scholarly journals Improvement of the Adhesion and Diamond Content of Electrodeposited Cu/Microdiamond Composite Coatings by a Plated Cu Interlayer

Materials ◽  
2021 ◽  
Vol 14 (10) ◽  
pp. 2571
Author(s):  
Xiaoli Wang ◽  
Chau-Chang Chou ◽  
Liberty Tse-Shu Wu ◽  
Rudder Wu ◽  
Jyh-Wei Lee ◽  
...  
Keyword(s):  
Composite Coating ◽  
Focused Ion Beam ◽  
Electrochemical Impedance ◽  
Ion Beam ◽  
Composite Coatings ◽  
Cross Sectional ◽  
X Ray ◽  
Copper Interlayer ◽  
Copper Composite ◽  
Cu Interlayer

Diamond-incorporated copper metal matrix layers were fabricated on brass substrates by using electrodeposition technology in this study. To improve the adhesion of the composite coatings on the brass substrate, a plated copper was applied as the interlayer between the multilayers and the substrate. The surface morphologies of the interlayer and the diamond-incorporated copper composite layers were studied by scanning electron microscopy. The effect of the copper interlayer on the incorporation and the distribution of the diamond content in the coatings was analyzed by surface roughness, electrochemical impedance spectroscopy, and cyclic voltammetry. The diamond content of the composite coating was measured by energy-dispersive X-ray. The film thickness was evaluated by the cross-sectional technique of focused ion beam microscopy. The element, composition, and crystallization direction of diamond with Cu matrix was measured by X-ray diffraction and transmission electron microscope. The adhesion of the multilayers was studied by scratch tests. The experiment results indicated that the diamond content and distribution of the coating were higher and more uniform with the Cu interlayer than that without one. The plated copper interlayer reduced the electrical double-layer impedance and enhanced the adsorption of diamond particles by the surrounding Cu ions, which promoted the diamond content in the composite coatings. The roughened surface caused by the plated Cu interlayer also improved the substrate’s mechanical interlock with the composite coating, which contributed to the strong adhesion between them.

Cross-sectional Specimen Preparation and Observation of a Plasma Sprayed Coating Using a Focused Ion Beam/Transmission Electron Microscopy System

2000 ◽  
Vol 6 (3) ◽  
pp. 218-223
Author(s):  
Toshie Yaguchi ◽  
Takeo Kamino ◽  
Mitsumasa Sasaki ◽  
Gerard Barbezat ◽  
Ryoichi Urao
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
Specimen Preparation ◽  
Coating Film ◽  
Cross Sectional ◽  
X Ray ◽  
Bright Contrast ◽  
Transmission Electron ◽  
Sprayed Coating ◽  
Plasma Sprayed

Abstract A focused ion beam (FIB) technique was applied to cross-sectional specimen preparation to observe an interface between a plasma sprayed coating and an aluminum (Al) substrate by transmission electron microscopy (TEM). The surface of the sprayed coating film has a roughness of several tens of microns. Sputter rates for the coating film and the substrate are greatly different. The rough surface and the difference in sputter rate cause problems in making TEM specimens with smooth side walls. The top surface of the coating film was planerized by the FIB before fabricating the TEM specimen. The interfaces were investigated by TEM and energy-dispersive X-ray (EDX) analysis. The TEM observation revealed that there is a 10 nm thick amorphous layer at the interface between the coating film and substrate. The coating film consists of two kinds of sublayers with bright and dark contrast. The bright contrast sublayers were amorphous layers with thickness of 2~10 nm. The Al/Fe X-ray intensity ratio was larger in bright contrast sublayers than that in dark contrast sublayers.

Method for Cross-sectional Transmission Electron Microscopy Specimen Preparation of Composite Materials Using a Dedicated Focused Ion Beam System

1999 ◽  
Vol 5 (5) ◽  
pp. 365-370 ◽  
Author(s):  
Toshie Yaguchi ◽  
Takeo Kamino ◽  
Tohru Ishitani ◽  
Ryoichi Urao
Keyword(s):  
Composite Materials ◽  
Focused Ion Beam ◽  
Ion Irradiation ◽  
Ion Beam ◽  
Implantation Rate ◽  
Specimen Preparation ◽  
Cross Sectional ◽  
X Ray ◽  
Transmission Electron ◽  
Lattice Images

A new method for transmission electron microscope (TEM) specimen preparation using a focused ion beam (FIB) system that results in a lower rate of gallium (Ga) implantation has been developed. The method was applied to structural and analytical studies of composite materials such as silicon (Si)-devices and magneto-optical disk. To protect the specimens against Ga ion irradiation, amorphous tungsten (W) was deposited on the surface of the specimen prior to FIB milling. The deposition was quite effective in reducing the Ga implantation rate, and energy-dispersive X-ray (EDX) analysis of these specimens detected 0.3Ð1.5% Ga incorporated in the thinned area. FIB milling times for these specimens were 1.5Ð2 hr. Although the milling rate was high, all the materials were properly prepared for TEM study, and clear crystal lattice images were observed on all specimens.

scholarly journals Copper Corrosion in Aqueous Sulfide Solutions under Nuclear Waste Repository Conditions

2012 ◽  
Vol 1475 ◽  
Author(s):  
J. Chen ◽  
Z. Qin ◽  
D. W. Shoesmith
Keyword(s):  
Nuclear Waste ◽  
Photoelectron Spectroscopy ◽  
Focused Ion Beam ◽  
Film Growth ◽  
Electrochemical Impedance ◽  
Ion Beam ◽  
Chloride Content ◽  
Nuclear Waste Repository ◽  
Copper Corrosion ◽  
X Ray

ABSTRACTThe corrosion behavior of oxygen-free copper in anoxic sulfide solutions under nuclear waste disposal conditions was studied using electrochemical impedance spectroscopy (EIS), scanning electron microscopy (SEM) equipped with a focused ion beam (FIB), X-ray photoelectron spectroscopy (XPS) and Micro X-ray diffraction (μXRD). The film growth process and mechanism were elucidated using an Au marker test, and the contribution of solution diffusion to corrosion was demonstrated in magnetically-stirred experiments. The effect of groundwater chemistry, particularly chloride content on copper corrosion and film properties was characterized using long-term corrosion experiments.

Cross-sectional Specimen Preparation and Observation of a Plasma Sprayed Coating Using a Focused Ion Beam/Transmission Electron Microscopy System

2000 ◽  
Vol 6 (3) ◽  
pp. 218-223 ◽  
Author(s):  
Toshie Yaguchi ◽  
Takeo Kamino ◽  
Mitsumasa Sasaki ◽  
Gerard Barbezat ◽  
Ryoichi Urao
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
Specimen Preparation ◽  
Coating Film ◽  
Cross Sectional ◽  
X Ray ◽  
Bright Contrast ◽  
Transmission Electron ◽  
Sprayed Coating ◽  
Plasma Sprayed

AbstractA focused ion beam (FIB) technique was applied to cross-sectional specimen preparation to observe an interface between a plasma sprayed coating and an aluminum (Al) substrate by transmission electron microscopy (TEM). The surface of the sprayed coating film has a roughness of several tens of microns. Sputter rates for the coating film and the substrate are greatly different. The rough surface and the difference in sputter rate cause problems in making TEM specimens with smooth side walls. The top surface of the coating film was planerized by the FIB before fabricating the TEM specimen. The interfaces were investigated by TEM and energy-dispersive X-ray (EDX) analysis. The TEM observation revealed that there is a 10 nm thick amorphous layer at the interface between the coating film and substrate. The coating film consists of two kinds of sublayers with bright and dark contrast. The bright contrast sublayers were amorphous layers with thickness of 2~10 nm. The Al/Fe X-ray intensity ratio was larger in bright contrast sublayers than that in dark contrast sublayers.

Automated Diagonal Slice and View Solution for 3D Device Structure Analysis

2018 ◽  
Author(s):  
Sang Hoon Lee ◽  
Jeff Blackwood ◽  
Stacey Stone ◽  
Michael Schmidt ◽  
Mark Williamson ◽  
...  
Keyword(s):  
Cross Section ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Image Data ◽  
Planar Surface ◽  
Device Structure ◽  
Cross Sectional ◽  
Device Structures ◽  
The Cross ◽  
Planar Analysis

Abstract The cross-sectional and planar analysis of current generation 3D device structures can be analyzed using a single Focused Ion Beam (FIB) mill. This is achieved using a diagonal milling technique that exposes a multilayer planar surface as well as the cross-section. this provides image data allowing for an efficient method to monitor the fabrication process and find device design errors. This process saves tremendous sample-to-data time, decreasing it from days to hours while still providing precise defect and structure data.

TEM Sample Preparation Tricks for Advanced DRAMs

2015 ◽  
Author(s):  
Ching Shan Sung ◽  
Hsiu Ting Lee ◽  
Jian Shing Luo
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Sample Preparation ◽  
Integrated Circuit ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Tem Analysis ◽  
Cross Sectional ◽  
Transmission Electron ◽  
Characterization Of Materials

Abstract Transmission electron microscopy (TEM) plays an important role in the structural analysis and characterization of materials for process evaluation and failure analysis in the integrated circuit (IC) industry as device shrinkage continues. It is well known that a high quality TEM sample is one of the keys which enables to facilitate successful TEM analysis. This paper demonstrates a few examples to show the tricks on positioning, protection deposition, sample dicing, and focused ion beam milling of the TEM sample preparation for advanced DRAMs. The micro-structures of the devices and samples architectures were observed by using cross sectional transmission electron microscopy, scanning electron microscopy, and optical microscopy. Following these tricks can help readers to prepare TEM samples with higher quality and efficiency.

Site-Specific Low Angle Plasma FIB Milling for Cross-Sectional Electrical Characterization

2019 ◽  
Author(s):  
Chuan Zhang ◽  
Jane Y. Li ◽  
John Aguada ◽  
Howard Marks
Keyword(s):  
Cross Section ◽  
Focused Ion Beam ◽  
Electrical Characteristic ◽  
Preparation Method ◽  
Ion Beam ◽  
Grazing Angle ◽  
Electrical Characterization ◽  
Sample Preparation Method ◽  
Cross Sectional ◽  
Site Specific

Abstract This paper introduces a novel sample preparation method using plasma focused ion-beam (pFIB) milling at low grazing angle. Efficient and high precision preparation of site-specific cross-sectional samples with minimal alternation of device parameters can be achieved with this method. It offers the capability of acquiring a range of electrical characteristic signals from specific sites on the cross-section of devices, including imaging of junctions, Fins in the FinFETs and electrical probing of interconnect metal traces.

3D Observation of Elemental Distribution of Si-Device using a Dedicated FIB/STEM System

2005 ◽  
Author(s):  
T. Yaguchi ◽  
M. Konno ◽  
T. Kamino ◽  
M. Ogasawara ◽  
K. Kaji ◽  
...  
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
Three Dimensional ◽  
Elemental Distribution ◽  
Multivariate Statistical ◽  
X Ray ◽  
Sample Rotation ◽  
Transmission Electron ◽  
Scanning Transmission ◽  
Elemental Maps

Abstract A technique for preparation of a pillar shaped sample and its multi-directional observation of the sample using a focused ion beam (FIB) / scanning transmission electron microscopy (STEM) system has been developed. The system employs an FIB/STEM compatible sample rotation holder with a specially designed rotation mechanism, which allows the sample to be rotated 360 degrees [1-3]. This technique was used for the three dimensional (3D) elemental mapping of a contact plug of a Si device in 90 nm technology. A specimen containing a contact plug was shaped to a pillar sample with a cross section of 200 nm x 200 nm and a 5 um length. Elemental analysis was performed with a 200 kV HD-2300 STEM equipped with the EDAX genesis Energy dispersive X-ray spectroscopy (EDX) system. Spectrum imaging combined with multivariate statistical analysis (MSA) [4, 5] was used to enhance the weak X-ray signals of the doped area, which contain a low concentration of As-K. The distributions of elements, especially the dopant As, were successfully enhanced by MSA. The elemental maps were .. reconstructed from the maps.

Comparison of Focused Ion Beam and Conventional Techniques on Tem Specimen Preparation of Metal-Ceramic Interfaces

1998 ◽  
Vol 4 (S2) ◽  
pp. 860-861 ◽  
Author(s):  
A. Ramirez de Arellano López ◽  
W.-A. Chiou ◽  
K. T. Faber
Keyword(s):  
Focused Ion Beam ◽  
Ceramic Coating ◽  
Steel Substrate ◽  
Ion Beam ◽  
Specimen Preparation ◽  
Inhomogeneous Materials ◽  
Cross Sectional ◽  
Fine Grain ◽  
Basic Industry ◽  
Coated Surface

The results of TEM analyses of materials are critically dependent on the quality of the sample prepared. Although numerous techniques have been developed in the last two decades, differential thinning of inhomogeneous materials remains a serious problem. Recently, focused ion beam (FIB) technique has been introduced for cross-sectional sample preparation for TEM and SEM.A novel system for depositing a fine-grain (∼ 200 nm) ceramic coating on a metal surface via a patent pending Small-Particle Plasma Spray (SPPS) technique has been developed at the Basic Industry Research Laboratory of Northwestern University. To understand the properties of the coated surface, the ceramic/metal interface and the microstructure of the ceramic coating must be investigated. This paper presents a comparison of the microstructure of an A12O3 coating on a mild steel substrate prepared using conventional and FEB techniques.

Cross-sectional microanalysis for tracking the effect of solvent on the morphological evaluation of PLA/AgNWs bionanocomposties

2021 ◽  
pp. 096739112110230
Author(s):  
Meltem Sezen ◽  
Busra Tugba Camic
Keyword(s):  
Focused Ion Beam ◽  
Silver Nanowires ◽  
Low Cost ◽  
Ion Beam ◽  
Lower Surface ◽  
Polymer Matrices ◽  
Elemental Distribution ◽  
Medical Sciences ◽  
Surface Area Ratio ◽  
Cross Sectional

The emphasis of biocompatible polymer applications in medical sciences and biotechnology has remarkably increased. Developing new low-cost, low-toxicity and lightweight composite forms of biopolymers has become even more attractive since the addition of new species into polymer matrices assist to improve biomedical activities of such materials to a higher extend. Developments in nanoscience and nanotechnology recently contribute to controlled fabrication and ultraprecise diagnosis of such materials. This study concerns the observation of solution processing effects in the fabrication of porous PLA/AGNWs bionanocomposite coatings using electron and ion processing based serial cross-sectioning and high-resolution imaging. The nanostructuring and characterization were both performed in a focused ion-beam-scanning electron microscope (FIB-SEM) platform. HR-SEM imaging was conducted on-site to track solvent based morphological property alterations of PLA and PLA/AgNWs structures. Simultaneous SEM-EDS analyses revealed the elemental distribution and the chemical composition along the cross-sectioned regions of the samples. Accordingly, it was observed that, in case of acetone dissolved materials, both pristine PLA and PLA/AgNWs samples sustained their foamy structure. When chloroform was used as the solvent, the porosity of the polymer matrices was less and the resulting structure was found to be denser than samples dissolved in acetone with a lower surface area ratio inside the material. This can be attributed to the rapid volatilization of acetone compared to chloroform, and hence the formation of interconnected pore network. For both nanocomposite biopolymers dissolved in acetone and chloroform, silver nanowires were homogeneously distributed throughout PLA matrices.

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