scholarly journals Microstructural Evolution and Dynamic Softening Mechanisms of Al-Zn-Mg-Cu Alloy during Hot Compressive Deformation

Materials ◽  
2014 ◽  
Vol 7 (1) ◽  
pp. 244-264 ◽  
Author(s):  
Cangji Shi ◽  
Jing Lai ◽  
X.-Grant Chen
Keyword(s):  
Microstructural Evolution ◽  
Compressive Deformation ◽  
Cu Alloy ◽  
Dynamic Softening

Microstructural evolution and mechanical properties of an AgInCd alloy during compressive deformation process

2019 ◽  
Vol 770 ◽  
pp. 608-615 ◽  
Author(s):  
Hongsheng Chen ◽  
Haibo Wang ◽  
Qingzhu Sun ◽  
Chongsheng Long ◽  
Tianguo Wei ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Microstructural Evolution ◽  
Deformation Process ◽  
Compressive Deformation

Microstructural evolution during reactive spray forming of dispersion strengthened Cu alloy

1999 ◽  
Vol 5 (2) ◽  
pp. 141-147 ◽  
Author(s):  
Jongsang Lee ◽  
Eon-Sik Lee ◽  
W. J. Park ◽  
J. Y. Jung ◽  
S. Ahn ◽  
...  
Keyword(s):  
Microstructural Evolution ◽  
Spray Forming ◽  
Cu Alloy

In Situ Observation of Diffusion Behavior and Microstructural Evolution on Interfaces in Al/Cu Bimetal

2017 ◽  
Vol 898 ◽  
pp. 1020-1025
Author(s):  
Fei Cao ◽  
Fen Fen Yang ◽  
Xue Jian Wang ◽  
Hui Jun Kang ◽  
Ya Nan Fu ◽  
...  
Keyword(s):  
Transition Zone ◽  
Microstructural Evolution ◽  
Equilibrium Phase ◽  
Liquidus Line ◽  
Eutectic Growth ◽  
Equilibrium Phase Diagram ◽  
Eutectic Structure ◽  
Diffusion Behavior ◽  
Cu Alloy

Synchrotron X-ray radiography was used to in situ study the diffusion behavior and microstructural evolution of Al/Cu bimetal. The interface diffusion, dendritic/eutectic growth and the formation of intermetallic compounds around the Al/Cu bimetal interface were analyzed. During the isothermal diffusion process, a liquefied transition zone at the interface with a concentration gradient was formed when the Cu concentration exceeded eutectic composition of Al-Cu alloy. During the solidification of transition zone, the growth sequence of α-Al dendrites and eutectic structure were mainly dominated by the variation of Cu concentration and thermal field according to the temperature of the liquidus line of the equilibrium phase diagram. Finally, the transition zone around the interface were identified to be I (α-Al), II (Al+Al2Cu), III (Al2Cu) and IV (Al2Cu, AlCu and Al4Cu9), respectively.

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