ◽  
Chris LaBarbera ◽  
Lee Kresge ◽  
...  
Keyword(s):  
Shear Strength ◽  
Thermal Aging ◽  
Migration Rate ◽  
Dense Layer ◽  
Pressureless Sintering ◽  
Thermal Shock Test ◽  
Sintering Process ◽  
Shock Test ◽  
Die Attach ◽  
Ag Paste

A novel nano-Ag sintering paste C has been developed for a pressureless sintering process under air. Paste C was sintered at 250°C (C1) and 280°C (C2), respectively; C1 showed a slightly higher porosity but higher shear strength after aging at 250°C for 840 hours. Both C1 and C2 exhibited a microstructure much more stable than the control solder 92.5Pb/5Sn/2.5Ag, which suffered both IMC spalling after thermal aging and voiding. Ag migration toward the DBC to form a dense layer of AgCuNi(Au) was observed for all nano-Ag pastes that were studied, with C1 and C2 being more moderate in the migration rate. The Ag migration could be attributed to the tendency of Ag to form an alloy with Au, with abundant Ni and Cu at the DBC side, and appeared to be affected by the chemistry of nano-Ag paste. A liquid to liquid thermal shock test from −45°C to 240°C was attempted, and was considered too harsh for the die/DBC system employed in this study.

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